LXDC2XQ series New Power Module 1. Features Small footprint Buck converter for up to 1.5A output current application (Output Voltage 2.5V and 3.3V: 800mA output current) Low EMI noise using an inductor-embedded embedded ferrite substrate High efficiency using synchronous rectifier technology at 3MHz operation Fixed output voltage range: 1.0~3.3V V (50mV 50mV step adjustable, factory setting) Selectable control mode : PFM/PWM FM/PWM auto mode / Forced PWM mode 2.5% DC voltage accuracy over full load current range with PWM mode. Wide input voltage range : 2.7~5.5V 5.5V Over current protection, Over temperature protection 2. Description The LXDC2XQ series is a step-down down DC DC-DC converter suitable for space-limited limited or noise-sensitive noise applications. The device utilizes an inductor-embedded embedded ferrite substrate that reduces radiated EMI noise and conduction noise. By adding input/output capacitors, it can be used as an LDO replaceme replacement. nt. Its low noise and easy-to-assemble easy features assure reliable power supply quality. The device works in PFM mode at light load for extended battery life. At heavy load, it changes to PMW mode automatically and maintains high efficiency using synchronous rectifying technology. The device provides good output voltage accuracy even in PFM mode. It maintains 2 2.5% DC voltage accuracy over the full current range (0-1,500mA), 00mA), and shows very smooth mode transition between PFM mode and PWM mode. 3. Typical Application Circuit Cout : 10uF/6.3V MLCC (muarta: GRM155R60J106) 1 July. 2015 LXDC2XQ series New Power Module 4. Mechanical Details 4-1. Outline W L unit:mm Mark Dimension Mark Dimension W 2.6 +/- 0.2 c 0.5 +/- 0.1 L 2.8 +/- 0.2 d 0.44 +/- 0.1 T 1.14 MAX e 0.5 +/- 0.1 a 0.26 +/- 0.2 f 0.35 +/- 0.1 b 0.49 +/- 0.1 g 0.4 +/- 0.1 4-2. Pin configuration Pin No. Symbol I/O 7 EN Input 2,3 Vout Output 4,8,9 GND 5,6 Vin 1 MODE - Description This is the ON/OFF control pin of the device. Connecting this pin to GND keeps the device in shutdown mode. Pulling this pin to Vin enables the device with soft start. This pin must not be left floating and must be terminated. EN=H: Device ON, EN=L: Device OFF Regulated voltage output pin. Apply output load between this pin and GND. Ground pin Input Vin pin supplies current to the LXDC2XQ internal regulator Input This is the operation mode select pin. This pin must not be left floating and must be terminated. Mode=H: Low-noise mode enabled, frequency PWM operation is forced. Mode=L: This device is operating in pulse frequency modulation mode (PFM) at light load currents, and in regulated frequency pulse width mode (PWM) at high-load currents. 2 July. 2015 LXDC2XQ series New Power Module 4-3. Functional Block Diagram 5. Ordering Information Part number Output Voltage Device Specific Feature MOQ LXDC2XQ10A-251 1.0V Standard Type T/R, 3000pcs/R LXDC2XQ11A-298 1.1V Standard Type T/R, 3000pcs/R LXDC2XQ12A-252 1.2V Standard Type T/R, 3000pcs/R LXDC2XQ13A-343 1.3V Standard Type T/R, 3000pcs/R LXDC2XQ1DA-299 1.35V Standard Type T/R, 3000pcs/R LXDC2XQ15A-277 1.5V Standard Type T/R, 3000pcs/R LXDC2XQ17A-396 1.7V Standard Type T/R, 3000pcs/R LXDC2XQ18A-253 1.8V Standard Type T/R, 3000pcs/R LXDC2XQ25A-300 2.5V Standard Type T/R, 3000pcs/R LXDC2XQ33A-254 3.3V Standard Type T/R, 3000pcs/R 6. Electrical Specification 6-1 Absolute maximum ratings Parameter symbol rating Unit Vin 6.2 V VEN 6.2 V VMODE 6.2 Maximum input voltage Maximum EN pin voltage Maximum MODE pin voltage V Operating Ambient temperature Ta -40 to +105 o Operating Case Temperature Tc -40 to +105 o C C 3 July. 2015 LXDC2XQ series New Power Module 6-2 Electrical characteristics (Ta=25℃) Parameter Input voltage Input leak current Symbo l Condition Vin Iin-off Vout PWM Mode Vin-Vout>0.7V UVLO Typ. Max. Unit 2.7 3.7 5.5 V 2 uA Vin=3.7V, EN=0V PFM Mode Vin-Vout>0.7V Output voltage Min. LXDC2XQ10A-251 0.975 1.0 1.035 LXDC2XQ11A-298 1.072 1.1 1.139 LXDC2XQ12A-252 1.170 1.2 1.242 LXDC2XQ13A-343 1.268 1.3 1.345 LXDC2XQ1DA-299 1.316 1.35 1.397 LXDC2XQ15A-277 1.462 1.5 1.553 LXDC2XQ17A-396 1.658 1.7 1.759 LXDC2XQ18A-253 1.755 1.8 1.863 LXDC2XQ25A-300 2.437 2.5 2.588 LXDC2XQ33A-254 3.218 3.3 3.416 LXDC2XQ10A-251 0.975 1.0 1.025 LXDC2XQ11A-298 1.072 1.1 1.128 LXDC2XQ12A-252 1.170 1.2 1.230 LXDC2XQ13A-343 1.268 1.3 1.332 LXDC2XQ1DA-299 1.316 1.35 1.384 LXDC2XQ15A-277 1.462 1.5 1.538 LXDC2XQ17A-396 1.658 1.7 1.742 LXDC2XQ18A-253 1.755 1.8 1.845 LXDC2XQ25A-300 2.473 2.5 2.563 LXDC2XQ33A-254 3.218 3.3 3.383 1.35 2.0 2.68 UVLO V V LXDC2XQ10A-251 LXDC2XQ11A-298 LXDC2XQ12A-252 LXDC2XQ13A-343 Load current range Iout LXDC2XQ1DA-299 0 1500 mA LXDC2XQ15A-277 LXDC2XQ17A-396 LXDC2XQ18A-253 LXDC2XQ25A-300 LXDC2XQ33A-254 0 800 4 July. 2015 LXDC2XQ series New Power Module Parameter Symbo l Condition Min. Typ. Max. Unit LXDC2XQ10A-251 LXDC2XQ11A-298 LXDC2XQ12A-252 LXDC2XQ13A-343 Over current protection LXDC2XQ1DA-299 OCP 1500 mA LXDC2XQ15A-277 LXDC2XQ17A-396 LXDC2XQ18A-253 LXDC2XQ25A-300 LXDC2XQ33A-254 800 LXDC2XQ10A-251 LXDC2XQ11A-298 LXDC2XQ12A-252 Vin=3.7V, LXDC2XQ13A-343 Iout=1500mA, LXDC2XQ1DA-299 BW=150MHz 15 LXDC2XQ15A-277 Ripple voltage LXDC2XQ17A-396 Vrpl mV LXDC2XQ18A-253 Vin=3.7V, Iout=800mA LXDC2XQ25A-300 15 LXDC2XQ33A-254 15 BW=150MHz Vin=5.0V, Iout=800mA, BW=150MHz 5 July. 2015 LXDC2XQ series New Power Module Parameter Symbol Condition Vin=3.7V, Efficiency EFF Iout=300mA Vin=5.0V, Iout=300mA EN control voltage VENH ON ; Enable VENL OFF ; Disable Min. Typ. LXDC2XQ10A-251 85 LXDC2XQ11A-298 85 LXDC2XQ12A-252 86 LXDC2XQ13A-343 87 LXDC2XQ1DA-299 87 LXDC2XQ15A-277 88 LXDC2XQ17A-396 89 LXDC2XQ18A-253 90 LXDC2XQ25A-300 93 LXDC2XQ33A-254 93 Max. Unit % 1.4 Vin V 0 0.3 V (*1) External capacitors (Cout:10uF) shall be placed near the module in order to proper operation. (*2) The above characteristics are tested using the application circuit on section 8. 6 July. 2015 LXDC2XQ series New Power Module 6-3 Thermal and Current De-rating Information The following figures show the power dissipation and temperature rise characteristics. These data are measured on Murata’s evaluation board of this device at no air-flow condition. Power Dissipation([mW) Io-Loss characteristics(Vin=3.7V,Vout=1.8V) 800 700 600 500 400 300 200 100 0 0 500 1000 1500 Io(mA) The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a continuous power delivering application. The amount of current de-rating is highly dependent on the environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should o especially be taken in applications where the device temperature exceeds 85 C. o The IC temperature of the device must be kept lower than the maximum rating of 105 C. It is generally recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for the temperature of semiconductor is 80%. MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in MLCC capacitor is not reversible but cumulative over time. 7 July. 2015 LXDC2XQ series New Power Module Vin= 3.7~5.5V, Vout= 1.0, 1.1, 1.2, 1.35, 1.5, 1.8V Capacitor B1 Life vs Capacitor Case temperature 100000 Capacitor B1 Life (Thousand Hours) Vin=5.5V Vin=5.0V 10000 Vin=4.0V Vin=3.7V 1000 100 10 1 20 40 60 80 100 Capacitor Case Temperature (oC ) 120 Vin= 5.0~5.5V, Vout=3.3V, 2.5V Capacitor B1 Life (Thousand Hours) Capacitor B1 Life vs Capacitor Case temperature 100000 Vout=3.3V 10000 Vout=2.5V 1000 100 10 1 20 40 60 80 100 Capacitor Case Temperature (oC ) 120 The following steps should be taken before the design fix of user’s set for reliable operation. o 1. The ambient temperature of the device should be kept below 105 C 2. The IC temperature should be measured on the worst condition of each application. The temperature must be o kept below 105 C. An appropriate de-rating of temperature and/or output current should be taken. 3. The MLCC temperature should be measured on the worst condition of each application. Considering the above figure, it should be checked if the expected B1 life of MLCC is acceptable or not. 8 July. 2015 LXDC2XQ series New Power Module 7. Detailed Description PFM/PWM Mode If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates in discontinuous current mode with a sporadic switching pulse to keep high efficiency at light load. The device uses constant on-time control in PFM operation, which produces a low ripple voltage and accurate output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just increasing the output capacitor. The transition between PFM and PWM is also seamless and smooth. The transition current between PFM and PWM is dependent on Vin, Vout and other factors, but the approximate threshold is about 100-200mA. PFM mode at light load PWM mode at heavy load Nominal output voltage UVLO (Under Voltage Lock Out) The input voltage (Vin) must reach or exceed the UVLO voltage (2.0Vtyp) before the device begins the start up sequence even when the EN pin is kept high. The UVLO function protects against unstable operation at low Vin levels . Soft Start The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because of this function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal soft-start time is 0.3msec. Enable The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must be terminated to logic high and must not be left floating. Pulling the EN pin to logic low forces the device into shutdown. The device does not have a discharge function when it turns off. If you prefer a discharge function, please contact a Murata representative. 100% Duty Cycle Operation The device can operate in 100% duty cycle mode, in which the high-side switch is constantly turned ON, thereby providing a low input-to-output voltage difference. When Vin and Vout become close and the duty cycle approaches 100%, the switching pulse will skip the nominal switching period and the output voltage ripple may be larger than other conditions. It should be noted that this condition does not mean a failure of the device. Thermal Shutdown o As soon as internal IC’s junction temperature exceeds 150 C(typ), the device goes into thermal shutdown. The device returns to its normal operation when the internal IC’s junction temperature again falls below 120OC(typ). 9 July. 2015 LXDC2XQ series New Power Module 8. Test Circuit 10 July. 2015 LXDC2XQ series New Power Module 9. Measurement Data Micro DC-DC Converter evaluation board (P2LX0244) Measurement setup The enable switch has three positions. 1. When it is toggled to “ON” side, the device starts operation. 2. When it is toggled to “OFF” side, the device stops operation and remains in shut down status. 3. When it is set to middle of “ON” and “OFF”, the EN pin floats and an external voltage can be applied to the EN terminal pin on the EVB. If you don’t apply an external voltage to EN pin, the enable switch should not to be set to the middle position. The mode switch has three states. 1. When it is toggled to “H” side, the device operates PWM forced mode. 2. When it is toggled to “L” side, the device operates PFM/PWM automatic mode. 3. When it is set to middle of “H”and “OFF”, the mode pin float and an external voltage can be applied to the Mode terminal pin on the EVB. If you don’t apply an external voltage to Mode pin, the mode switch should not to be set to the middle position. ※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables. 11 July. 2015 LXDC2XQ series New Power Module Typical Measurement Data (reference purpose only) (Ta=25℃) Efficiency ・Vin=5.0V, Vout=3.3V ・Vin=3.7V, Vout=1.8V Efficiency 96 95 94 90 92 85 90 EFF [%] EFF [%] Efficiency 88 86 80 75 70 84 65 82 60 80 1 10 1 100 10 1000 10000 Iout [mA] Iout [mA] ・Vin=3.7V, Vout=1.2V ・Vin=3.7V, Vout=1.0V Efficiency Efficiency 90 90 85 85 80 80 EFF [%] EFF [%] 100 75 75 70 70 65 65 60 60 1 10 100 1000 1 10000 10 100 1000 10000 Iout [mA] Iout [mA] 12 July. 2015 LXDC2XQ series New Power Module Typical Measurement Data (reference purpose only) (Ta=25℃) Load Regulation ・Vin=5.0V, Vout=3.3V ・Vin=3.7V, Vout=1.8V Load Regulation 3.366 1.836 3.333 1.818 Vout [V] Vout [V] Load Regulation 3.3 1.8 3.267 1.782 3.234 1.764 0 200 400 600 0 800 500 Iout [mA] ・Vin=3.7V, Vout=1.2V 1500 ・Vin=3.7V, Vout=1.0V Load Regulation Load Regulation 1.224 1.02 1.212 1.01 Vout [V] Vout [V] 1000 Iout [mA] 1.2 1 0.99 1.188 1.176 0.98 0 500 1000 0 1500 Iout [mA] 500 1000 1500 Iout [mA] 13 July. 2015 LXDC2XQ series New Power Module Typical Measurement Data (reference purpose only) Output Ripple-Noise ・Vin=5.0V, Vout=3.3V, BW : 150MHz ・Vin=3.7V, Vout=1.8V, BW: 150MHz Output Ripple Noise 50 50 40 40 Vrpl [mV] Vrpl [mV] Output Ripple Noise 30 20 30 20 10 10 0 0 0 200 400 600 0 800 500 ・Vin=3.7V, Vout=1.2V, BW: 150MHz ・Vin=3.7V, Vout=1.0V, BW: 150MHz Output Ripple Noise 50 50 40 40 Vrpl [mV] Vrpl [mV] Output Ripple Noise 30 20 30 20 10 10 0 0 500 1000 1500 Iout [mA] Iout [mA] 0 1000 1500 0 Iout [mA] 500 1000 1500 Iout [mA] 14 July. 2015 LXDC2XQ series New Power Module Typical Measurement Data (reference purpose only) (Ta=25℃) Load Transient Response ・Vin=5.0V, Vout=3.3V ・Vin=3.7V, Vout=1.8V 15 July. 2015 LXDC2XQ series New Power Module ・Vin=3.7V, Vout=1.2V ・Vin=3.7V, Vout=1.0V 16 July. 2015 LXDC2XQ series New Power Module 10.Reliability Tests No. 1 2 3 Items Vibration Resistance Result (NG) 18 G (0) Frequency : 10~2000 Hz 2 Acceleration : 196 m/s Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection : 1.6mm Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. 18 G (0) Pushing Direction 18 G (0) 18 G (0) 18 G (0) Test Methods Appearance : No severe damages Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection Soldering strength (Push Strength) QTY Specifications 9.8 N Minimum Specimen 4 5 Solderability of Termination Resistance to Soldering Heat (Reflow) 75% of the terminations is to be soldered evenly and continuously. Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 3±0.5 sec. at 245±5 °C. Preheat : 150 °C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature : 150-180 °C Preheat Period : 90+/-30 sec. High Temperature : 220 °C High Temp. Period : 20sec. Peak Temperature : 260+5/-0 °C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. 17 July. 2015 LXDC2XQ series New Power Module No. 6 7 8 9 Items Specifications Test Methods High Temp. Exposure Temperature：85±2 ℃ Period：1000+48/-0 h Room Condition：2～24h Temperature Cycle Condition：100 cycles in the following table Humidity (Steady State) Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Low Temp. Exposure Step Temp(°C) Time(min) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+3/-0 30±3 Temperature：85±2 ℃ Humidity：80～90%RH Period：1000+48/-0 h Room Condition：2～24h Temperature：-40±2 ℃ Period：1000+48/-0 h Room Condition：2～24h QTY Result (NG) 18 G (0) 18 G (0) 18 G (0) 18 G (0) 10 ESD(Machine Model) C：200pF、R：0Ω TEST Voltage ：+/-100V Number of electric discharges：1 5 G (0) ESD(Human Body Model) C：100pF、R：1500Ω TEST Voltage ：+/-1000V Number of electric discharges：1 5 G (0) 11 18 July. 2015 LXDC2XQ series New Power Module Fig.1 Land Pattern unit (mm) Mark Dimension a 0.65 b 0.3 c 0.6 d 0.6 e 0.3 *Reference purpose only 19 July. 2015 LXDC2XQ series New Power Module Fig.2 Testing board Unit：mm 100 40 ■： Land pattern is same as figure1 Glass-fluorine board t＝1.6mm Copper thickness over 35 mm Mounted situation Unit：mm チップ Device 45 45 Test method Unit：mm 20 50 R230 deflection 20 July. 2015 LXDC2XQ series New Power Module 11.Tape and Reel Packing 1）Dimensions of Tape (Paper tape) (Unit : mm) Feeding direction 2） Dimensions of Reel (Unit : mm) 2±0.5 Φ60 φ13±0.2 Φ180 (9.0) 13.0±1.4 21 July. 2015 LXDC2XQ series New Power Module 3）Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 50um in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip 22 July. 2015 LXDC2XQ series New Power Module 4）Leader and Tail tape A B Components 部品収納部 Symbol C Items Ratings(mm) A No components at trailer min 160 B No components at leader min 100 C Whole leader min 400 5）The tape for chips are wound clockwise and the feeding holes are to the right side as the tape is pulled toward the user. 6）Packaging unit: 3,000 pcs./ reel 7） Material： Base Tape … Plastic Reel … Plastic Antistatic coating for both base tape and reel 8）Peeling of force 0.7 N max. 0.1~1.0N 165 to 180 ° Cover Tape カバーテープ ベーステープ Base Tape 23 July. 2015 LXDC2XQ series New Power Module NOTICE 1. Storage Conditions: To avoid damaging the solderability of the external electrodes, be sure to observe the following points. - Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH. (Packing materials, In particular, may be deformed at the temperature over 40 °C.). - Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.). - Stored products should be used within 6 months of receipt. Solderability should be verified if this period is exceeded This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020). 2. Handling Conditions: Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the product because of the nature of ceramics structure. Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions are shown for a reference purpose only. Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set. When using underfill materials, be sure to check the mechanical characteristics in the actual set. 24 July. 2015 LXDC2XQ series New Power Module 4. Soldering Conditions: Soldering is allowed up through 2 times. Carefully preheat the product ：T less than 130 °C. If the product is cooled down rapidly like being immersed in liquid, it might be damaged by a rapid temperature change. Excessive thermal shock should be avoided. Soldering should be carried out in the conditions shown below to prevent damaging the product. Contact a Murata representative in case there is concerning about soldering conditions. Reflow soldering standard conditions (example) Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 25 July. 2015 LXDC2XQ series New Power Module 5. Cleaning Conditions: The product is not designed to be cleaned after soldering. 6. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - In a dusty environment. - Direct sunlight - Water splashing place. - Humid place where water condenses. - In a freezing environment. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. If static electricity is added to this product, degradation and destruction may be produced. Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time of an assembly and measurement. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: (1) Installation of protection circuits or other protective device to improve system safety (2) Installation of redundant circuits in the case of single-circuit failure 7. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. 26 July. 2015 LXDC2XQ series New Power Module 8. Limitation of Applications: The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring extremely high reliability following the application listed below, you should consult with the Murata staff in advance. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option and dealer-installed option. - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application which malfunction or operational error may endanger human life and property of assets. - Application which related to occurrence the serious damage - Application of similar complexity and/ or reliability requirements to the applications listed in the above. ! Note: Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. Product specifications are subject to change or our products in it may be discontinued without advance notice. This catalog is for reference only and not an official product specification document, therefore, please review and approve our official product specification before ordering this product. 27 July. 2015