null 1301522

LXDC2HL
LXDC2HL-G
Series
Micro DC-DC converter
1. Features
2
 Low EMI noise and small footprint (5mm ) using inductor-embedded ferrite substrate
 PFM/PWM automatic
matic mode switching function
 Smooth mode transient between PFM mode and PWM mode
with low-ripple-voltage PFM mode
 2% DC voltage accuracy over full load current range
 Wide input
nput voltage range : 2.3~5.5V
 Fixed output voltage : 0.8V – 2. 5V
V (factory setting
setting)
 Internal soft start, overcurrent protection
2. Description
The LXDC2HL series is a low power step
step-down DCDC converter, which is suitable for a space-limited or a
noise-sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate
eliminates radiated EMI noise and conduction noise efficiently.
By just putting input/output capacitors, it can be used as a LDO replacement.. Its low noise feature and easy to
assembly feature assures reliable power su
supply quality.
The
e device works in PFM mode at light load and it extends the battery life. At heavy load, its control mode
changes to PMW mode automatically and it keeps high efficiency using synchronous rectifying technology.
The device keeps good output voltage accuracy even in PFM mode. It keeps 2% DC voltage accuracy o
over full
current range,, and shows very smooth mode transient between PFM mode and PWM mode.
3. Typical Application Circuit
LXDC2HL-G
LXDC2HL
Enable
EN
VBAT
Vin
Vout
Vout
GND
10uF
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
4. Mechanical details
4-1 Outline
Bottom View
Top View
Side View
Unit: mm
Mark
Dimension
L
2.5 +/- 0.2
W
2.0 +/- 0.2
T
1.0 MAX
a
0.85 +/- 0.1
b
0.60 +/- 0.1
c
0.15 +/- 0.15
4-2. Pin Function
Pin
1
Symbol
Vin
I/O
Input
2
EN
Input
3
Vout
Output
4
GND
-
Description
Vin pin supplies current to the LXDC2HL internal regulator.
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
If this pin is left open, the device may be off around 100mA output.
EN=H: Device ON, EN=L: Device OFF
Regulated voltage output pin.
Apply output load between this pin and GND.
Ground pin
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
4-3. Functional Block Diagram
5. Ordering Information
Part number
Output Voltage
Device Specific Feature
MOQ
LXDC2HL10G-301
1.0V
Standard Type
T/R, 3000pcs/R
LXDC2HL11G-306
1.1V
Standard Type
T/R, 3000pcs/R
LXDC2HL12G-302
1.2V
Standard Type
T/R, 3000pcs/R
LXDC2HL13G-441
1.3V
Standard Type
T/R, 3000pcs/R
LXDC2HL15G-303
1.5V
Standard Type
T/R, 3000pcs/R
LXDC2HL18G-304
1.8V
Standard Type
T/R, 3000pcs/R
LXDC2HL25G-341
2.5V
Standard Type
T/R, 3000pcs/R
6. Electrical Specification
6-1
Absolute maximum ratings
Parameter
Input voltage
symbol
rating
Vin, EN
6.3
Unit
V
Operating ambient temperature
Ta
-40 to +85
o
Operating IC temperature
TIC
-40 to +125
o
-40 to +85
o
Storage temperature
TSTO
C
C
C
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
6-2
Electrical characteristics (Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input voltage
Vin
2.3
3.7
5.5
V
UVLO voltage
UVLO
1.0
1.4
1.8
V
Input leak current
lin-off
0
2
uA
Output voltage
accuracy
Vout
Vin=3.7V, EN=0V
Vin-Vout>1V
Vin-Vout>0.7V
Load current range
Ripple voltage
Efficiency
EN control voltage
SW Frequency
Iout
Vrpl
EFF
LXDC2HL10G-301
0.976
1.0
1.024
LXDC2HL11G-306
1.076
1.1
1.124
LXDC2HL12G-302
1.176
1.2
1.224
LXDC2HL13G-441
1.274
1.3
1.326
LXDC2HL15G-303
1.47
1.5
1.53
LXDC2HL18G-304
1.764
1.8
1.836
LXDC2HL25G-341
2.45
2.5
2.55
LXDC2HL10G-301
0
300
LXDC2HL11G-306
0
250
LXDC2HL12G-302
0
250
LXDC2HL13G-441
0
250
LXDC2HL15G-303
0
200
LXDC2HL18G-304
0
200
LXDC2HL25G-341
0
200
Vin=3.7V,
Iout=50mA,
BW=100MHz
Vin=3.7V,
Iout=100mA
VENH
ON ; Enable
VENL
OFF ; Disable
LXDC2HL10G-301
LXDC2HL11G-306
LXDC2HL12G-302
LXDC2HL13G-441
LXDC2HL15G-303
LXDC2HL18G-304
LXDC2HL25G-341
LXDC2HL10G-301
15
15
15
15
15
15
15
80
LXDC2HL11G-306
81
LXDC2HL12G-302
82
LXDC2HL13G-441
83
LXDC2HL15G-303
85
LXDC2HL18G-304
86
LXDC2HL25G-341
90
Fosc
V
mA
mVpp
%
1.4
Vin
V
0
0.25
V
1.2
MHz
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
OCP
Over current
protection
LXDC2HL10G-301
350
700
1350
LXDC2HL11G-306
300
700
1350
LXDC2HL12G-302
300
700
1350
LXDC2HL13G-441
300
700
1350
LXDC2HL15G-303
250
700
1350
LXDC2HL18G-304
250
700
1350
LXDC2HL25G-341
250
700
1350
mA
If the over current event continues less than Tlatch, auto-recovery.
If the over current event continues more than Tlatch, latch-up.
Restart by toggling EN voltage or Vin voltage
Tlatch
Start-up time
Latch-up mask time
@Vout=0.8×Vnom
Ton
20
usec
0.25
msec
(*1) External capacitors (Cout:10uF) shall be placed near the module in order to proper operation.
(*2)The above characteristics are tested using the test circuit on section 8.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
6-3
Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
Loss-ΔT Characteristics (Vin=3.7V)
80
6
70
5
60
4
50
ΔT[℃]
Power Dissipation[mW]
Io - Loss Characteristics (Vin=3.7V)
40
30
3
2
20
1
10
0
0
0
50
100
Iout [mA]
150
0
200
20
40
60
Power Dissipation[mW]
80
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
o
especially be taken in applications where the device temperature exceeds 85 C.
o
The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress.
Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be
described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance).
The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out
mechanisms in MLCC capacitor is not reversible but cumulative over time.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Capacitor B1 Life vs Capacitor Case temperature
Capacitor
B1B1Life(Thousand
Hours)
Capacitor
Life (Tousand Hours)
100000
Vin=5V
Vin=3.6V
10000
Vin=3.3V
Vin=2.5V
1000
100
10
1
0.1
20
40
60
80
100
120
Capacitor Case
Case Temprature
(o C )
Capacitor
temperature(℃)
The following steps should be taken before the design fix of user’s set for reliable operation.
o
1. The ambient temperature of the device should be kept below 85 C
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
o
kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
7. Detailed Description
PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates
in discontinuous current mode with a sporadic one switching pulse to keep high efficiency at light load.
The device uses constant on time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark
threshold is about 100-200mA
PFM mode at light load
PWM mode at heavy load
Nominal output voltage
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up
sequence even when EN pin kept high. UVLO function keeps away of an unstable operation at low Vin range
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 0.25msec. If you prefer a faster soft-start time, please contact Murata representative.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin
must be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light
load but will not work at heavy load.
Pulling the EN pin to logic low forces the device shutdown. The device does not have a discharge function when it
turns off. If you prefer a discharge function, please contact Murata representative.
100% Duty Cycle Operation
The device can operate 100% duty cycle mode, in which high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout becomes close and the duty gets close to 100%, the switching pulse will skip the nominal
switching period and the output voltage ripple may be larger than other condition. It should be noted that this
condition does not mean a failure of the device.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown.
After it is shut down, it can be restarted by toggling the Vin or EN voltage.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
8. Test Circuit
LXDC2HL-G
Cout :
10uF/6.3V
(GRM155R60J106M)
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
9. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0244)
Measurement setup
Enable SW
VIN_S
VIN
VOUT_S
Load
V
A
A
VOUT
GND
V
GND
GND_S
GND_S
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stop operation and keep shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external
voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable
switch should not to be set to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Efficiency
・Vin=3.7V,Vout=1.0V
・Vin=3.7V,Vout=1.2V
95
95
90
90
85
85
EFF [%]
100
EFF [%]
100
80
75
80
75
70
70
65
65
60
1
10
100
60
1000
1
10
Iout [mA]
・Vin=3.7V,Vout=1.5V
1000
100
1000
・Vin=3.7V,Vout=1.8V
100
95
95
90
90
85
85
EFF [%]
100
EFF [%]
100
Iout [mA]
80
75
80
75
70
70
65
65
60
60
1
10
100
1000
1
Iout [mA]
10
Iout [mA]
・Vin=3.7V,Vout=2.5V
100
95
EFF [%]
90
85
80
75
70
65
60
1
10
100
1000
Iout [mA]
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Load Regulation
・Vin=3.7V,Vout=1.0V
・Vin=3.7V,Vout=1.2V
1.01
1.212
Vout [V]
1.224
Vout [V]
1.02
1
0.99
1.188
0.98
1.176
0
50
100
150
200
Iout [mA]
250
300
0
・Vin=3.7V,Vout=1.5V
50
100
150
Iout [mA]
200
250
・Vin=3.7V,Vout=1.8V
1.53
1.836
1.515
1.818
Vout [V]
Vout [V]
1.2
1.5
1.485
1.8
1.782
1.47
1.764
0
50
100
Iout [mA]
150
200
100
Iout [mA]
150
200
0
50
100
Iout [mA]
150
200
・Vin=3.7V,Vout=2.5V
2.55
Vout [V]
2.525
2.5
2.475
2.45
0
50
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Ripple Voltage
・Vin=3.7V,Vout=1.0V
・Vin=3.7V,Vout=1.2V
3.7V,Vout=1.1V
50
50
40
Vrpl [mV]
Vrpl [mV]
40
30
20
10
20
10
0
0
0
50
100
150
200
Iout [mA]
250
300
0
・Vin=3.7V,Vout=1.5V
50
100
150
Iout [mA]
200
250
・Vin=3.7V,Vout=1.8V
50
50
40
40
Vrpl [mV]
Vrpl [mV]
30
30
20
10
30
20
10
0
0
0
50
100
Iout [mA]
150
200
100
Iout [mA]
150
200
0
50
100
Iout [mA]
150
200
・Vin=3.7V,Vout=2.5V
50
Vrpl [mV]
40
30
20
10
0
0
50
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Load Transient Response
・Vin=3.7V, Vout=1.8V
192mV
ΔIo=200mA
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
10.Reliability Tests
No.
1
2
3
Items
Vibration
Resistance
Result
(NG)
18
G
(0)
Frequency : 10~2000 Hz
2
Acceleration : 196 m/s
Direction : X,Y,Z 3 axis
Period
: 2 h on each direction
Total 6 h.
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
Pushing Direction
18
G
(0)
18
G
(0)
18
G
(0)
Test Methods
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection
Soldering strength
(Push Strength)
QTY
Specifications
9.8 N Minimum
Specimen
4
5
Solderability of
Termination
Resistance to
Soldering Heat
(Reflow)
75%
of
the
terminations is to be
soldered evenly and
continuously.
Appearance
No severe damages
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
Jig
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat
: 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Preheat Temperature : 150-180 °C
Preheat Period
: 90+/-30 sec.
High Temperature
: 220 °C
High Temp. Period
: 20sec.
Peak Temperature
: 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
No.
6
7
8
9
Items
Specifications
Test Methods
High Temp.
Exposure
Temperature:85±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
Temperature
Cycle
Condition:100 cycles in the following
table
Humidity
(Steady State)
Appearance
No severe damages
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
Low Temp.
Exposure
Step
Temp(°C)
Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
Temperature:85±2 ℃
Humidity:80~90%RH
Period:1000+48/-0 h
Room Condition:2~24h
Temperature:-40±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
QTY
Result
(NG)
18
G
(0)
18
G
(0)
18
G
(0)
18
G
(0)
10
ESD(Machine
Model)
C:200pF、R:0Ω
TEST Voltage :+/-100V
Number of electric discharges:1
5
G
(0)
ESD(Human
Body Model)
C:100pF、R:1500Ω
TEST Voltage :+/-1000V
Number of electric discharges:1
5
G
(0)
11
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Fig.1
Land Pattern
Unit:mm
Symbol
Dimensions
a
0.85
b
0.60
c
0.5
d
0.2
・Reference purpose only.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
Fig.2
Testing board
Unit:mm
■: Land pattern is same as figure1
Glass-fluorine board t=1.6mm
Copper thickness over 35 mm
Mounted situation
Unit:mm
チップ
Device
45
45
Test method
Unit:mm
20
50
R230
deflection
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
11. Tape and Reel Packing
1)Dimensions of Tape (Plastic tape)
Unit: mm
Feeding direction
2) Dimensions of Reel
Unit: mm
2±0.5
Φ60
Φ13±0.2
Φ180
(9.0)
13.0±1.4
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
3)Taping Diagrams
[1] Feeding Hole
:
As specified in (1)
[2] Hole for chip
:
As specified in (1)
[3] Cover tape
:
50um in thickness
[4] Base tape
:
As specified in (1)
[3]
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Chip
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
4)Leader and Tail tape
A
B
Components
部品収納部
Symbol
C
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
5)The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
6)Packaging unit: 3,000 pcs./ reel
7) Material: Base Tape
Reel
… Plastic
… Plastic
Antistatic coating for both base tape and reel
8)Peeling of force
0.7 N max.
0.1~1.0N
165 to 180 °
Cover
Tape
カバーテープ
ベーステープ
Base
Tape
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this
period is exceeded
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating :△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions (example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
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July. 2015
LXDC2HL-G Series
Micro DC-DC converter
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the
similar conditions to the above-mentioned. However, if products are used under the following
circumstances, it may damage products and leakage of electricity and abnormal temperature may
occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at
the time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range .
24
July. 2015
LXDC2HL-G Series
Micro DC-DC converter
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices
requiring extremely high reliability following the application listed below, you should consult with the
Murata staff in advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed
option and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
! Note:
Please make sure that your product has been evaluated and confirmed against your specifications
when our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without
advance notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
25
July. 2015