RENESAS HZM27FA

HZM27FA
Silicon Epitaxial Planar Zener Diode for Surge Absorb
REJ03G1213-0400
(Previous: ADE-208-443C)
Rev.4.00
Jun 14, 2005
Features
• HZM27FA has four devices, and can absorb surge.
• MPAK-5 Package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
HM27FA
Laser Mark
27A
Package Name
MPAK-5
Pin Arrangement
1
2
5
4
3
(Top View)
Rev.4.00 Jun 14, 2005 page 1 of 4
1. Cathode
2. Cathode
3. Cathode
4. Anode
5. Cathode
Package Code
(Previous Code)
PLSP0005ZC-A
(MPAK-5)
HZM27FA
Absolute Maximum Ratings
(Ta = 25°C)
Item
Power dissipation
Pd *
Junction temperature
Tj
Storage temperature
Tstg
Note: Four device total, See Fig.2.
Symbol
Value
200
150
−55 to +150
Unit
mW
°C
°C
Electrical Characteristics *1
(Ta = 25°C)
Item
Zener voltage
Reverse current
Capacitance
Dynamic resistance
ESD-Capability *3
Symbol
VZ
IR
C
rd
—
Min
25.10
—
—
—
30
Typ
—
—
(27) *2
—
—
Notes: 1. Per one device
2. Reference only
3. Failure criterion ; IR > 2 µA at VR = 21 V
Rev.4.00 Jun 14, 2005 page 2 of 4
Max
28.90
2
—
70
—
Unit
V
µA
pF
Ω
kV
Test Condition
IZ = 2 mA, 40 ms pulse
VR = 21 V
VR = 0 V, f = 1 MHz
IZ = 2 mA
C = 150 pF, R = 330 Ω , Both forward
and reverse direction 10 pulse.
HZM27FA
Main Characteristic
10-3
10-4
Zener Current IZ (A)
10-5
10-6
10-7
10-8
10-9
10-10
10-11
0
5
10
15
Zener Voltage
20
25
30
Vz (V)
Fig.1 Zener current vs. Zener voltage
1.0mm
0.6mm
Power Dissipation Pd (mW)
250
200
Cu Foil
Printed circuit board
25 × 62 × 1.6t mm
Material:
Glass Epoxy Resin+Cu Foil
150
100
50
0
0
50
100
150
200
Ambient Temperature Ta (°C)
Fig.2 Power Dissipation vs. Ambient Temperature
Rev.4.00 Jun 14, 2005 page 3 of 4
HZM27FA
Package Dimensions
JEITA Package Code
RENESAS Code
SC-74A
Previous Code
PLSP0005ZC-A
MASS[Typ.]
MPAK-5 / MPAK-5V
0.013g
D
e
c
E HE
L
A
L1
A
b
e
Reference
Symbol
A2
A
e1
A1
b
l1
c
b2
A — A Section
Rev.4.00 Jun 14, 2005 page 4 of 4
Pattern of terminal position areas
A
A1
A2
b
c
D
E
e
HE
L
L1
b2
e1
l1
Dimension in Millimeters
Min
1.0
0
1.0
0.3
0.11
2.7
1.5
2.5
0.15
-
Nom
1.1
0.4
0.16
2.9
1.6
0.95
2.8
0.6
2.15
-
Max
1.4
0.1
1.3
0.5
0.26
3.1
1.8
3.0
0.55
0.85
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 2.0