PixArt Imaging Inc. PAC7352 USB 2.0 VGA Camera SoC PAC7352 USB 2.0 VGA Camera SoC General Description The USB 2.0 VGA PC Camera SoC is a highly integrated and cost-effective solution for USB 2.0 PCCamera based applications. It is fully compliant with USB Video Class 1.0. UVC defined image processing functions are supported by ISP engine. The USB 2.0 VGA PC Camera SoC integrates partial color processing function, integrates regulators, noise reduction, and outputs YUV VGA (640x480) resolution. System Features Key Specification z Power consumption: < 70 mA z 3.3V power input, on-chip 3.3V, 2.8V, and 1.8V regulator for I/O, USB, sensor, and core logic. z Built-in oscillator, external crystal is not needed. z 5 GPIO, including KEY and LED z Flash/EEPROM Serial Peripheral Interface (SPI) Compatible USB Features z USB 2.0 and USB video class 1.0 compliance. z 3 Endpoints: CONTROL, Interrupt IN, and Isochronous IN Micro Controller Features z Built-in micro controller with 1K bytes SRAM data memory z 24K bytes mask ROM and 4K bytes SRAM for program memory z Software controlled connection to USB bus for re-enumeration and soft reset. z Firmware is upgradeable from PC via USB connection 3.3V ± 10% Supply Voltage Resolution Up to 640 (H) x 480 (V) Frame Rate Up to 30 fps Power consumption < 70 mA Optical format 1/9” Lens 2.5 um Pixel Size 21〫 Chief Ray Angle Sensitivity 1720 mV/lux*sec Color filter RGB Bayer Pattern Scan Mode Progressive S/N Ratio 37 dB Dynamic range 73 dB 0.4 LSB Power noise (8Bits RAW, 16x Gain) Ordering Information Part number Package Type Package Size(mm) PAC7352LT 29-ball CSP 3.2 x 2.9 All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 1 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 USB 2.0 VGA Camera SoC 1. Pin Description Pin No. Category Name Type Description A1 USB PHY RREF IN Reference for USB A2 USB PHY DP IO USB D+ A3 USB PHY DM IO USB D- A4 USB PHY VDD18_PHY A5 Power VSSD A6 Power VDDIO B1 Power VDD18_O POWER-OUT B2 Power GND_PHY GND B3 USB PHY VDD33_HSRT B4 SPI SPI_CSB OUT B5 Power VDD18K POWER-IN B6 SPI SPI_SCK OUT C1 Power VDD28_O POWER-OUT C2 Power VDD33A POWER-IN C4 SPI SPI_SO C5 GPIO GIPO6/LED C6 SPI SPI_SI D1 Power DVDD28/AVDD28 D2 Reserved TESTMD IN reserved for test D3 Reserved REG_SDA IN/OUT reserved for test D4 GPIO GPIO2 IO General purpose IO D5 GPIO GPIO0 IO General purpose IO D6 GPIO GPIO5/KEY E1 Power VDDAY_O/VDDAY_I E2 Power VSSA/VSSAY E3 Reserved OSCMD IN reserved for test E4 Reserved REG_SCL IN reserved for test E5 Reserved VPP IN reserved for test E6 GPIO GPIO1 IO General purpose IO POWER-IN GND POWER-IN POWER-IN OUT IO/OUT IN POWER-IN IO/IN 1.8V digital power Ground I/O power 1.8V power output Ground Analog power for USB transceiver SPI chip select 1.8V digital power SPI clock 2.8V power output 3.3V input from VBUS SPI data output General purpose IO / LED indicator SPI data input 2.8V input from VDD28_O General purpose IO / snapshot; active low POWER-IN/OUT Power for internal use GND Ground All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 2 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 USB 2.0 VGA Camera SoC 2. Electrical Characteristics 2.1 Absolute Maximum Ratings Exceeding the Absolute Maximum Ratings shown below invalidates all AC and DC electrical specifications and may result in permanent device damage. Symbol Parameter Min Max Unit TSTG Ambient storage temperature -25 125 °C VDD33A DC supply voltage from USB -0.3 3.6 V VDDIO IO voltage -0.3 3.6 V VDD18K Digital core input voltage -0.3 1.9 V - 2 kV ESD 2.2 ESD Rating, Human Body model Notes Operating Condition Symbol TA Parameter Typ. Max Unit 0 25 50 °C 3.0 3.3 3.6 V - 3.3 - V Operating temperature VDD33A DC supply voltage from USB VDDIO DC supply for GPIO 2.3 Min Notes DC Electrical Characteristics (TA = 25°C, VBUS = 3.3V, VDDIO = 3.3V) Symbol Parameter Min. Typ. Max. Unit Operating Current - 65 70 mA Power Down current - 310 400 uA Notes Type: Power IDD IPWDN VGA 30 fps Type: IN & I/O, Reset VIH Input voltage HIGH VDDIO x 0.6 - - V VIL Input voltage LOW -0.3 - VDDIO x 0.3 V Type: OUT & I/O VOH Output voltage HIGH 2.4 - - V IOH = 8mA VOL Output voltage LOW - - 0.4 V IOL = 8mA All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 3 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 USB 2.0 VGA Camera SoC 3. Package Handling Information 3.1 Product Ordering Information Product Number: PAC7352 LT Lead Free 3D CSP Package Part Number 3.2 Material List Items Process Material 1 Substrate Material Silicon substrate 2 Cover Material Solder Mask 3 Die Attach Epoxy 4 Trace Aluminum/ Ni/ Au 5 Sensor Cover Glass 6 Marking Laser 7 Lead Finish Solder Ball Sn/Ag/Cu All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 4 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 3.3 USB 2.0 VGA Camera SoC Package Outline Dimension All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 5 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 3.4 USB 2.0 VGA Camera SoC Ball Matrix Table All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 6 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 3.5 USB 2.0 VGA Camera SoC Recommended Layout PCB All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 7 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 3.6 z USB 2.0 VGA Camera SoC Packing Information IC CSP Pin 1 (A-1 pin) orientation is toward the chamfer of chip tray. Chamfer Pin A1 IC orientation z Stack 10 trays with one cover tray in a bunch. Stack 10 +1 Chip tray z Pack 2 bunches of chip tray into one aluminum laminate moisture proof bag. Al packing bag All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 8 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 3.7 USB 2.0 VGA Camera SoC Recommended Guideline for PCB Assembly z Recommended vender and type for Pb-free solder paste 1. Almit LFM-48W TM-HP 2. Senju M705-GRN360-K z IR Reflow Soldering Profile: Temperature profile is the most important control in reflow soldering. It must be fine tuned to establish a robust process. The typical recommended IR reflow profile is showed in figure 8 below. IR Reflow Profile Reflow Profile : 1. Average Ramp-up Rate (30°C to preheat zone): 1.5~ 2.5 Degree C/ Sec 2. Preheat zone: 2.1 Temp ramp from 170~ 200 degree C 2.2 Exposure time: 90 +/- 30 sec 3. Melting zone: 3.1 Melting area temp > 220 degree C for at least 30 ~ 50 sec 3.2 Peak temperature : 245 degree C. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 9 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 3.8 USB 2.0 VGA Camera SoC Handling precaution for the prevention of ESD Explained below are procedures that must be taken in fabrication to prevent the electrostatic destruction of semiconductor devices. The following basic rules must be obeyed. 1. Equalize potentials of terminals when transporting or storing. 2. Equalize the potentials of the electric device, work table, and operator's body that may come in contact with the IC's. 3. Prepare an environment that does not generate static electricity. One method is keeping relative humidity in the work room to about 50%. Operator 1. The operator should wear wrist straps. (Must maintain electric contact with bare skin) 2. Wear cotton or antistatic-treated materials clothes and gloves. 3. When a conductive mat will be used, must be ware conductive shoes. 4. Do not touch the IC's leads. Touch the body of IC's when holding. Equipment and tools 1. Any electrical equipments and tools located on the work table surface must be isolated from The work table surface, and ground the equipments and tools that are to be used. 2. Work table surface must be use conductive material or conductive mat. (Should be ground through a 1MΩ resistor) Transporting, storing and packing 1. Use conductive IC's tray, and conductive or shielding bag to store IC's. Soldering operation 1. Use a soldering iron with a grounding wire. 2. When perform manual soldering operation, the operator should wear wrist straps. 3. Do not use the desoldering pump when removing the IC's from the PCB board. Use a solder-wick or equivalent. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 10 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 USB 2.0 VGA Camera SoC 4. Reference Application Circuit All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] 11 V1.0 Feb. 2012 PixArt Imaging Inc. PAC7352 USB 2.0 VGA Camera SoC 5. Revision History Revision V0.10 V0.90 V1.0 Comments Preliminary version Update “Key Specification” Update section of “Package Handling Information” Release to ECN. No content changes. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: [email protected] Issue Date Nov. 10, 2011 Feb. 10, 2012 Feb. 14, 2012 12 V1.0 Feb. 2012