RENESAS HD74HC237

To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
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or system that is used under circumstances in which human life is potentially at stake. Please contact
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contained therein.
HD74HC237
3-to-8-line Decoder/Demultiplexer with Address Latch
ADE-205-469 (Z)
1st. Edition
Sep. 2000
Description
The HD74HC237 decodes a three-bit Address to one-of-eight active-high outputs. The device has a
transparent latch for storage of the Address. Two Chip Selects, one active-low and one active-high, are
provided to facilitate the demultiplexing, cascading, and chip-selecting functions.
The demultiplexing function is accomplished by using the Address inputs to select the desired device
output, and then by using one of the Chip Selects as a data input while holding the other one active.
The HD74HD237 is the noninverting version of the HD74HC137.
Features
•
•
•
•
•
High Speed Operation: tpd (Data to Y) = 19 ns typ (CL = 50 pF)
High Output Current: Fanout of 10 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
HD74HC237
Function Table
Inputs
Enable
Select
Outputs
GL
G1
G2
C
B
A
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
X
X
H
X
X
X
L
L
L
L
L
L
L
L
X
L
X
X
X
X
L
L
L
L
L
L
L
L
L
H
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
H
L
H
L
L
L
L
L
L
L
H
L
L
H
L
L
L
H
L
L
L
L
L
L
H
L
L
H
H
L
L
L
H
L
L
L
L
L
H
L
H
L
L
L
L
L
L
H
L
L
L
L
H
L
H
L
H
L
L
L
L
L
H
L
L
L
H
L
H
H
L
L
L
L
L
L
L
H
L
L
H
L
H
H
H
L
L
L
L
L
L
L
H
H
H
L
X
X
X
Output corresponding to stored address H; all others L
Pin Arrangement
16 VCC
A
1
B
2
B
C
3
GL
A
Y0
15 Y0
C
Y1
14 Y1
4
GL
Y2
13 Y2
G2
5
G2
Y3
12 Y3
G1
6
G1
Y4
11 Y4
Y7
7
Y7
Y5
10 Y5
GND
8
Y6
9
(Top view)
2
Y6
HD74HC237
Logic Diagram
Y0
A
Y1
Y2
B
Y3
Y4
C
Y5
Y6
GL
Y7
G2
G1
3
HD74HC237
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Input voltage
VIH
2.0
1.5 —
—
1.5
—
V
4.5
3.15 —
—
3.15
—
6.0
4.2 —
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35 —
1.35
6.0
—
—
1.8
—
1.8
2.0
1.9 2.0 —
1.9
—
4.5
4.4 4.5 —
4.4
—
6.0
5.9 6.0 —
5.9
—
4.5
4.18 —
—
4.13
—
I OH = –4 mA
6.0
5.68 —
—
5.63
—
I OH = –5.2 mA
2.0
—
0.0 0.1
—
0.1
4.5
—
0.0 0.1
—
0.1
6.0
—
0.0 0.1
—
0.1
4.5
—
—
0.26 —
0.33
I OL = 4 mA
6.0
—
—
0.26 —
0.33
I OL = 5.2 mA
VIL
Output voltage
VOH
VOL
Test Conditions
V
V
V
Vin = VIH or VIL I OH = –20 µA
Vin = VIH or VIL I OL = 20 µA
Input current
Iin
6.0
—
—
±0.1 —
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
I CC
6.0
—
—
4.0
40
µA
Vin = VCC or GND, Iout = 0 µA
4
—
HD74HC237
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
VCC (V) Min Typ Max Min
Max
Unit
Test Conditions
Propagation delay t PLH
2.0
—
—
185 —
230
ns
Data to Y
time
4.5
—
19
37
—
46
6.0
—
—
31
—
39
2.0
—
—
145 —
180
ns
G2 to Y
4.5
—
14
29
—
36
6.0
—
—
25
—
31
2.0
—
—
145 —
180
ns
G1 to Y
4.5
—
14
29
—
36
6.0
—
—
25
—
31
2.0
—
—
190 —
240
ns
GL to Y
4.5
—
21
38
—
48
6.0
—
—
32
—
41
2.0
80
—
—
100
—
4.5
16
8
—
20
—
6.0
14
—
—
17
—
2.0
5
—
—
5
—
4.5
5
–4
—
5
—
6.0
5
—
—
5
—
2.0
75
—
—
95
—
4.5
15
4
—
19
—
6.0
13
—
—
16
—
Item
Pulse width
Hold time
Setup time
Symbol
t PHL
tw
th
t su
Output rise/fall
t TLH
2.0
—
—
75
—
95
time
t THL
4.5
—
5
15
—
19
6.0
—
—
13
—
16
—
—
5
10
—
10
Input capacitance
Cin
ns
ns
ns
ns
pF
5
HD74HC237
Package Dimensions
Unit: mm
19.20
20.00 Max
6.30
9
1
7.40 Max
16
8
1.3
0.48 ± 0.10
7.62
2.54 Min 5.06 Max
2.54 ± 0.25
0.51 Min
1.11 Max
+ 0.13
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
10.06
10.5 Max
9
1
8
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
16
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
6
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
FP-16DA
—
Conforms
0.24 g
HD74HC237
Unit: mm
9.9
10.3 Max
9
1
8
*0.42 ± 0.08
0.40 ± 0.06
0.15
*0.22 ± 0.03
0.20 ± 0.03
0.635 Max
+ 0.11
1.27
0.14 – 0.04
1.75 Max
3.95
16
+ 0.10
6.10 – 0.30
1.08
0° – 8°
0.67
0.60 +– 0.20
0.25 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
FP-16DN
Conforms
Conforms
0.15 g
7
HD74HC237
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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URL
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:
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:
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For further information write to:
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(America) Inc.
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Copyright  Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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