Datasheet - Pixart Imaging Inc.

PixArt Imaging Inc.
PAC7352
USB 2.0 VGA Camera SoC
PAC7352 USB 2.0 VGA Camera SoC
General Description
The USB 2.0 VGA PC Camera SoC is a highly integrated and cost-effective solution for USB 2.0 PCCamera based applications. It is fully compliant with USB Video Class 1.0.
UVC defined image processing functions are supported by ISP engine. The USB 2.0 VGA PC Camera
SoC integrates partial color processing function, integrates regulators, noise reduction, and outputs
YUV VGA (640x480) resolution.
System Features
Key Specification
z Power consumption: < 70 mA
z 3.3V power input, on-chip 3.3V, 2.8V, and 1.8V
regulator for I/O, USB, sensor, and core logic.
z Built-in oscillator, external crystal is not needed.
z 5 GPIO, including KEY and LED
z Flash/EEPROM Serial Peripheral Interface (SPI)
Compatible
USB Features
z USB 2.0 and USB video class 1.0 compliance.
z 3 Endpoints: CONTROL, Interrupt IN, and
Isochronous IN
Micro Controller Features
z Built-in micro controller with 1K bytes SRAM
data memory
z 24K bytes mask ROM and 4K bytes SRAM for
program memory
z Software controlled connection to USB bus for
re-enumeration and soft reset.
z Firmware is upgradeable from PC via USB
connection
3.3V ± 10%
Supply Voltage
Resolution
Up to 640 (H) x 480 (V)
Frame Rate
Up to 30 fps
Power
consumption
< 70 mA
Optical format
1/9” Lens
2.5 um
Pixel Size
21〫
Chief Ray Angle
Sensitivity
1720 mV/lux*sec
Color filter
RGB Bayer Pattern
Scan Mode
Progressive
S/N Ratio
37 dB
Dynamic range
73 dB
0.4 LSB
Power noise
(8Bits RAW, 16x Gain)
Ordering Information
Part number
Package Type
Package Size(mm)
PAC7352LT
29-ball CSP
3.2 x 2.9
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
1
V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
USB 2.0 VGA Camera SoC
1. Pin Description
Pin No. Category
Name
Type
Description
A1
USB PHY
RREF
IN
Reference for USB
A2
USB PHY
DP
IO
USB D+
A3
USB PHY
DM
IO
USB D-
A4
USB PHY
VDD18_PHY
A5
Power
VSSD
A6
Power
VDDIO
B1
Power
VDD18_O
POWER-OUT
B2
Power
GND_PHY
GND
B3
USB PHY
VDD33_HSRT
B4
SPI
SPI_CSB
OUT
B5
Power
VDD18K
POWER-IN
B6
SPI
SPI_SCK
OUT
C1
Power
VDD28_O
POWER-OUT
C2
Power
VDD33A
POWER-IN
C4
SPI
SPI_SO
C5
GPIO
GIPO6/LED
C6
SPI
SPI_SI
D1
Power
DVDD28/AVDD28
D2
Reserved
TESTMD
IN
reserved for test
D3
Reserved
REG_SDA
IN/OUT
reserved for test
D4
GPIO
GPIO2
IO
General purpose IO
D5
GPIO
GPIO0
IO
General purpose IO
D6
GPIO
GPIO5/KEY
E1
Power
VDDAY_O/VDDAY_I
E2
Power
VSSA/VSSAY
E3
Reserved
OSCMD
IN
reserved for test
E4
Reserved
REG_SCL
IN
reserved for test
E5
Reserved
VPP
IN
reserved for test
E6
GPIO
GPIO1
IO
General purpose IO
POWER-IN
GND
POWER-IN
POWER-IN
OUT
IO/OUT
IN
POWER-IN
IO/IN
1.8V digital power
Ground
I/O power
1.8V power output
Ground
Analog power for USB transceiver
SPI chip select
1.8V digital power
SPI clock
2.8V power output
3.3V input from VBUS
SPI data output
General purpose IO / LED indicator
SPI data input
2.8V input from VDD28_O
General purpose IO / snapshot; active low
POWER-IN/OUT Power for internal use
GND
Ground
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
USB 2.0 VGA Camera SoC
2. Electrical Characteristics
2.1
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings shown below invalidates all AC and DC electrical
specifications and may result in permanent device damage.
Symbol
Parameter
Min
Max
Unit
TSTG
Ambient storage temperature
-25
125
°C
VDD33A
DC supply voltage from USB
-0.3
3.6
V
VDDIO
IO voltage
-0.3
3.6
V
VDD18K
Digital core input voltage
-0.3
1.9
V
-
2
kV
ESD
2.2
ESD Rating, Human Body
model
Notes
Operating Condition
Symbol
TA
Parameter
Typ.
Max
Unit
0
25
50
°C
3.0
3.3
3.6
V
-
3.3
-
V
Operating temperature
VDD33A
DC supply voltage from USB
VDDIO
DC supply for GPIO
2.3
Min
Notes
DC Electrical Characteristics (TA = 25°C, VBUS = 3.3V, VDDIO = 3.3V)
Symbol
Parameter
Min.
Typ.
Max.
Unit
Operating Current
-
65
70
mA
Power Down current
-
310
400
uA
Notes
Type: Power
IDD
IPWDN
VGA 30 fps
Type: IN & I/O, Reset
VIH
Input voltage HIGH
VDDIO x 0.6
-
-
V
VIL
Input voltage LOW
-0.3
-
VDDIO x 0.3
V
Type: OUT & I/O
VOH
Output voltage HIGH
2.4
-
-
V
IOH = 8mA
VOL
Output voltage LOW
-
-
0.4
V
IOL = 8mA
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
3
V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
USB 2.0 VGA Camera SoC
3. Package Handling Information
3.1
Product Ordering Information
Product Number:
PAC7352 LT
Lead Free 3D CSP Package
Part Number
3.2
Material List
Items
Process
Material
1
Substrate Material
Silicon substrate
2
Cover Material
Solder Mask
3
Die Attach
Epoxy
4
Trace
Aluminum/ Ni/ Au
5
Sensor Cover
Glass
6
Marking
Laser
7
Lead Finish
Solder Ball
Sn/Ag/Cu
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
3.3
USB 2.0 VGA Camera SoC
Package Outline Dimension
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
5
V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
3.4
USB 2.0 VGA Camera SoC
Ball Matrix Table
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
3.5
USB 2.0 VGA Camera SoC
Recommended Layout PCB
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
3.6
z
USB 2.0 VGA Camera SoC
Packing Information
IC CSP Pin 1 (A-1 pin) orientation is toward the chamfer of chip tray.
Chamfer
Pin A1
IC orientation
z
Stack 10 trays with one cover tray in a bunch.
Stack 10 +1 Chip tray
z
Pack 2 bunches of chip tray into one aluminum laminate moisture proof bag.
Al packing bag
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
3.7
USB 2.0 VGA Camera SoC
Recommended Guideline for PCB Assembly
z
Recommended vender and type for Pb-free solder paste
1.
Almit LFM-48W TM-HP
2.
Senju M705-GRN360-K
z
IR Reflow Soldering Profile:
Temperature profile is the most important control in reflow soldering. It must be fine tuned to
establish a robust process. The typical recommended IR reflow profile is showed in figure 8
below.
IR Reflow Profile
Reflow Profile :
1. Average Ramp-up Rate (30°C to preheat zone): 1.5~ 2.5 Degree C/ Sec
2. Preheat zone:
2.1
Temp ramp from 170~ 200 degree C
2.2
Exposure time: 90 +/- 30 sec
3. Melting zone:
3.1
Melting area temp > 220 degree C for at least 30 ~ 50 sec
3.2
Peak temperature : 245 degree C.
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
3.8
USB 2.0 VGA Camera SoC
Handling precaution for the prevention of ESD
Explained below are procedures that must be taken in fabrication to prevent the
electrostatic destruction of semiconductor devices.
The following basic rules must be obeyed.
1. Equalize potentials of terminals when transporting or storing.
2. Equalize the potentials of the electric device, work table, and operator's body that
may come in contact with the IC's.
3. Prepare an environment that does not generate static electricity.
One method is keeping relative humidity in the work room to about 50%.
Operator
1. The operator should wear wrist straps.
(Must maintain electric contact with bare skin)
2. Wear cotton or antistatic-treated materials clothes and gloves.
3. When a conductive mat will be used, must be ware conductive shoes.
4. Do not touch the IC's leads. Touch the body of IC's when holding.
Equipment and tools
1. Any electrical equipments and tools located on the work table surface must be
isolated from The work table surface, and ground the equipments and tools that are
to be used.
2. Work table surface must be use conductive material or conductive mat.
(Should be ground through a 1MΩ resistor)
Transporting, storing and packing
1. Use conductive IC's tray, and conductive or shielding bag to store IC's.
Soldering operation
1. Use a soldering iron with a grounding wire.
2. When perform manual soldering operation, the operator should wear wrist straps.
3. Do not use the desoldering pump when removing the IC's from the PCB board. Use
a solder-wick or equivalent.
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
USB 2.0 VGA Camera SoC
4. Reference Application Circuit
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PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
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V1.0 Feb. 2012
PixArt Imaging Inc.
PAC7352
USB 2.0 VGA Camera SoC
5. Revision History
Revision
V0.10
V0.90
V1.0
Comments
Preliminary version
Update “Key Specification”
Update section of “Package Handling Information”
Release to ECN. No content changes.
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: fae_service@PixArt.com.tw
Issue Date
Nov. 10, 2011
Feb. 10, 2012
Feb. 14, 2012
12
V1.0 Feb. 2012