NJL5303R COBP PHOTO REFLECTOR with Green LED GENERAL DISCRIPTION The NJL5303R is the compact surface mount type photo reflector , which is built in a GREEN LED and a high sensitive photo transistor. FEATURES • Peak wavelength: 570nm • High output, High S/N • Miniature, thin package: 1.9x2.6x0.8mm • Pb free solder reflowing permitted: 260°C, 2times • Halogen free, Pb free • Compliant with RoHS directive ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Emitter Forward Current (Continuous) Reverse Voltage (Continuous) Power Dissipation Detector Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Collector Power Dissipation SYMBOL RATINGS UNIT IF VR PD 20 4 50 mA V mW VCEO VECO IC PC 16 6 10 25 V V mA mW Ptot Topr Tstg Tsol 60 -20 to +70 -30 to +85 260 mW ℃ ℃ ℃ Coupled Total Power Dissipation Operating Temperature Storage Temperature Reflow Soldering Temperature ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Emitter Forward Voltage Reverse Current Peak Wavelength Detector Dark Current Collector-Emitter Voltage Coupled Output Current *1 Operating Dark Current *2 Rise Time Fall Time SYMBOL VF IR λP ICEO VCEO IO ICEOD tr tf TEST CONDITION MIN TYP MAX UNIT IF=4mA VR=4V ― ― ― ― ― 570 2.3 100 ― V µA nm VCE=10V IC=100µA ― 16 ― ― 0.2 ― µA V IF=4mA,VCE=2V,d=0.7mm IF=4mA,VCE=2V IC=100µA,VCE=2V,RL=1KΩ,d=0.7mm IC=100µA,VCE=2V,RL=1KΩ,d=0.7mm 12 ― ― ― ― ― 30 30 50 0.2 ― ― µA µA µs µs *1 Refer to OUTPUT CURRENT TEST CONDITION *2 Iceod may increase according to the periphery situation of the surface mounted product. 29-Jul-13 -1- NJL5303R OUTLINE unit:mm ±0.1 2.6 ±0.1 ±0.1 0.65 0.65 (0.2) E ±0.1 ±0.1 C LED CENTER 0.2 ±0.1 (0.25) A 0.5 (0.62) (1.16) 1.9 ±0.1 0.5 ±0.1 K (0.2) (0.25) (0.5) (1.54) (0.85) 0.2 PT CENTER 0.8 ±0.1 A : anode K : cathode C : collector E : emitter 0.7 0.85 0.5 0.4 0.5 0.85 PCB Pattern OUTPUT CURRENT TEST CONDITION DARK CURRENT TEST CONDITION The signal from LED is reflected at the aluminum surface. (0.8mm ) Aluminum Evapolation Surface ICEOD IF VCE 29-Jul-13 1.5m m Light Sealed Dark Box ICEOD IF VCE -2- NJL5303R RESPONSE TIME TEST CONDITION 0.7mm Aluminum Input Evapolation 90% Surface V+ RD P.G IF RL Output 10% OSC tr tf Io EDGE RESPONSE TEST CONDITION l=0mm l=0mm 0.7mm 0.7mm Aluminum Evaporation Surface Aluminum Evaporation Surface Direction X 29-Jul-13 Direction Y -3- NJL5303R Forward Current v.s. Temperature 100 50 90 45 80 40 70 Forward Current IF(mA) Power Dissipation P(mW) Power Dissipation v.s. Temperature Total Power Dissipation 60 50 40 30 20 35 30 25 20 15 10 Collector Power Dissipation 10 5 0 0 0 20 40 60 80 0 20 Ambient Temperature Ta(°C) 40 60 80 Ambient Temperature Ta(°C) TYPICAL CHARACTERISTICS Forward Voltage v.s. Forward Current (Ta=25deg-c) Forward Voltage v.s. Temperature 2.2 Forward Voltage VF(V) Forward Current IF(mA) 100 10 2 1.8 IF=4mA IF=10mA 1 1.6 1.5 -20 2.5 0 20 40 60 80 Ambient Temperature Ta(°C) Forward Voltage VF(V) Dark Current v.s. Temperature Operating Dark Current v.s. Temperature (Vce=2V) 100 0.1 Operating Dark Current Iceod(µA) Dark Current Iceo(nA) 10 1 0.1 0.01 Vce=2V 0.01 Vce=10V 0.001 IF=4mA IF=10mA 0.0001 0.001 -20 0 20 40 60 Ambient Temperature Ta(°C) 29-Jul-13 80 -20 0 20 40 60 80 Ambient Temperature Ta(°C) -4- NJL5303R Output Current v.s. Forward Current (Ta=25°° C) Output Current v.s. Temperature (Vce=2V) 160 Relative Output Current Io/Io(25°C)(%) 80 Output Current Io(µA) 60 40 20 IF=4mA 140 IF=10mA 120 100 80 60 Vce=2V,d=0.7mm 0 40 0 2 4 6 8 10 -20 0 Output Characteristics (Ta=25°C) 40 60 80 Vce Saturation (Ta=25°C) 0.5 80 Collector-Emitter Voltage Vce(V) IF=10mA 60 Output Current Io(µA) 20 Ambient Temperature Ta(°C) Forward Current IF(mA) IF=8mA 40 IF=6mA IF=4mA 20 0.4 0.3 Io=50µA Io=20µA Io=10µA 0.2 Io=5µA 0.1 IF=2mA 0 0 0 1 2 3 4 5 0.1 1 Collector-Emitter Voltage Vce(V) 10 Forward Current IF(mA) Output Current v.s. Distance (Ta=25°C) Output Current v.s. Edge Distance (Ta=25°C) 120 120 Relative Output Current Io/Io(max.)(%) Relative Output Current Io/Io(max.)(%) IF=4mA, Vce=2V,d=0.7mm 100 Vce=2V,IF=4mA 80 60 40 20 0 Direction Y 80 60 Direction X 40 20 0 0 1 2 3 Reflector Distance d(mm) 29-Jul-13 100 4 5 0 0.4 0.8 1.2 1.6 2 2.4 Edge Distance l(mm) -5- NJL5303R Spectral Response (Ta=25°° C) Emitter Spectral Response (Ta=25°° C) Detector 120 120 IF=4mA Vce=2V 100 Relative Response (%) Relative Response (%) 100 80 60 40 20 0 450 80 60 40 20 500 550 Wavelength λ(nm) 600 650 0 500 600 700 800 900 1000 Wavelength λ(nm) Attention: Please be aware that all data in the graph are just for reference and not for guarantee. 29-Jul-13 -6- NJL5303R ■ MOUNTING METHOD NOTE Mounting was evaluated with the following profiles in our company, so there was no problem. However, confirm mounting by the condition of your company beforehand. Mounting: Twice soldering is allowed. ■ INFRARED REFLOW SOLDERING METHOD Recommended reflow soldering procedure f 260°C e 230°C 220°C d 180°C 150°C a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 220°C or higher time e : 230°C or higher time f : Peak temperature : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : Shorter than 60s : Shorter than 40s g : Temperature ramping rate : 1 to 6°C /s : Lower than 260°C The temperature of the surface of mold package Room Temp. a b c g (NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp Regarding temperature profile, please refer to those of reflow furnace. In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored mold resin. Therefore, please avoid from direct exposure to mold resin. (NOTE2) Other method Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply. (NOTE3) The resin gets softened right after soldering, so, the following care has to be taken Not to contact the lens surface to anything. Not to dip the device into water or any solvents. ■ FLOW SOLDERING METHOD Flow soldering is not possible. ■ IRON SOLDERING METHOD Iron soldering is not possible. 29-Jul-13 -7- NJL5303R ■ CLEANING Avid washing the device after soldering by reflow method. ■ IC STORAGE CONDITIONS AND ITS DURATION (1) Temperature and humidity ranges Pack Sealing Temperature: Humidity: Pack Opening Temperature: Humidity: 5 to 40 [°C] 40 to 80 [%] 5 to 30 [°C] 40 to 70 [%] After opening the bag, solder products within 48h. Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge. Store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) When baking, place the reel vertically to avoid load to the side. (3) Do not store the devices in corrosive-gas atmosphere. (4) Do not store the devices in a dusty place. (5) Do not expose the devices to direct rays of the sun. (6) Do not allow external forces or loads to be applied to IC’s. (7) BE careful because affixed label on the reel might be peeled off when baking. ■ BAKING In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape) Baking method: Ta=60°C, 48 to 72h, Three times baking is allowed ■ STORAGE DURATION Within a year after delivering this device. For the products stored longer than a year, confirm their terminals and solderability before they are used. ■ APPLICATION NOTES (1) Attention in handling Treat not to touch the light receiving and light emitting part. Avoid to adhering the dust and any other foreign materials on the light receiving and light emitting part when using. Never apply reverse voltage (VEC) of over 6V to the photo transistor when measuring the characteristics or adjusting the system. If applied, it causes to lower the sensitivity. When LED has operated by voltage, it should be connected the resistor of current adjustment. Avoid to applying direct voltage to LED, because there is possibility that LED is destroyed. When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. (2) Attention in designing Avoid the entering ambient light into light receiving part for avoid the malfunction by ambient light. Furthermore, there is possibility of malfunction when there are the other mounted parts by near this product peripheral. There will be changing characteristics by detection object. Refer to this datasheet and evaluate by actual detection object. When LED has been applied continuous power on long period of time, the output current is dropped. If it uses by always applying power to LED, have to consider the circuit designing of including output current decrease. 29-Jul-13 -8- NJL5303R ■ PACKING SPECIFICATION PACKING DIMENTIONS UNIT : mm Drawing direction Insert direction D0 P0 T0 W0 B (TE1) W1 F E P2 P1 A T1 D1 SYMBOL DIMENSION REMARKS A B D0 2.15 ±0.10 2.85 ±0.10 +0.1 1.50 - 0 BOTTOM DIMENSION D1 E F P0 P1 P2 T0 T1 W0 W1 1.00 1.75 3.50 4.00 4.00 2.00 0.25 1.05 8.00 5.40 BOTTOM DIMENSION +0.2 -0 ±0.10 ±0.05 ±0.10 ±0.10 ±0.05 ±0.10 ±0.10 ±0.10 ±0.10 THICKNESS 0.1MAX * Carrier tape material : Polycarbonate(antistatic) Cover tape material : Polyester(antistatic) ■ Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. ■ Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start rolling : Carrier tape open space more than 20 Pieces. 2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a damp proof bag with silica gel. SYMBOL E A B D C A B C D E W0 W1 DIMENSION φ180 φ60 φ13 φ21 2.0 9.5 13.1 ±1.0 ±1.0 ±0.2 ±0.8 ±0.5 ±1.0 ±1.0 W0 W1 [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. 29-Jul-13 -9-