0003 L-204ED-E610 - Para Light Electronics Co. Ltd.

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PARA LIGHT DCC
PARA LIGHT DCC
南 京 华 鼎 电 子 有 限 公 司
中 国 南 京 市 江 宁 区 汤 山 镇
Tel: 025-84107685
Fax: 025-84107684
E-mail: [email protected]
DATA SHEET
PART NO. :
REV :
L-204ED-E610
A/0
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-32-08-0003
DCC : ____________
DATE : 2008-01-15
Page : 1
HD-R/RD012
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PARA LIGHT DCC
1.8 mm
DIA TOWER
TYPE
LED
L-204ED-E610
LAMP
REV:A / 0
PACKAGE DIMENSIONS
ITEM
MATERIALS
RESIN
Epoxy Resin
LEAD FRAME
Sn Plating iron Alloy
Note:
1.All Dimensions are in millimeters.
2.Tolerance is ±0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
4.Lead spacing is measured where
the leads emerge from the package.
5.Specification are subject to change
without notice
6.The lamps have sharp and hard
points that may injure human eyes or
fingers etc., so please pay enough
care in the handling.
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
Page : 2
HD-R/RD013
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PARA LIGHT DCC
1.8 mm
DIA TOWER
TYPE
LED
L-204ED-E610
LAMP
REV:A / 0
FEATURES
* 1.8 mm DIA TOWER TYPE LED LAMP.
* LOW POWER CONSUMPTION.
* I.C. COMPATIBLE.
* LONG LIFE SOLID STATE RELIABILITY
* Pb FREE PRODUCTS
CHIP MATERIALS
* Dice Material : GaAsP/GaP
* Light Color :AMBER
* Lens Color : AMBER DIFFUSED
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
SYMBOL
PARAMETER
AMBER.
UNIT
PD
Power Dissipation Per Chip
85
mW
VR
Reverse Voltage Per Chip
5
V
IAF
Continuous Forward Current Per Chip
30
mA
IPF
Peak Forward Current Per Chip (Duty-0.1,1KHz)
120
mA
-
Derating Linear From 25°C Per Chip
0.40
mA/°C
Topr
Operating Temperature Range
-25°C to 85°C
Tstg
Storage Temperature Range
-25°C to 85°C
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
PARAMETER
TEST CONDITION
MIN.
TYP. MAX. UNIT
VF
Forward Voltage
IF = 20mA
IR
Reverse Current
VR = 5V
λD
Dominant Wavelength
IF = 20mA
605
nm
∆λ
Spectral Line Half-Width
IF = 20mA
35
nm
2θ1/2
Half Intensity Angle
IF = 20mA
60
deg
IV
Luminous Intensity
IF = 20mA
25
mcd
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
2.1
2.8
V
100
µA
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PARA LIGHT DCC
1.8 mm
DIA TOWER
TYPE
L-204ED-E610
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
LED
LAMP
REV:A / 0
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PARA LIGHT DCC
1.8 mm
DIA TOWER
TYPE
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LED
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Label Explanation
华 鼎 电 子 有 限 公 司
版次
XXXXXXXXXX
型 号:
客户编号
XXXXXXXX
批 号: XXXXXXXXXXXX
数 量:
日 期:
XXXX PCS
XXXX.XX.XX
PARA NO. : Refer to p13
LOT NO. : E L L 4
A
B
C
D
7
0009
E
F
A---E: For series number
B---L: Local
F: Foreign
C---L: LAMP
D---Year
E---Month
F---SPEC.
BIN : Bin Code List
Luminous Intensity(IV), Unit:[email protected]
Bin Code
Min
Max
H
10.8
15.1
I
15.1
21.1
J
21.1
29.50
K
29.5
41.3
L
41.3
57.8
N’W : Net Weight
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
Page : 5
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PARA LIGHT DCC
1.8 mm
DIA TOWER
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L-204ED-E610
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ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
DIP
SOLDERING
base of the package
y Using soldering flux,” RESIN FLUX”
is recommended.
yAttached data of temperatuare cure
for your reference
Bath temperature: 240℃
Immersion time: with 3 sec, 1 time
y During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 300℃ or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
s
e
i
r
w
d
a
e
L
l
e
n
a
P
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
s
e
i
r
w
d
a
e
L
te
hc
gn
ia
lr
sa
e
al
c
e
v
a
e
L
(Fig.2)
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3
seconds.
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
Page : 6
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PARA LIGHT DCC
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L-204ED-E610
LED
LAMP
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3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
d
r
a
o
b
C
P
(Fig.3
)
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
y STORAGE
1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA
and the storage life limits are 3 months .
2) PARA LED lead frames are comprised of a stannum plated iron alloy. The silver surface may be
affected by environments which contain corrosive gases and so on. Please avoid conditions
which may cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may
cause difficulty during soldering operations. It is recommended that the LEDs be used as soon
as possible.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
Page : 7
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DIA TOWER
TYPE
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LED
LAMP
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yLED MOUNTING METHOD
3) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
4) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
DRAWING NO. : DS-32-08-0003
Fig.6
DATE : 2008-01-15
Page : 8
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yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
m
m
2
7
.
g
i
F
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
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2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK!
1Kg
Fig.10
y HEAT GENERATION
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when making the system design. The coefficient of temperature increase
per input electric power is affected by the thermal resistance of the circuit board and density of
LED placement on the board, as well as other components. It is necessary to avoid intense
heat generation and operate within the maximum ratings given in this specification.
The operating current should be decided after considering the ambient maximum temperature of
LEDs.
yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
⊙
Chlorothene
╳
resin body differ depending on such factors
Isopropyl Alcohol
⊙
as the oscillator output, size of the PC board
Thinner
╳
Acetone
╳
Trichloroethylene
╳
⊙--Usable
╳--Do not use.
DRAWING NO. : DS-32-08-0003
NOTE: Influences of ultrasonic cleaning of the LED
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
DATE : 2008-01-15
Page :10
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yOTHERS
1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
2) Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had
LEDs incorporated into it.
3) The LEDs described in this brochure are intended to be used for ordinary electronic equipment
(such as office equipment, communications equipment, measurement instruments and
household appliances). Consult PARA’s sales staff in advance for information on the
applications in which exceptional quality and reliability are required , particularly when the
failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes,
aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control
equipment, life support systems and safety devices).
4) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior
written consent from PARA. When defective LEDs are found, the User shall inform PARA
directly before disassembling or analysis.
5) The formal specifications must be exchanged and signed by both parties before large volume
purchase begins.
6) The appearance and specifications of the product may be modified for improvement without
notice.
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
Page :11
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LED Lamps:
DRAWING NO. : DS-32-08-0003
DATE : 2008-01-15
Page :12