null 1301523

LXDC44A series
Micro DC-DC converter
1. Features
 Small footprint boost converter for up to 700mA output current application
 Low EMI noise by using an inductor-embedded ferrite substrate
 Input voltage range : 2.7 to 5.5V
 Output voltage : 5V-6V (Adjustable to one fixed voltage at factory setting: 5.0 to 6.0V)
 Switching frequency : 3.3MHz
 Automatic PWM/PFM mode switching for high efficiency
2.Description
The LXDC44A series is a small boost converter for products powered by either a three-cell alkaline,
NiCd or NiMH battery, or an one-cell Li-Ion or Li-polymer battery. The wide input voltage range is ideal to power
portable applications like mobile phones or for computer peripherals. The device utilizes an inductor-embedded
ferrite substrate that reduces radiated EMI noise and conduction noise.
At light load currents the converter will automatically enter PFM (Pulse Frequency Modulation) mode and keep
good conversion efficiency. When load current increases, it operates in PWM (Pulse Width Modulation) mode.
The converter utilizes a quasi-constant on-time valley current mode control, which offers fast load transient
response.
3. Typical Application Circuit
LXDC44A
Cin :10uF/6.3V (GRM188B30J106M)
Cout :22uF/6.3V (GRM21BB30J226M)
1
July 2015
LXDC44A series
Micro DC-DC converter
4. Mechanical details
4-1 Outline
Unit:mm
Mark
Dimension
Mark
Dimension
L
4.0±0.2
c
0.4 +/- 0.1
W
4.0±0.2
d
0.4 +/- 0.1
T
2.0 (Max)
e
0.4 +/- 0.1
a
1.0 +/- 0.1
f
0.2 +/- 0.2
b
0.8 +/- 0.1
4-2. Pin Function
Pin number
Symbol
I/O
2,3,8
GND
-
4,5,6
Vout
Output
7
NC
-
9
PG
Output
Function
Ground pin
Regulated voltage output pin.
Apply output load between this pin and GND.
No connection
Power good voltage output pin (Open drain). This is to indicate
whether the output voltage has reached its appropriate level or not.
This is the ON/OFF control pin of the device. The device is in
10
EN
Input
shutdown when the voltage to this pin is below 0.3V. Pulling this pin
above 1.4V enables the device with soft start. This pin should not be
left floating.
1,11,12
Vin
Input
EN=H: Device ON, EN=L: Device OFF
Vin pin supplies current to the LXDC44A internal regulator.
2
July 2015
LXDC44A series
Micro DC-DC converter
4-3. Functional Block Diagram
5. Ordering Information
Part number
Output Voltage
Device Specific Feature
MOQ
LXDC44AAAC–169
5.0V
Standard Type
T/R,1000pcs/R
LXDC44AAAC–212
6.0V
Standard Type
T/R,1000pcs/R
3
July 2015
LXDC44A series
Micro DC-DC converter
6. Electrical Specification
6-1. Absolute maximum ratings
Parameter
Symbol
Rating
Unit
Maximum input Voltage
Vin
6.0
V
Operating ambient temperature
Ta
-40 to +85
℃
Operating IC temperature
Tic
-40 to +125
℃
TSTO
-40 to +85
℃
Storage temperature
6-2. Electrical characteristics (Ta=25°C)
Parameter
Input Voltage Range
Symbol
Condition
Vin
UVLO Threshold Voltage
Vuvlo
Input leakage current
Iin-off
Output Voltage
Vout
Iout
Typ
2.7
2.0
Vin=3.6V
Max
Unit
5.5
V
2.2
V
3.5
uA
LXDC44AAAC–169
4.85
5.0
5.15
LXDC44AAAC–212
5.82
6.0
6.18
LXDC44AAAC–169
Output Current Range
Min
3.3V≦VIN≦4.5V
LXDC44AAAC–212
3.3V≦VIN≦5.5V
0
V
700
mA
0
Vin=3.6V, Iout=300mA
550
Vout Ripple
Vrpl
Efficiency
EFF
EN,MODE input H Level
VH
1.4
Vin
V
EN,MODE input L Level
VL
0
0.3
V
Start-up Time
Ton
0.35
msec
FOSC
3.3
MHz
Switching Frequency
BW=100MHz
Vin=3.6V, Iout=300mA
LXDC44AAAC-169
Over Current Protection
OCP
Auto recovery
LXDC44AAAC-212
Auto recovery
Over Temperature Protection
OTP
Auto recovery
700
10
mV
90
%
900
1800
mA
550
750
140
1800
o
C
(*1) External capacitors (Cin:10uF,Cout:22uF) shall be placed near the module in order to proper operation.
(*2)The above characteristics are tested using the application circuit on section 8
4
July 2015
LXDC44A series
Micro DC-DC converter
6-3
Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
o
especially be taken in applications where the device temperature exceeds 85 C.
o
The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress.
Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be
described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance).
The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out
mechanisms in MLCC capacitor is not reversible but cumulative over time.
5
July 2015
LXDC44A series
Capacitor B1 Life(Thousand Hours)
Micro DC-DC converter
Capacitor Case temperature(℃)
The following steps should be taken before the design fix of user’s set for reliable operation.
o
1. The ambient temperature of the device should be kept below 85 C
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
o
kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
6
July 2015
LXDC44A series
Micro DC-DC converter
7. Detailed Description
PFM MODE
The device integrates a PFM mode to improve efficiency at light load. In PFM mode the converter only operates
when the output voltage trips below a set threshold voltage. It ramps up the output voltage with several pulses.
During the PFM operation when the output voltage is above the set threshold the converter turns off some of the
inner circuits to save energy. The converter goes into PWM mode in case the output current can no longer be
supported in PFM mode.
UVLO (Under Voltage Lock Out)
The under voltage lockout circuit prevents the device from malfunctioning at low input voltages and the battery
from excessive discharge. It disables the output stage of the converter once the falling VIN trips the under-voltage
lockout threshold VUVLO which is typically 2.0V. The device starts operation once the rising VIN trips VUVLO
threshold plus its hysteresis of 100 mV at typ. 2.1V.
Soft Start
The device has an internal soft start circuit that controls the ramp-up of the current during start-up and prevents
the converter from inrush current that exceeds the set current limit. For typical 100 μs the current is ramped to the
set current limit. After reaching the current limit threshold it stays there until Vin = Vout then the converter starts
switching and boosting up the voltage to its nominal output voltage. During the complete start-up the input current
does not exceed the current limit.
POWER GOOD
The device has a built in power good function to indicate whether the output voltage operates within appropriate
levels. The power good output (PG) is set high after the output voltage reaches 95% of its nominal value and
stays there until the output voltage falls below 90 % of the nominal value. The power good is operable as long as
the converter is enabled and Vin is present. If the converter is disabled by pulling the EN pin low the PG open
drain output is high resistive. That means it follows the voltage it is connected to via the pull-up resistor.
Over Current Protection
LXDC44A series integrates a current limit function to avoid inrush current and to protect internal components
against heavy load including short circuit event. When over current event is removed, the device returns to the
normal operation automatically.
Over Temperature Shutdown
o
As soon as the internal IC’s junction temperature exceeds 140 C (typ), the device goes into thermal shutdown.
The device returns to its normal operation when the Internal IC’s junction temperature again falls below
o
120 C(typ).
7
July 2015
LXDC44A series
Micro DC-DC converter
8. Test Circuit
Cin
: 10uF/6.3V (GRM188B30J106M)
Cout : 22uF/6.3V (GRM21BB30J226M)
8
July 2015
LXDC44A series
Micro DC-DC converter
9. Micro DC-DC Converter evaluation board
(P2LX0720A)
Measurement setup
1MOhm
The enable switch has three states (ON, OFF and Open).
1. When it is shorted to “ON” side, the device starts operation.
2. When it is shorted to “OFF” side, the device stop operation and keep shut down status.
3. When it is set to open, the EN pin becomes floated and can be applied an external voltage through the EN
terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable switch should NOT to be set
to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
9
July 2015
LXDC44A series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25oC)
Conversion Efficiency
P/N : LXDC44AAAC–169
P/N : LXDC44AAAC–212
10
July 2015
LXDC44A series
Micro DC-DC converter
Load Regulation
P/N : LXDC44AAAC–169
P/N : LXDC44AAAC–212
11
July 2015
LXDC44A series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25oC)
Output Ripple-Noise
P/N : LXDC44AAAC–169
Vin=3.6V, Vout=5.0V, BW : 150MHz
P/N : LXDC44AAAC–212
Vin=3.6V, Vout=6.0V, BW : 150MHz
12
July 2015
LXDC44A series
Micro DC-DC converter
Load Transient Response
P/N : LXDC44AAAC–169
Vo(100mV/div)
200mVpp
Io(0.5A/div)
13
July 2015
LXDC44A series
Micro DC-DC converter
10.Reliability Tests
No.
1
2
3
Items
Vibration
Resistance
Result
(NG)
18
G
(0)
Frequency : 10~2000 Hz
2
Acceleration : 196 m/s
Direction : X,Y,Z 3 axis
Period
: 2 h on each direction
Total 6 h.
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
Pushing Direction
18
G
(0)
18
G
(0)
18
G
(0)
Test Methods
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection
Soldering strength
(Push Strength)
QTY
Specifications
9.8 N Minimum
Specimen
4
5
Solderability of
Termination
Resistance to
Soldering Heat
(Reflow)
75%
of
the
terminations is to be
soldered evenly and
continuously.
Appearance
No severe damages
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
Jig
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat
: 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Preheat Temperature : 150-180 °C
Preheat Period
: 90+/-30 sec.
High Temperature
: 220 °C
High Temp. Period
: 20sec.
Peak Temperature
: 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
14
July 2015
LXDC44A series
Micro DC-DC converter
No.
6
7
8
9
Items
Specifications
Test Methods
High Temp.
Exposure
Temperature:85±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
Temperature
Cycle
Condition:100 cycles in the following
table
Humidity
(Steady State)
Appearance
No severe damages
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
Low Temp.
Exposure
Step
Temp(°C)
Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
Temperature:85±2 ℃
Humidity:80~90%RH
Period:1000+48/-0 h
Room Condition:2~24h
Temperature:-40±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
QTY
Result
(NG)
18
G
(0)
18
G
(0)
18
G
(0)
18
G
(0)
10
ESD(Machine
Model)
C:200pF、R:0Ω
TEST Voltage :+/-100V
Number of electric discharges:1
5
G
(0)
ESD(Human
Body Model)
C:100pF、R:1500Ω
TEST Voltage :+/-1000V
Number of electric discharges:1
5
G
(0)
11
15
July 2015
LXDC44A series
Micro DC-DC converter
Fig.1
Land Pattern
Unit:mm
Symbol
Dimension
a
1.0
b
0.8
c
0.4
d
0.4
e
0.4
・Reference purpose only.
16
July 2015
LXDC44A series
Micro DC-DC converter
Fig.2
Testing board
Unit:mm
100
40
■: Land pattern is same as figure1
Glass-fluorine board t=1.6mm
Copper thickness over 35 mm
Mounted situation
Unit:mm
チップ
Device
45
45
Test method
Unit:mm
20
50
R230
deflection
たわみ量
17
July 2015
LXDC44A series
Micro DC-DC converter
11.Tape and Reel Packing
1)Dimensions of Tape (Paper tape)
(Unit : mm)
Feeding direction
2) Dimensions of Reel
(Unit : mm)
2±0.5
Φ100 Φ330
Φ13±0.2
(13.5)
17.5±1.0
18
July 2015
LXDC44A series
Micro DC-DC converter
3)Taping Diagrams
[1] Feeding Hole
:
As specified in (1)
[2] Hole for chip
:
As specified in (1)
[3] Cover tape
:
50um in thickness
[4] Base tape
:
As specified in (1)
[3]
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Chip
19
July 2015
LXDC44A series
Micro DC-DC converter
4)Leader and Tail tape
A
B
Components
部品収納部
Symbol
C
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
5)The tape for chips are wound clockwise and the feeding holes are to the right side as the tape is pulled
toward the user.
6)Packaging unit: 1,000 pcs./ reel
7)Material: Base Tape
Reel
… Plastic
… Plastic
Antistatic coating for both base tape and reel
8)Peeling of force
0.7 N max.
0.1~1.3N
165 to 180 °
Cover
Tape
カバーテープ
ベーステープ
Base
Tape
20
July 2015
LXDC44A series
Micro DC-DC converter
NOTICE
1. Storage Conditions:
・The product shall be stored without opening the packing under the ambient temperature from 5 to 35 deg.C and
humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40 deg.C.)
・The product left more than 6 months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and
dropping the product, shall not be applied in order not to damage the packing materials.
・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be used
within 168 hours.
When the color of the indicator in the packing changed, the product shall be baked before
soldering.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be
provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
21
July 2015
LXDC44A series
Micro DC-DC converter
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating :△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products
from damage. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions (example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
22
July 2015
LXDC44A series
Micro DC-DC converter
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it may
damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before actual
use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time of
an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures
must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range.
23
July 2015
LXDC44A series
Micro DC-DC converter
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option
and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
!
Note:
Please make sure that your product has been evaluated and confirmed against your specifications when our
product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance notice.
This catalog is for reference only and not an official product specification document, therefore, please review
and approve our official product specification before ordering this product.
24
July 2015