Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Overview KEMET’s High Temperature X7R Dielectric capacitors are formulated and designed for extreme temperature applications. Constructed of a robust and proprietary base metal electrode (BME) dielectric system, these devices are capable of reliable operation in temperatures up to 175°C. Providing an attractive combination of performance and robustness in general high temperature applications, High Temperature X7R dielectric capacitors are well suited for high temperature bypass and decoupling applications or frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. They exhibit a predictable change in capacitance with respect to time, voltage and temperature up to 175°C. Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C Ceramic 1210 R Case Size1 Specification/ (L" x W") Series1 0402 0603 0805 1206 1210 1812 G = 175°C with standard termination R = 175°C w/ Flexible Termination 225 Capacitance Code (pF) First two digits represent significant figures. Third digit specifies number of zeros. C T050 Failure Rate/ Capacitance Rated Voltage Dielectric Design Tolerance (VDC) Termination Finish Packaging/Grade (C-Spec)2 J = ±5% K = ±10% M = ±20% C = 100% Matte Sn K 3 4 = 16 3 = 25 5 = 50 1 = 100 2 = 200 R R = X7R A A = N/A Blank = Bulk 7292 = Waffle Pack/Tray TU = 7" Reel - Unmarked (full reel quantity) T050 = 50 pieces/7" Reel Unmarked T100 = 100 pieces/7" Reel Unmarked T250 = 250 pieces/7" Reel Unmarked T500 = 500 pieces/7" Reel Unmarked T1K0 = 1,000 pieces/Reel Unmarked Flexible termination option is only available in 0603 (1608 metric) and larger case sizes. Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the "T1K0" packaging option, 1812 case size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7" reels or a single 13" reel. The term "Unmarked" pertains to laser marking of components. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. Additional reeling or packaging options may be available. Contact KEMET for details. 1 2 One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Dimensions – Millimeters (Inches) – Standard Termination L W B T S EIA Size Code Metric Size Code B Bandwidth S Separation Minimum Mounting Technique 0402 1005 1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002) 0.30 (0.012) ± 0.10 (0.004) 0.30 (0.012) Solder Reflow Only 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006) 0.35 (0.014) ± 0.15 (0.006) 0.70 (0.028) 0805 2012 2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008) 0.50 (0.02) ± 0.25 (0.010) 0.75 (0.030) 1206 3216 See Table 2 for Thickness 3.20 (0.126) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) Solder Wave or Solder Reflow 1210 3225 3.20 (0.126) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008) 0.50 (0.02) ± 0.25 (0.010) N/A Solder Reflow Only 1812 4532 4.50 (0.177) ±0.30 (0.012) 3.20 (0.126) ±0.30 (0.012) 0.60 (0.024) ± 0.35 (0.014) L Length W Width T Thickness 0.50 (0.02) ± 0.25 (0.010) Solder Reflow Only Dimensions – Millimeters (Inches) – Flexible Termination EIA Size Code Metric Size Code B Bandwidth S Separation Minimum 0603 1608 1.60 (0.064) ±0.17 (0.007) 0.80 (0.032) ±0.15 (0.006) 0.45 (0.018) ±0.15 (0.006) 0.58 (0.023) 0805 2012 2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) 0.75 (0.030) 1206 3216 3.30 (0.130) ±0.40 (0.016) 1.60 (0.063) ±0.20 (0.008) 1210 3225 See Table 2 0.60 (0.024) ±0.25 (0.010) for Thickness 3.30 (0.130) ±0.40 (0.016) 2.50 (0.098) ±0.20 (0.008) 0.60 (0.024) ±0.25 (0.010) Solder Wave or Solder Reflow N/A Solder Reflow Only 1812 4532 4.50 (0.178) ±0.40 (0.016) 3.20 (0.126) ±0.30 (0.012) L Length W Width T Thickness 0.70 (0.028) ±0.35 (0.014) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com Mounting Technique Solder Reflow Only C1075_X7R_HT_SMD • 6/18/2015 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Overview cont'd Concerned with flex cracks resulting from excessive stresses produced during board flexure and thermal cycling? These devices are available with KEMET's Flexible termination technology which inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although flexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. KEMET’s High Temperature X7R surface mount MLCCs are manufactured in state of the art ISO/TS 16949:2009 certified facilities and are proven to function reliably in harsh, high temperature and high humidity, down-hole environments. Benefits • • • • • • Operating temperature range of -55°C to +175°C Voltage derating not required Lead (Pb)-Free, RoHS and REACH compliant Base metal electrode (BME) dielectric system EIA 0402, 0603, 0805, 1206, 1210 and 1812 case sizes DC voltage ratings of 16 V, 25 V, 50 V, 100 V & 200 V • Capacitance offerings ranging from 2.7 nF to 3.3 µF • Available capacitance tolerances of ±5%, ±10% & ±20% • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability • Flexible termination option available upon request Applications Typical applications include decoupling, bypass, filtering and transient voltage suppression in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes. Application Notes X7R dielectric is not recommended for AC line filtering or pulse applications. Voltage derating of these capacitors is not required for application temperatures up to 175°C. Qualification/Certification High temperature Industrial grade products meet or exceed the requirements outlined Table 4, Performance & Reliability. Qualification packages are available upon request. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions. Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Limit at 25°C -55°C to +175°C ±15% (-55°C to +125°C) beyond 125°C see "Capacitance vs. Temperature Performance" plot - Reference Only <3.0% 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) See Dissipation Factor Limit Table 1,000 megohm microfarads or 100 GΩ (Rated voltage applied for 120 ± 5 secs at 25°C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Dissipation Factor Limit Table Rated DC Voltage Dissipation Factor 16/25 3.5% >25 2.5% Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric X7R Rated DC Voltage 16/25 >25 Capacitance Value All Dissipation Factor (Maximum %) 5.0 3.0 Capacitance Shift Insulation Resistance ± 20% 10% of Initial Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Electrical Characteristics Capacitance vs. Temperature Capacitance Performance (-55°C toPerformance +175°C) vs. Temperature (-55°C to +175°C) 10.00 CAPACITANCE CHANGE % 0.00 -10.00 -20.00 -30.00 0603 (1608), 0.1µF, 25V -40.00 0805 (2012), 0.27µF, 25V 1206 (3216), 1.0µF, 25V -50.00 1210 (3225), 2.2µF, 25V -60.00 1812 (4532), 3.3µF, 25V -70.00 -80.00 1812 (4532), 1.0µF, 50V -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 140 155 170 TEMPERATURE (°C) Capacitance vs. Bias Voltage Performance (25 VDC Rated ) Capacitance vs. Bias Voltage Performance (25VDC Rated ) 10.0 CAPACITANCE CHANGE % 0.0 -10.0 -20.0 -30.0 -40.0 0603 (1608), 0.1µF, 25V -50.0 0805 (2012), 0.27µF, 25V -60.0 1210 (3225), 2.2µF, 25V -70.0 1812 (4532), 3.3µF, 25V -80.0 0 5 10 15 20 25 BIAS DC VOLTAGE Capacitance vs. Bias Voltage Performance (1812 Case Size, 1.0 µF, 50 VDC Rated) Capacitance vs. Bias Voltage Performance (1812 Case Size, 1.0µF, 50VDC Rated) 10.0 CAPACITANCE CHANGE % 5.0 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 1812 (4532), 1.0µF, 50V -30.0 -35.0 -40.0 0 5 10 BIAS DC VOLTAGE 15 20 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com 25 C1075_X7R_HT_SMD • 6/18/2015 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Table 1 – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) Case Size/ Series Capacitance Cap Code 2700 pF 3300 pF 3900 pF 4700 pF 5600 pF 6800 pF 8200 pF 10000 pF 12000 pF 15000 pF 18000 pF 22000 pF 27000 pF 33000 pF 39000 pF 47000 pF 56000 pF 68000 pF 82000 pF 0.1 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 0.27 µF 0.33 µF 0.39 µF 0.47 µF 0.56 µF 0.68 µF 0.82 µF 1 µF 1.2 µF 1.5 µF 1.8 µF 2.2 µF 2.7 µF 3.3 µF Capacitance 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 Cap Code C0402G C0603G/R C0805G/R C1206G/R Voltage Code 4 3 5 1 3 Rated Voltage (VDC) 16 25 50 100 25 J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M Rated Voltage (VDC) BB BB BB BB BB BB BB BB BB BB BB BB Capacitance Tolerance Voltage Code Case Size/ Series BB BB BB BB BB BB BB BB BB BB BB BB C1210G/R C1812G/R 5 1 3 5 1 3 5 1 3 5 1 3 5 1 2 50 100 25 50 100 25 50 100 25 50 100 25 50 100 200 GN GN GN GN GM GM GM GM GB GB GB GB GB GB GC GE GH GJ GL GE GG GJ GL GB GB GB GB GB GB GC GE GH GJ GL Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions BB BB BB BB BB BB BB BB CF CF CF CF CF CF CF CF CF CF CF CF BB CF CF CF CF CF CF CF CF CF CF DN DN DN DN DN DP DP DF DG DG DP DP DG DG DG DN DN DN DN DN DP DP DF DG DG ED ED ED ED EP EP EJ EJ EJ EP EJ EJ EJ ED ED ED ED EP EP EJ EJ EJ FE FE FF FF FG FG FH FM FK FK FH FM FK FK FE FE FF FF FG FG FH FM FK FK 16 25 50 100 25 50 100 25 50 100 25 50 100 25 50 100 25 50 100 200 4 3 5 1 3 5 1 3 5 1 3 5 1 3 5 1 3 5 1 2 C0402G C0603G/R C0805G/R C1206G/R © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1210G/R C1812G/R C1075_X7R_HT_SMD • 6/18/2015 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Table 2 – Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB CF DN DP DF DG ED EP EJ FE FF FG FH FM FK GB GC GE GH GG GJ GN GL GM 0402 0603 0805 0805 0805 0805 1206 1206 1206 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 1812 0.50 ± 0.05 0.80 ± 0.07* 0.78 ± 0.10* 0.90 ± 0.10* 1.10 ± 0.10 1.25 ± 0.15 1.00 ± 0.10 1.20 ± 0.20 1.70 ± 0.20 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.55 ± 0.15 1.70 ± 0.20 2.10 ± 0.20 1.00 ± 0.10 1.10 ± 0.10 1.30 ± 0.10 1.40 ± 0.15 1.55 ± 0.10 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 10,000 4,000 4,000 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 15,000 15,000 15,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 2,500 2,000 2,500 2,500 2,500 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 0 0 0 0 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2,000 Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination EIA Size Code Metric Size Code 0603 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00 1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X C V2 X C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish TP 100% Matte Sn Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax 150°C 200°C 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Temperature Profile Feature TL tP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec tL Tsmax Tsmin 25 tS 25° C to Peak Time Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Terminal Strength JIS–C–6429 Board Flex JIS–C–6429 Test or Inspection Method Appendix 1, Note: Package Size Force (L" x W") 0402 5 N (0.51 kg) 0603 10 N (1.02 kg) ≥ 0805 18 N (1.83 kg) Duration 60 seconds Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J–STD–002 a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B at 215°C category 3 c) Method D, category 3 at 260°C Temperature Cycling KEMET defined 50 cycles (-55°C to +220°C). Measurement at 24 hours +/- 4 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. Biased Humidity MIL–STD–202 Method 103 Moisture Resistance MIL–STD–202 Method 106 High Temperature Life MIL–STD–202 Method 108 /EIA–198 Storage Life KEMET defined Vibration MIL–STD–202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 175°C with 2 X rated voltage applied. 200°C, 0 VDC for 1,000 hours. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Construction – Standard Termination Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Dielectric Material (BaTiO3) End Termination / External Electrode (Cu) Inner Electrodes (Ni) End Termination / External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Construction – Flexible Termination Detailed Cross Section Dielectric Material (BaTiO3) End Termination / External Electrode (Cu) Epoxy Layer (Ag) Dielectric Material (BaTiO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn) End Termination / Inner Electrodes External Electrode (Cu) (Ni) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited to the “K” character only. Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive Grade stacked devices. • X7R dielectric products in capacitance values outlined below EIA Case Size Metric Size Code Capacitance 0603 0805 1206 1210 1808 1812 1825 2220 2225 1608 2012 3216 3225 4520 4532 4564 5650 5664 ≤ 170 pF ≤ 150 pF ≤ 910 pF ≤ 2,000 pF ≤ 3,900 pF ≤ 6,700 pF ≤ 0.018 µF ≤ 0.027 µF ≤ 0.033 µF Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of “KA8”, which designates a KEMET device with rated capacitance of 100 µF. Orientation of marking is vendor optional. KEMET ID © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com 2-Digit Capacitance Code C1075_X7R_HT_SMD • 6/18/2015 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Capacitor Marking (Optional) cont’d Alpha Character 9 A Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral 0 1 2 3 4 0.1 10 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 12 12 120 1,200 12,000 D 0.13 13 13 130 1,300 E 0.15 15 15 150 1,500 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 16 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 18 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.2 20 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 22 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.3 30 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 33 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 36 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 39 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 43 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 56 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 62 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 68 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 75 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 82 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 25 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 35 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 40 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 45 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 50 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 60 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 70 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 80 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 90 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) Embossed Plastic EIA Case Size Tape size (W)* 7" Reel 13" Reel Punched Paper 7" Reel Pitch (P1)* 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 4 4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 ±0.05 0.600 (0.079 ±0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 (0.138 ±0.002) 5.5 ±0.05 (0.217 ±0.002) 7.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 8.0 ±0.10 (0.315 ±0.004) 12.0 ±0.10 (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 ±0.05 (0.138 ±0.002) P1 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 – 200 Bo Maximum Rotation ( 20 10 ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape ° s Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 56 10 72 – 200 5 ° S) Figure 5 – Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R C1075_X7R_HT_SMD • 6/18/2015 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Wyboston, United Kingdom Tel: 44-1480-273082 Taipei, Taiwan Tel: 886-2-27528585 Espoo, Finland Tel: 358-9-5406-5000 Southeast Asia Singapore Tel: 65-6701-8033 2835 KEMET Way Simpsonville, SC 29681 Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 Central Novi, MI Tel: 248-994-1030 Beijing, China Tel: 86-10-5877-1075 Shanghai, China Tel: 86-21-6447-0707 Seoul, South Korea Tel: 82-2-6294-0550 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 21 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 6/18/2015 22