5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 ■Features ■Outline ● Top view white LED (5.6x3.0x0.8mm) ● Super high brightness of surface mount LED ● Lead frame package with individual 4 pins ● ESD protection ● Compatible to IR reflow soldering. Dimension Recommended Soldering Pad Design ■Applications ● General lighting ● Decoration lighting ● Indicator ■Absolute Maximum Rating Item ■Directivity (Ta=25℃) Symbol Value Unit DC Forward Current IF 150 mA Pulse Forward Current* IFP 200 mA Reverse Voltage VR 5 V Power Dissipation PD 540 mW Operating Temperature Topr -30 ~ +85 Storage Temperature Tstg -40~ +100 Lead Soldering Temperature Tsol 0 0 ℃ ℃ ℃/10sec 260 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics Part Number OSW35630C1A-150mA Color White OSM55630C1A-150mA Warm White W M (Ta=25℃ (Ta=25℃) VF (V) IR(µA) Φv(lm) Min. Typ. Max. Max. Min. Typ. Max. IF=150mA VR=5V ■ ■ Note: * Vf tolerance: ±0.05V * Luminous flux measurement allowance is:±10% LED & Application Technologies CCT Min. Typ. 2θ1/2(deg) Max. Typ. IF=150mA 2.8 3.1 3.6 10 45 - 60 5000K - 6000K 120 2.8 3.1 3.6 10 40 - 55 2800K - 3500K 120 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 ■Rank * Correspondence Table of Luminous Flux *VF bin Limit (IF=150mA) ■Chromaticity Diagram LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 *Bin Range of Chromaticity Coordinates (OSW35630C1A) Code X1 Y1 X2 Y2 X3 Y3 X4 Y4 D06 0.3221 0.3523 0.3324 0.3612 0.3324 0.3520 0.3224 0.3420 D09 0.3224 0.3430 0.3324 0.3520 0.3323 0.3429 0.3228 0.3336 D12 0.3228 0.3336 0.3323 0.3429 0.3323 0.3337 0.3231 0.3243 D15 0.3231 0.3243 0.3323 0.3337 0.3322 0.3245 0.3234 0.3149 E03 0.3324 0.3612 0.3470 0.3738 0.3461 0.3637 0.3324 0.3520 E05 0.3324 0.3520 0.3461 0.3637 0.3452 0.3536 0.3323 0.3429 E07 0.3323 0.3429 0.3452 0.3536 0.3442 0.3435 0.3323 0.3337 E09 0.3323 0.3337 0.3442 0.3435 0.3433 0.3334 0.3322 0.3245 LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 *Bin Range of Chromaticity Coordinates (OSM55630C1A) Code X1 Y1 X2 Y2 X3 Y3 X4 Y4 G04 0.4160 0.4199 0.4373 0.4302 0.4313 0.4166 0.4112 0.4067 G06 0.4112 0.4067 0.4313 0.4166 0.4252 0.4030 0.4063 0.3936 G08 0.4063 0.3936 0.4252 0.4030 0.4192 0.3893 0.4015 0.3804 G10 0.4015 0.3804 0.4192 0.3893 0.4131 0.3757 0.3966 0.3672 H04 0.4373 0.4302 0.4518 0.4354 0.4453 0.4216 0.4313 0.4166 H05 0.4518 0.4354 0.4689 0.4408 0.4614 0.4265 0.4453 0.4216 H07 0.4313 0.4166 0.4453 0.4216 0.4387 0.4077 0.4252 0.4030 H08 0.4453 0.4216 0.4614 0.4265 0.4539 0.4123 0.4387 0.4077 H10 0.4252 0.4030 0.4387 0.4077 0.4322 0.3939 0.4192 0.3893 H11 0.4387 0.4077 0.4539 0.4123 0.4463 0.3980 0.4322 0.3939 H13 0.4192 0.3893 0.4322 0.3939 0.4256 0.3800 0.4131 0.3757 H14 0.4322 0.3939 0.4463 0.3980 0.4388 0.3837 0.4256 0.3800 *If color binning is required, only one color group is allowed for each chip within a reel. Chromaticity coordinate groups are measured with an accuracy of ±0.01 *Color coordinate is derived from the CIE 1931 chromaticity. *Bin Rank of VF Rank (IF=20mA) DC Forward Voltage(v) White 88T-999 AAA BBB 2.9-3.2 3.2-3.4 3.4-3.6 *Forward voltage is measured with an accuracy of ±0.1V. LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 ■Typical Electro-Optical Characteristics Curves LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 RELIABILITY TEST REPORT CLASSIFICATION TEST TIME TEST CONDTION OPERATION If:150mA LIFE Ta:25+5 TEST ENDURANCE TEST ITME=1000HRS(-24HRS,+72HRS) HIGH R.H:90~95% TEMPERTURE Ta:65+5 ℃ HIGH HUMIDITY TEST ITME=240HRS(+2HRS) STORAGE HIGH Ta:105+5 TEMPERTURE TEST ITME=500HRS(-24HRS,+48HRS) STORAGE LOW Ta:-55+5 TEMPERTURE TEST STORAGE ℃ ℃ ITME=500HRS(-24HRS,+48HRS) ℃~25℃~-55℃~25℃ TEMPERTURE 105 CYCLING 60min 10min 60min 10min 20cycles ENVIRONMENTAL ℃~-55℃ THERMAL 105 SHOCK 10min 10min 10cycles ℃ TEST SOLDER Ta:260+5 RESISTANCE TEST SOLDERABILITY Ta:230+5 TEST ITME=10+1sec ℃ ITME=5+1sec JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY MEASURING ITME SYMBOL CONDITIONS LUMINOUS INTENSITY IV IF=150mA FORWARD VOLTAGE VF IF=150mA FAILURE IV<0.5*INITIAL VALUE VF>1.2*INITIAL VALUE REVERSE CURRENT IR Vr=5V IR>2*SPEC LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 OPERATION LIFE TEST LUMINANCE RATE CURVE Operating Life Test(If=150mA, Ta=25degC) Φv% White 120% 100% 100.0% 103.0% 100.4% 96.5% 80% 60% 40% 20% 0% Time (Hours) 0 168 500 *Burn-in condition: 150mA (With heatsink.) *Projection of Statistical Average Light Output Degradation Performance for LED Technology Extrapolated from OptoSupply QA Dept. Test Data. *According to OptoSupply outgoing Packaged Products Specification *MTBF:50,000hrs, 90% Confidence (A Failure is Any LED Which is Open, shorted or fails to Emit Light) *The Projected Data is Base on The Feature of LED Itself Under Normal Operation Conditions. *Any Improper Circuit Design or External Factors Might Cause a Different Result. LED & Application Technologies 1000 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 ■Recommended Reflow Soldering Profile Surface mounting condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for reflow soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 3) Manual soldering. - Lead solder ℃for max. 3sec, and only one time. Max. 300 - Lead-free solder ℃for max. 3sec, and only one time. Max. 350 - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method use the nitrogen reflow method. - After LEDs have been soldered, repairs should not be done. As repair is unavoidable, a doublehead soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times. LED & Application Technologies 5.6 x 3.0 x 0.8mm SMD OSXX5630C1A-150mA Ver.A.6 ■Package Model Loaded Quantity 3000 pcs. Per Reel Reel Part Optosupply Label LED & Application Technologies