FT5x06 True Multi-Touch Capacitive Touch Panel Controller INTRODUCTION The FT5x06 Series ICs are single-chip capacitive touch panel controller ICs with a built-in 8 bit Micro-controller unit (MCU).They adopt the mutual capacitance approach, which supports true multi-touch capability. In conjunction with a mutual capacitive touch panel, the FT5x06 have user-friendly input functions, which can be applied on many portable devices, such as cellular phones, MIDs, netbook and notebook personal computers. The FT5x06 series ICs include FT5206/FT5306/FT5406, the difference of their specifications will be listed individually in this datasheet. FEATURES Mutual Capacitive Sensing Techniques True Multi-touch with up to 10 Points of Absolution X and Y Coordinates Immune to RF Interferences Auto-calibration: Insensitive to Capacitance and Environmental Variations Supports up to 28 Transmit Lines and 16 Receive Lines Supports up to 8” Touch Screen Full Programmable Scan Sequences with Individual Adjustable Receive Lines and Transmit Lines to Support Various Applications High Report Rate: More than 100Hz Touch Resolution of 100 Dots per Inch (dpi) or above -depending on the Panel Size Optional Interfaces :I2C/SPI 2.8V to 3.6V Operating Voltage Supports 1.8V/AVDD IOVCC FocalTech Systems Co., Ltd · Capable of Driving Single Channel (transmit/receive) Resistance: Up to15K Ω Capable of Supporting Single Channel (transmit/receive) Capacitance: 60 pF Optimal Sensing Mutual Capacitor: 1pF~4pF 12-Bit ADC Accuracy Built-in MCU with 28KB Program Memory, 6KB Data Memory and 256B Internal Data Space 11 Internal Interrupt Sources and 2 External Interrupt Sources 3 Operating Modes Active Monitor Hibernate Operating Temperature Range: -20°C to +85°C www.focaltech-systems.com Document Number: D-FT5x06-1212-V4.0 (Version: 4.0) · [email protected] Revised Dec. 18, 2012 From No.: F-OI-RD01-03-03-B FT5x06 DATASHEET TABLE OF CONTENTS \\ INTRODUCTION..................................................................................................................................................... I FEATURES............................................................................................................................................................... I 1 OVERVIEW ......................................................................................................................................................... 1 1.1 2 TYPICAL APPLICATIONS ................................................................................................................................... 1 FUNCTIONAL DESCRIPTION .............................................................................................................................. 1 2.1 2.2 2.3 2.4 3 MCU ........................................................................................................................................................... 2 OPERATION MODES ........................................................................................................................................ 2 HOST INTERFACE ............................................................................................................................................ 3 SERIAL INTERFACE ......................................................................................................................................... 3 2.4.1 I2C ..................................................................................................................................................... 3 2.4.2 SPI ..................................................................................................................................................... 4 ELECTRICAL SPECIFICATIONS ........................................................................................................................................... 8 3.1 3.2 3.3 3.4 3.5 ABSOLUTE MAXIMUM RATINGS ...................................................................................................................................... 8 DC CHARACTERISTICS ............................................................................................................................................... 9 AC CHARACTERISTICS............................................................................................................................................... 9 I/OPORTSCIRCUITS ................................................................................................................................................10 POWER ON/RESET/WAKE SEQUENCE ..............................................................................................................................11 4 PIN CONFIGURATIONS ..................................................................................................................................................12 5 PACKAGE INFORMATION ...............................................................................................................................................15 5.1 5.2 5.3 5.4 5.5 PACKAGE INFORMATION OF QFN-5X5-40L PACKAGE .................................................................................................................15 PACKAGE INFORMATION OF QFN-6X6-48L PACKAGE .................................................................................................................16 PACKAGE INFORMATION OF QFN-6X6-56L PACKAGE ..................................................................................................................17 PACKAGE INFORMATION OF QFN-8X8-68L PACKAGE ..................................................................................................................18 ORDER INFORMATION ...............................................................................................................................................19 FocalTech Systems Co., Ltd · www.focaltech-systems.com Document Number: D-FT5x06-1212-V4.0 (Version: 4.0) · [email protected] Revised Dec. 18, 2012 From No.: F-OI-RD01-03-03-B 1 1.1 OVERVIEW Typical Applications FT5x06 accommodate a wide range of applications with a set of buttons up to a 2D touch sensing device, their typical applications are listed below. Mobile phones, smart phones MIDs Netbook Navigation systems, GPS Game consoles Car applications POS (Point of Sales) devices Portable MP3 and MP4 media players Digital cameras FT5x06 Series ICs support < 8.0” Touch Panel, users may find out their target IC from the specs listed in the following table, Model Name Panel TX RX Type Package Pin Size Touch Panel Size Recommended Pitch FT5206GE1 15 10 QFN5*5 40 0.75-P0.4 ≤3.7" ~5mm FT5306DE4 20 12 QFN6*6 48 0.75-P0.4 ≤5.0" ~5mm FT5406DQ9 26 16 QFN6*6 56 0.55-P0.35 ≤7.0" ~5mm FT5406EE8 28 16 QFN8*8 68 0.75-P0.4 ≤8.0" ~6mm Remarks: FocalTech suggests to use pitch between 4.0mm to 6.0mm; The customer can decide the pitch based on applications. 2 FUNCTIONAL DESCRIPTION Architectural OverviewFigure2-1 shows the overall architecture for the FT5x06. Figure 2-1 FT5x06 System Architecture Diagram The FT5x06 is comprised of five main functional parts listed below, Touch Panel Interface Circuits The main function for the AFE and AFE controller is to interface with the touch panel. It scans the panel by sending AC signals to the THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 1 of 21 panel and processes the received signals from the panel. So, it supports both Transmit (TX) and Receive (RX) functions. Key parameters to configure this circuit can be sent via serial interfaces, which will be explained in detail in a later section. 8051-based MCU This MCU is 8051 compatible with some enhancements. For instant, larger program and data memories are supported. In addition, a Multiplication-Division unit (MDU) is implemented to speed up the touch detection algorithms. Furthermore, a Flash ROM is implemented to store programs and some key parameters. Complex signal processing algorithms are implemented with firmware running on this MCU to process further the received signals in order to detect the touches reliably. Communication protocol software is also implemented on this MCU to exchange data and control information with the host processor. External Interface I2C/SPI: an interface for data exchange with host INT: an interrupt signal to inform the host processor that touch data is ready for read WAKE: an interrupt signal for the host to change FT5x06 from Hibernate to Active mode /RST: an external low signal reset the chip. A watch dog timer is implemented to ensure the robustness of the chip. A voltage regulator to generate 1.8V for digital circuits from the input VDD3 supply Power On Reset (POR) is active until VDDD is higher than some level and hold decades of μs. 2.1 MCU This section describes some critical features and operations supported by the 8051 compatible MCU. Figure 2-2 shows the overall structure of the MCU block. In addition to the 8051 compatible MCU core, we have added the following circuits, MDU: A 16x8 Multiplier and A 32/32 Divider Program Memory: 28KB Flash Data Memory: 6KB SRAM Real Time Clock (RTC): A 32KHz RC Oscillator Timer: A number of timers are available to generate different clocks Master Clock: 24/ 48MHz from a 48MHz RC Oscillator Clock Manager: To control various clocks under different operation conditions of the system Figure 2-2 MCU Block Diagram 2.2 Operation Modes FT5x06 operates in the following three modes: Active Mode When in this mode, FT5x06 actively scans the panel. The default scan rate is 60 frames per second. The host processor can configure FT5x06 to speed up or to slow down. Monitor Mode THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 2 of 21 When in this mode, FT5x06 scans the panel at a reduced speed. The default scan rate is 25 frames per second and the host processor can increase or decrease this rate. When in this mode, most algorithms are stopped. A simpler algorithm is being executed to determine if there is a touch or not. When a touch is detected, FT5x06 shall enter the Active mode immediately to acquire the touch information quickly. During this mode, the serial port is closed and no data shall be transferred with the host processor. Hibernate Mode In this mode, the chip is set in a power down mode. It shall only respond to the “WAKE” or “RESET” signal from the host processor. The chip therefore consumes very little current, which help prolong the standby time for the portable devices. 2.3 Host Interface Figure 2-3 shows the interface between a host processor and FT5x06. This interface consists of the following three sets of signals: Serial Interface Interrupt from FT5x06 to the Host Wake-up Signal from the Host to FT5x06 TP Module TP Serial Interface TX FT5x06 Host RX /INT /WAKE Figure 2-3 Host Interface Diagram The serial interfaces of FT5x06 is I2C or SPI. The details of this interface are described in detail in Section 2.5. The interrupt signal (/INT) is used for FT5x06 to inform the host that data are ready for the host to receive. The /WAKE signal is used for the host to wake up FT5x06 from the Hibernate mode. After exiting the Hibernate mode, FT5x06 shall enter the Active mode. 2.4 Serial Interface FT5x06 supports the I2C or SPI interfaces, which can be used by a host processor or other devices. 2.4.1 I2C The I2C is always configured in the Slave mode. The data transfer format is shown in Figure 2-4. Figure 2-4 I2C Serial Data Transfer Format THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 3 of 21 Figure 2-5 I2C master write, slave read Figure 2-6 I2C master read, slave write Table 2-1 lists the meanings of the mnemonics used in the above figures. Table 2-1 Mnemonics Description Mnemonics S A[6:0] Description I2C Start or I2C Restart Slave address A[6:4]: 3’b011 A[3:0]: data bits are identical to those of I2CCON[7:4] register. W 1’b0: Write R 1’b1: Read A(N) P ACK(NACK) STOP: the indication of the end of a packet (if this bit is missing, S will indicate the end of the current packet and the beginning of the next packet) I2C Interface Timing Characteristics is shown in Table 2-2. Table 2-2 I2C Timing Characteristics Parameter Unit Min Max SCL frequency KHz 0 400 Bus free time between a STOP and START condition us 4.7 \ Hold time (repeated) START condition us 4.0 \ Data setup time ns 250 \ Setup time for a repeated START condition us 4.7 \ Setup Time for STOP condition us 4.0 \ 2.4.2 SPI SPI is a 4 wire serial interface. The following is a list of the 4 wires: SCK: serial data clock MOSI: data line from master to slave MISO: data line from slave to master SLVESEL: active low select signal SPI transfers data at 8bit packets. The phase relationship between the data and the clock can be defined by the two registers: phase and polck. Some data transfer examples can be found in Figure 2-7 to Figure 2-10. THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 4 of 21 Figure 2-7 SPI Data Transfer Format (Phase=0, POLCK=0) Figure 2-8 SPI Data Transfer Format (PHASE=0, POLCK=1) Figure 2-9 SPI Data Transfer Format (Phase=1, POLCK=0) Figure 2-10 SPI Data Transfer Format (Phase=1, POLCK=1) SPI can be configured into either Master or Slave mode via the MAS bit of the SPI0CON register. When in the Master mode, the SPI needs to supply the data clock, whose frequency relationship with the Master clock can be set by CLKDVD bits of the SPI0CON register. When it is configured in the Slave mode, the clock, SCK, is supplied by the external Master. The maximum data clock frequency must not be higher than Fmclk 8 . SPI Interface Timing Characteristics is shown in the following Figure2-11,Figure2-12, Figure2-13, Figure2-14 and Table 2-3. THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 5 of 21 Figure 2-11 SPI master Timing PHASE =0 PHASE=1 Tmck Tmckl h SCK(POLCK=0) SCK(POLCK=1) Tmh Tmo MOSI MISO Tmsr c SLVSEL Tmsfc Figure 2-12 SPI master Timing PHASE =1 THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 6 of 21 Figure 2-13 SPI slave Timing PHASE = 0 PHASE=1 Tsck Tsckl h SCK(POLCK=0) SCK(POLCK=1) T s Th MOSI MISO To Tsr c SLVSEL Tsfc Figure 2-14 SPI slave Timing PHASE = 1 Table 2-3 SPI Timing Parameters Parameter Description Min Max Units Master Mode timing (see figure 2-11,2-12) Tmckh sck high time 4×Tsysclk -- ns Tmckl sck low time 4×Tsysclk -- ns Tmo sck shift edge to mosi data change 0 -- ns Tmh mosi data valid to sck shift edge 3×Tsysclk -- ns Tsd slvsel falling edge to mosi data valid 4×Tsysclk -- ns Tmsfc slvsel falling edge to first sck edge (Tmckh+Tmckl)/2 -- ns Tmsrc last sck edge to slvsel rising edge (Tmckh+Tmckl)/2 -- ns Slave mode timing(See figure 2-13,2-14) THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 7 of 21 Tsckh sck high Time 4×Tsysclk -- ns Tsckl sck low Time 4×Tsysclk -- ns Tsd slvsel falling edge to Miso valid data time 0 4xTsysclk ns Ts Mosi Data valid to sck sample edge 0 -- ns Th sck sample edge to Mosi data change 4×Tsysclk -- ns To sck shift edge to Miso data change 0 4xTsysclk ns Tsfc slvsel falling edge to first sck edge 4×Tsysclk -- ns Tsrc last sck edge to slvsel rising edge 4×Tsysclk -- ns *Tsysclk is equal to one period of the device system clock 3 ELECTRICAL SPECIFICATIONS 3.1 Absolute Maximum Ratings Table 3-1 Absolute Maximum Ratings Item Symbol Unit Value Note Power Supply Voltage 1 VDDA - VSSA V -0.3 ~ +3.6 1, 2 Power Supply Voltage 2 VDD3 – VSS V -0.3 ~ +3.6 1, 3 I/O Power Supply Voltage Vt V -0.3 ~ IOVCC + 0.3 1,4 Operating Temperature Topr ℃ -20 ~ +85 1 Storage Temperature Tstg ℃ -55 ~ +150 1 Notes 1. If used beyond the absolute maximum ratings, FT5x06 may be permanently damaged. It is strongly recommended that the device be used within the electrical characteristics in normal operations. If exposed to the condition not within the electrical characteristics, it may affect the reliability of the device. 2. Make sure VDDA (high) ≥VSSA (low) 3. Make sure VDD (high) ≥VSS (low) 4. IOVCC is set to VDD3 or VDDD by software configuration. THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO., LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO., LTD. Copyright © 2012, FocalTech Systems Co., Ltd . All rights reserved Version 4.0︱Page 8 of 21 3.2 DC Characteristics Table 3-2 DC Characteristics (VDDA=VDD3=2.8~3.6V, Ta=-20~85℃) Item Symbol Unit Test Condition Min. Typ. Max. Input high-level voltage VIH V 0.7 x IOVCC -- IOVCC Input low -level voltage VIL V -0.3 -- 0.3 x IOVCC Output high -level voltage VOH V IOH=-0.1mA 0.7 x IOVCC -- -- Output low -level voltage VOL V IOH=0.1mA -- -- 0.3 x IOVCC I/O leakage current ILI μA Vin=0~VDDA -1 -- 1 Iopr mA -- 6 -- Imon mA -- 4 -- Current consumption （Sleep mode） Islp mA VDDA=VDD3 = 2.8V Ta=25℃ MCLK=24MHz -- 0.03 -- Step-up output voltage VDD5 V VDDA=VDD3= 2.8V 5 5.25 5.5 Power Supply voltage VDDA VDD3 V 2.8 -- 3.6 Current consumption （Normal operation mode） Current consumption （Monitor mode） 3.3 VDDA=VDD3 = 2.8V Ta=25℃ MCLK=24MHz VDDA=VDD3 = 2.8V Ta=25℃ MCLK=24MHz Note AC Characteristics Table 3-3 AC Characteristics of Oscillators Item Symbol Unit Test Condition OSC clock 1 fosc1 MHz VDD3 = 2.8V Ta=25℃ OSC clock 2 fosc2 KHz VDD3 = 2.8V Ta=25℃ Min. Typ. Max. 43 48 52 29 32 36 Note Table 3-4 AC Characteristics of TX & RX Item Symbol Unit Test Condition Min Typ Max 100 150 270 TX acceptable clock ftx KHz TX output rise time Ttxr nS -- 20 -- TX output fall time Ttxf nS -- 20 -- RX input voltage Trxi V 1.2 -- 1.6 Note HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 9 of 21 3.4 I/OPortsCircuits Figure 3-1 Digital Input & Output Port Circuits Figure 3-3 Reset Input Port Circuits Figure 3-2 Digital In/Out Port Circuit Figure 3-4 Wake Input Port Circuits Figure 3-5 INT output Port Circuits Figure 3-6 SCL/SDA Port Circuits HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 10 of 21 3.5 POWER ON/Reset/Wake Sequence Reset and GPIO such as Wake, INT and I2C are advised to be low before powering on. The signal of waking up should be set to be high after powering on. INT signal will be sent to the host after initializing all parameters and then start to report points to the host. If Power is down, the voltage of supply must be below 0.3V and Trst is more than 5ms. Tris Power Figure 3-7 Power on time Trst Power 0.3V Figure 3-8 Power Cycle requirement T rtp T vdr T vd r Tpo n VD D R es et W ake INT I 2C/ SP I Figure 3-9 Power on / down Sequence Reset time must be enough to guarantee reliable reset, the time of starting to report point after resetting approach to the time of starting to report point after powering on. Trs i Trs t Power RESET INT I2C/SPI Figure 3-10 Reset Sequence Wake time must be enough to wake up the system, the time of starting to report point after waking approach to the time of starting to report point after powering on HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 11 of 21 Tw ai T wak Power Wakeup INT I2C/SPI Figure 3-11 Wake Sequence Table 3-5 Power on/Reset/Wake Sequence Parameters Parameter 4 Description Min Max Units -- 5 ms Tris Rise time from 0.1VDD to 0.9VDD Trtp Time of resetting to be low before powering on 100 -- μs Tpon Time of starting to report point after powering on 400 -- ms Tvdr Reset time after VDD powering on 1 -- ms Trsi Time of starting to report point after resetting 400 -- ms Trst Reset time 5 -- ms Twai Time of starting to report point after waking 300 -- ms Twak Wake up time 5 -- ms PIN CONFIGURATIONS Pin List of FT5x06 Table 4-1 Pin Definition of FT5x06 Name Pin No. FT5206GE1 VSSA 40 NC 1 NC FT5306DE4 FT5406DQ9 FT5406EE8 1 56 1 Type PWR Description Analog ground 2 2 Not connected 48 3 Not connected TX28 TX27 4 O Transmit output pin 5 O Transmit output pin TX26 1 6 O Transmit output pin TX25 2 7 O Transmit output pin TX24 3 8 O Transmit output pin TX23 4 9 O Transmit output pin TX22 5 10 O Transmit output pin TX21 6 11 O Transmit output pin TX20 3 7 12 O Transmit output pin TX19 4 8 13 O Transmit output pin TX18 5 9 14 O Transmit output pin TX17 6 10 15 O Transmit output pin 7 11 16 O Transmit output pin 8 12 17 O Transmit output pin TX16 TX15 2 TX14 3 9 13 18 O Transmit output pin TX13 4 10 14 19 O Transmit output pin TX12 5 11 15 20 O Transmit output pin HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 12 of 21 TX11 6 12 16 21 O Transmit output pin TX10 7 13 17 22 O Transmit output pin TX9 8 14 18 23 O Transmit output pin TX8 9 15 19 24 O Transmit output pin TX7 10 16 20 25 O Transmit output pin TX6 11 17 21 26 O Transmit output pin TX5 12 18 22 27 O Transmit output pin TX4 13 19 23 28 O Transmit output pin TX3 14 20 24 29 O Transmit output pin TX2 15 21 25 30 O Transmit output pin TX1 16 22 26 31 O VDD5 17 23 27 32 PWR Transmit output pin internal generated 5V power supply,A 1μF ceramic capacitor to ground is required. VDD3 18 24 28 33 PWR Analog power supply VSS 19 25 29 34 PWR VDDD 20 26 30 35 PWR Analog ground Digital power supply (1.8V), generated internal. A 1μF ceramic capacitor to ground is required. TEST_EN 21 27 31 36 I GPIO0 37 I/O General Purpose Input/Output port GPIO1 38 I/O General Purpose Input/Output port GPIO2 39 I/O General Purpose Input/Output port GPIO3 40 I/O General Purpose Input/Output port Test mode enabled at high and float in normal mode SPI Slave mode, chip select, active low / I2C SSEL/SCL 22 28 32 41 I/O SCK/GPIO 23 29 33 42 I MOSI/SDA 24 30 34 43 I/O MISO 25 31 35 44 O SPI Slave mode, data output /RST 26 32 36 45 I External Reset, Low is active WAKE 27 33 37 46 I External interrupt from the host INT 28 34 38 47 O External interrupt to the host clock input SPI Slave mode, clock input / General Purpose Input/Output port SPI Slave mode, data input / I2C data input and output NC 48 Not connected NC 49 Not connected NC 50 Not connected NC 51 Not connected VDDA 30 35 39 52 PWR Analog power supply RX1 29 36 40 53 I Receiver input pins RX2 31 37 41 54 I Receiver input pins RX3 32 38 42 55 I Receiver input pins RX4 33 39 43 56 I Receiver input pins RX5 34 40 44 57 I Receiver input pins RX6 35 41 45 58 I Receiver input pins RX7 36 42 46 59 I Receiver input pins RX8 37 43 47 60 I Receiver input pins RX9 38 44 48 61 I Receiver input pins HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 13 of 21 45 49 62 I Receiver input pins RX11 46 50 63 I Receiver input pins RX12 47 51 64 I Receiver input pins RX13 52 65 I Receiver input pins RX14 53 66 I Receiver input pins RX15 54 67 I Receiver input pins RX16 55 68 I Receiver input pins RX8 RX7 RX6 RX5 RX4 RX3 RX2 RX1 VDDA 59 58 57 56 55 54 53 52 RX9 60 61 62 64 63 NC NC NC NC INT WAKE /RST MISO MOSI/SDA SCK SSEL/SCL GPIO3 GPIO2 GPIO1 GPIO0 34 TEST_EN VDDD VDD3 VSS 31 32 33 TX4 TX3 30 28 TX5 TX2 TX1 VDD5 27 TX6 29 26 25 28 VDD3 35 TX7 27 VDD5 FT5406DQ9 Package Diagram TX16 TX15 TX8 26 VDDD VSS 43 42 41 40 39 38 37 36 22 23 24 25 TX2 TX1 SCK SSEL/SCL TEST_EN 9 10 11 12 13 14 15 16 17 TX10 TX9 24 TX3 TX22 TX21 TX20 TX19 TX18 TX17 TX23 47 46 45 44 20 21 22 23 TX5 TX4 MISO MOSI/SDA TX25 TX24 5 6 7 8 TX12 TX11 20 21 TX7 TX6 TX27 TX26 19 19 TX8 TX9 17 18 TX10 RX1 VDDA INT WAKE /RST 67 66 68 RX4 43 RX7 RX6 RX5 44 45 RX9 RX8 47 46 RX10 RX11 50 49 48 51 RX15 RX14 RX13 RX12 RX16 15 16 TX14 TX13 32 31 30 29 TX12 TX11 TX16 TX15 9 10 11 12 13 14 NC TX28 50 49 48 18 5 6 7 8 RX3 RX2 51 2 3 4 TX13 TX22 TX21 TX20 TX19 TX18 TX17 42 41 40 39 38 37 36 35 34 33 1 TX14 2 3 4 54 53 52 VSSA TX25 TX24 TX23 55 56 TX26 1 VSSA NC RX11 RX10 FT5306DE4 Package Diagram RX16 RX15 FT5206GE1 Package Diagram RX14 RX13 RX12 39 65 RX10 FT5406EE8 Package Diagram HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 14 of 21 5 5.1 PACKAGE INFORMATION Package Information of QFN-5x5-40L Package Item Symbol Lead Length Package Edge Tolerance Mold Flatness A A1 A2 A3 b D E e J K L aaa bbb Co Planarity Lead Offset ccc ddd Exposed Pad Offset eee Total Thickness Stand Off Mold Thickness L/F Thickness Lead Width Body Size Lead Pitch EP Size Min 0.7 0 ---0.15 3.5 3.5 0.35 Millimeter Type 0.75 0.035 0.55 0.203 REF 0.20 5 BSC 5 BSC 0.4 BSC 3.6 3.6 0.4 0.1 0.1 0.08 0.1 0.1 Max 0.8 0.05 0.57 0.25 3.7 3.7 0.45 HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 15 of 21 5.2 Package Information of QFN-6x6-48L Package Item Symbol Total Thickness Stand Off Mold Thickness L/F Thickness Lead Width A A1 A2 A3 b D E e J K L aaa bbb ccc ddd eee Body Size Lead Pitch EP Size Lead Length Package Edge Tolerance Mold Flatness Co Planarity Lead Offset Exposed Pad Offset Millimeter Min 0.7 0 ---- Type Max 0.75 0.035 0.55 0.203 REF 0.15 0.20 6 BSC 6 BSC 0.4 BSC 4.1 4.2 4.1 4.2 0.35 0.4 0.1 0.1 0.08 0.1 0.1 0.8 0.05 0.57 0.25 4.3 4.3 0.45 HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 16 of 21 5.3 Package Information of QFN-6x6-56L Package Min Millimeter Type Max A A1 0.5 0 0.55 0.035 0.6 0.05 Mold Thickness A2 ---- 0.4 ---- L/F Thickness A3 Item Name Symbol Total Thickness Stand Off Lead Width b 0.152 REF 0.13 D Body Size Lead Pitch E 6 BSC e 0.35 BSC J EP Size 0.18 0.23 6 BSC 4.6 4.7 4.8 K 4.6 4.7 4.8 Lead Length L 0.35 0.4 0.45 Package Edge Tolerance Mold Flatness aaa bbb 0.1 0.1 Coplanarity ccc 0.08 Lead Offset Exposed Pad Offset ddd eee 0.1 0.1 HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 17 of 21 5.4 Package Information of QFN-8x8-68L Package Min Millimeter Type Max A A1 0.7 0 0.75 0.035 0.8 0.05 Mold Thickness A2 ---- 0.55 0.57 L/F Thickness A3 Item Name Symbol Total Thickness Stand Off Lead Width b 0.203 REF 0.15 D Body Size Lead Pitch EP Size 0.20 0.25 8 BSC E 8 BSC e 0.4 BSC J 6.1 6.2 6.3 K 6.1 6.2 6.3 0.35 0.4 0.45 Lead Length L Package Edge Tolerance Mold Flatness aaa bbb 0.1 0.1 Coplanarity ccc 0.08 Lead Offset Exposed Pad Offset ddd eee 0.1 0.1 HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 18 of 21 5.5 Order Information QFN Package Type 40Pin(5 * 5 )/48Pin( 6 * 6 )/56Pin( 6 * 6 )/68Pin ( 8 * 8 ) 0.75 - P0.4/0.55 - P0.35 Product Name FT5206GE1/ FT5306DE4/ FT5406DQ9/FT5406EE8 Note: 1). The last two letters in the product name indicate the package type and lead pitch and thickness. 2). The second last letter indicates the package type. D : QFN-6*6 , E : QFN-8*8, G : QFN-5*5 3). The last letter indicates the lead pitch and thickness. E : 0.75 - P0.4 , Q:0.55-P0.35 T: Track Code F/R:”F” for Lead Free process, F T 5x06xxx TFYWWSV ”R” for Halogen Free process Y: Year Code WW: Week Code S: Lot Code V：IC Version Product Name Package Type # TX Pins # RX Pins FT5206GE1 QFN-40L 15 10 FT5306DE4 QFN-48L 20 12 FT5406DQ9 QFN-56L 26 16 FT5406EE8 QFN-68L 28 16 END OF DATASHEET HIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BE REPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF FOCALTECH SYSTEMS CO.,LTD. Copyright © 2012, FocalTech Systems CO.,Ltd . All rights reserved Version 3.0︱Page 19 of 21