RELIABILITY TEST SPECIFICATIONS We apply the reliability tests to new products, modified products (design, production equipment, process and materials) and reliability monitor test. Reliability tests verify that our products attain the reliability target. 1. Bipolar IC IC Storage Conditions for Normal Packing(MSL1)／SMD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 1 301 Soldering Heat 2 301 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Absolute Maximum Rating, 1000h 85℃, 85％, Voltage＝Absolute Maximum Rating, 1000h 121℃, 2.03×105Pa, 100％, 100h Reflow Max260℃, 10s Precondition：125℃ 16h, 85℃ 85% 168h 260℃, 10s Precondition：125℃ 16h, 85℃ 85% 168h 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 22 11 IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)／SMD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 1 301 Soldering Heat 2 301 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Absolute Maximum Rating, 1000h 85℃, 85％, Voltage＝Absolute Maximum Rating, 1000h 121℃, 2.03×105Pa, 100％, 100h Reflow Max260℃, 10s Precondition：125℃ 16h, 85℃ 65% 168h 260℃, 10s Precondition：125℃ 16h, 85℃ 65% 168h 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 22 11 IC Storage Conditions for Normal Packing(MSL1)／THD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 302 Thermal Shock Temperature Cycling Solderability 307 105 － Ver.2012-10-31 CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Absolute Maximum Rating, 1000h 85℃, 85％, Voltage＝Absolute Maximum Rating, 1000h 121℃, 2.03×105Pa, 100％, 100h 260℃，10s， The dipping depth should be up to 1mm from the body of the specimen. 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with Flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 11 -1- ORDERING INFORMATION 2. CMOS IC、Bi-CMOS IC IC Storage Conditions for Normal Packing(MSL1)／SMD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 1 301 Soldering Heat 2 301 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Voprmax, 1000h 85℃, 85％, Voltage＝Voprmax, 1000h 121℃, 2.03×105Pa, 100％, 100h Reflow Max260℃, 10s Precondition：125℃ 16h, 85℃ 85% 168h 260℃, 10s Precondition：125℃ 16h, 85℃ 85% 168h 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 22 11 IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)／SMD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 1 301 Soldering Heat 2 301 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Voprmax, 1000h 85℃, 85％, Voltage＝Voprmax, 1000h 121℃, 2.03×105Pa, 100％, 100h Reflow Max260℃, 10s Precondition：125℃ 16h, 85℃ 65% 168h 260℃, 10s Precondition：125℃ 16h, 85℃ 65% 168h 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 22 11 IC Storage Conditions for Deaeration Packing(Dry Pack2:MSL3)／SMD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST -2- Soldering Heat 1 301 Soldering Heat 2 301 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Voprmax, 1000h 85℃, 85％, Voltage＝Voprmax, 1000h 121℃, 2.03×105Pa, 100％, 100h Reflow Max260℃, 10s Precondition：125℃ 16h, 85℃ 30% 168h, 30℃ 70% 168h, 30℃ 70% 72h 260℃, 10s Precondition：125℃ 16h, 85℃ 30% 168h, 30℃ 70% 168h, 30℃ 70% 72h 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 22 11 Ver.2012-10-31 ORDERING INFORMATION IC Storage Conditions for Normal Packing(MSL1)／THD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 302 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Voprmax, 1000h 85℃, 85％, Voltage＝Voprmax, 1000h 121℃, 2.03×105Pa, 100％, 100h 260℃，10s， The dipping depth should be up to 1mm from the body of the specimen. 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with Flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 11 3. GaAs IC IC Storage Conditions for Normal Packing(MSL1)／SMD Type Package Test Method EIAJ ED-4701 High Temperature Storage 201 Low Temperature Storage 202 Humidity 103 Steady State Life 101 Temperature Humidity Bias（THB） 102 Pressure Cooker （PCT） － TEST Soldering Heat 1 301 Soldering Heat 2 301 Thermal Shock Temperature Cycling Solderability 307 105 － CONDITIONS Tstgmax, 1000h Tstgmin, 1000h 85℃, 85％, 1000h Tj＝Tstgmax, Voltage＝Absolute Maximum Rating, 1000h 85℃, 85％, Voltage＝Absolute Maximum Rating, 1000h 121℃, 2.03×105Pa, 100％, 100h Reflow Max260℃, 10s Precondition：125℃ 16h, 85℃ 85% 168h 260℃, 10s Precondition：125℃ 16h, 85℃ 85% 168h 0℃ 5 min.～100℃ 5 min, 10 cycles Tstgmin 30 min.～25℃ 5 min.～Tstgmax 30 min, 100 cycles Sn-3.0Ag-0.5Cu, 245℃, 5s, with flux SAMPLE SIZE 22 22 22 22 22 22 22 22 22 22 11 4. Opt Device Please make contact with us about detail information on each device. Ver.2012-10-31 -3-