Tops 3*1.5W Power Pure White LED OSW4X5H891E Ver.0 ■ Features ● ■Outline High-power LED ● Long lifetime operation ● RoHS compliant ● Possible to attach to heat sink directly without 4 5 6 3 2 1 using print circuit board. ■ Dimension Applications 3 2 1 4 5 6 ● Indoor & outdoor lighting ● Stage lighting ● Reading lamps Unit:mm Tolerance:±0.30mm ● Display cases, furniture illumination, marker Tolerances are for reference only ● Architectural illumination ● Spotlights ■Absolute Maximum Rating Item ■Directivity (Ta=25℃) Symbol Value Unit DC Forward Current *1 IF 3*175 mA Pulse Forward Current*2 IFP 3*200 mA Reverse Voltage VR 15 V Power Dissipation*1 PD 3*1,890 mW Operating Temperature Topr -30 ~ +85 Storage Temperature Tstg -40~ +100 Lead Soldering Temperature Tsol 260 0 ℃ ℃ ℃/5sec 0 - *1, Power dissipation and forward current are the value when the module temperature is set lower than the rating by using an adequate heat sink. *2, Pulse width Max.10ms Duty ratio max 1/10 -Optical Characteristics ■Forward Operating Current (DC) (Ta=25℃ (Ta=25℃) Item Symbol Condition Min. Typ. Max. Unit DC Forward Voltage VF IF=3*150mA 9.0 9.8 10.8 V DC Reverse Current IR - - 30 µA VR=15V Luminous Flux Φv IF=3*150mA 3*145 3*160 - lm Color Temperature CCT IF=3*150mA 5500 6500 8000 K Chromaticity x IF=3*150mA - 0.31 - Coordinates* y IF=3*150mA - 0.34 - 2θ1/2 IF=3*150mA - 90 - 50% Power Angle 3*175 3*150 3*125 3*100 RJ-A=8.5degC/W 3*75 3*50 3*25 0 deg Note: Don’t drive at rated current more than 5s without heat sink for High Power series. *1 Luminous Flux Measurement allowance is ±15% *2 Chromaticity Coordinates Measurement allowance is ±10% 3*200 Forward Current, IF (mA) ■Electrical 25 50 Ambient Temperature, T ( Fig. a 100 75 ℃) 115 125 Tops 3*1.5W Power Pure White LED OSW4X5H891E Ver.0 ■Heat design The following pictures show some measurements of mounted 5W Led on the heat sink for each board A and B (See Fig 1) with using thermograph to make an observation about heat distribution. Each boards is tested at various current conditions. As a result, LED needs larger heat sink as much as possible to reduce its own case temperature. Fig. 1 Configuration pattern examples for board assembly ㎡ Surface area (m ) Board LED power Material A 5W Al 20,600 B 10W Al 41,200 C 25W Al 103,000 D 50W Al 206,000 E 100W Al 412,000 F 200W Al 824,000 G 300W Al 1236,000 Min. Above tested LED device is attached with adhesive sheet to the heatsink. ℃ as a prerequisite on design process of 5W LED. <Fig.3> Board B (surface area=20,600m㎡) For reference's sake, Tj absolute maximum rating is defined at 115 ㎡ <Fig.2> Board A (surface area=10,300m ) IF=600mA LED & Application Technologies IF=600mA Tops 3*1.5W Power Pure White LED OSW4X5H891E Ver.0 ■Heat design Design flow chart LED & Application Technologies