0132 L-513VG3C B3 - Para Light Electronics Co. Ltd.

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PARA LIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: [email protected]
DATA SHEET
PART NO. :
REV :
PARA LIGHT ENGINEERING:
CUSTOMER'S APPROVAL:
DRAWING NO. : DS-35-02-0132
L513VG3C
B/3
DCC:
DATE : 2009-04-10
Page : 1
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L513VG3C
REV:B / 3
PACKAGE DIMENSIONS
ITEM
MATERIALS
RESIN
Epoxy Resin
LEAD FRAME
Sn Plating iron Alloy
Note:
1.All Dimensions are in millimeters.
2.Tolerance is ±0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
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REV:B / 3
FEATURES
* High-brightness
* High reliability
* Low-voltage characteristics
* Narrow view angle
* Pb FREE Products
* RoHS Compliant
CHIP MATERIALS
* Dice Material : GaAlInP/GaAs
* Light Color : ULTRA GREEN
* Lens Color : WATER CLEAR
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
SYMBOL
PARAMETER
ULTRA
GREEN
UNIT
PD
Power Dissipation Per Chip
85
mW
VR
Reverse Voltage Per Chip
5
V
IAF
Continuous Forward Current Per Chip
30
mA
IPF
Peak Forward Current Per Chip (Duty-0.1,1KHz)
120
mA
-
Derating Linear From 25°C Per Chip
0.40
mA/°C
Topr
Operating Temperature Range
-25°C to 85°C
Tstg
Storage Temperature Range
-25°C to 85°C
IFP Condition : Pulse Width≤10msec, 10% duty cycle
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
PARAMETER
TEST CONDITION
MIN.
1.8
TYP. MAX. UNIT
VF
Forward Voltage
IF = 20mA
IR
Reverse Current
VR = 5V
λD
Dominant Wavelength
IF = 20mA
∆λ
Spectral Line Half-Width
IF = 20mA
30
nm
2θ1/2
Half Intensity Angle
IF = 20mA
15
deg
IV
Luminous Intensity
IF = 20mA
DRAWING NO. : DS-35-02-0132
564
222
DATE : 2009-04-10
2.0
570
2.8
V
100
µA
574
nm
500 1193.8 mcd
Page : 3
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█
DRAWING NO. : DS-35-02-0132
TJ= 25℃
DATE : 2009-04-10
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Label Explanation
光鼎电子股分有限公司
PART NO. : L513VG3C
Refer to page 12
LOT
NO. : E
L
L
4
7
0009
A
B
C
D
E
F
A---E: For Serial number
B---L: Local
F: Foreign
C---L: LAMP
D---Year
E---Month
F---Serial number
BIN : Bin Code List
Luminous Intensity(IV), Unit:[email protected]
Bin Code
Min
Max
Q
222
310.8
R
310.8
435.1
S
435.1
609.1
T
609.1
852.7
U
852.7
1193.8
Tolerance of each bin are±15%
N’W : Net Weight
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DATE : 2009-04-10
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ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
DIP
SOLDERING
Bath temperature: 260℃
Immersion time: within 5 sec, 1 time
base of the package
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 300℃ or lower (To prevent heat from being
IRON
Soldering time: within 3 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering)
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
s
e
i
r
w
d
a
e
L
l
e
n
a
P
(Fig.1)
s
e
i
r
w
d
a
e
L
2) When soldering wire to the lead, work with a jig (See Fig.2) to avoid stressing the package.
te
hc
gn
ia
lr
sa
e
al
c
e
v
a
e
L
(Fig.2)
Regarding tinning the leads, compound made of tin ,copper and sliver is proposed with the
temperature of 260℃. The proportion of the alloyed solution is 95.5% tin, 3.5 % copper, 0.5%
silver. The time of tinning is 3 seconds.
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
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3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid stressing the leads (See Fig.3).
d
r
a
o
b
C
P
(Fig.3
)
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable: select a
best-suited method that assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
y STORAGE
1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA
and the storage life limit is 1 year .
2) PARA LED lead frames are comprised of a tin plated iron alloy. The surface may be affected by
environments which contain corrosive gases and so on. Please avoid conditions which may
cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause
difficulty during soldering operations. It is recommended that the LEDs be used as soon as
possible.
3) Please avoid rapid changes in ambient temperature, especially, in high humidity environments
where condensation can occur.
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
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y STATIC ELECTRICITY
1) Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band and an anti-electrostatic glove be used when handling the
LEDs.
2) All devices, equipment and machinery must be properly grounded. It is recommended that
measures be taken against surge voltage to the LED mounting equipment.
3) When inspecting the final products in which LEDs were assembled, it is recommended to
check whether the assembled LEDs are damaged by static electricity. To find static-damaged
LEDs, perform a light-on test or a VF test at a lower current (below 1mA is recommended).
4) Damaged LEDs will show some unusual characteristics such as the leakage current
remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low
current.
Criteria : ( VF>2.0V at IF=0.5mA )
yLED MOUNTING METHOD
1) When mounting the LED to a housing, as shown on Fig.4, ensure that the mounting holes on
the PC board match the pitch of the leads correctly. Tolerance of dimensions of the
respective components including the LEDs should be taken into account especially when
designing the housing, PC board, etc. to prevent pitch misalignment between the leads and
holes on PCB, the diameter of the holes should be slightly larger than the size of the lead.
Alternatively, the shape of the holes could be made oval. (See Fig.4)
case
pc board
Fig.4
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
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2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of plastic (Fig.6) to position the
LEDs.
Tube
Stand-off
Fig.5
Fig.6
yFORMING LEAD
1) The lead should be bent at least 2mm away from the package. Bending should be performed
with base fixed to a jig to pliers (Fig.7)
m
m
2
7
.
g
i
F
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the holes on PCB, so that stress
against the LED is prevented. (Fig.8)
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
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yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK!
1Kg
Fig.10
y HEAT MANAGEMANT
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when designing the system. The temperature increase is affected by
the thermal resistance of the circuit board and density of LED placement on the board, as
well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
2) The operating current (IF) should be decided after considering the ambient maximum
temperature of LEDs.
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yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be used.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
⊙
Chlorothene
╳
resin body differ depending on factors such
Isopropyl Alcohol
⊙
as the oscillator output, size of the PC board
Thinner
╳
Acetone
╳
Trichloroethylene
╳
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed by confirming an ultrasonic
cleaning trial run.
⊙--Usable
╳--Do not use.
NOTE: Influences of ultrasonic cleaning of the LED
yOTHER CONSIDERTIONS
1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
2) The LEDs described in this data sheet are intended to be used for ordinary electronic
equipment (such as office equipment, communications equipment, measurement
instruments and household appliances). Consult PARA’s sales staff in advance for
information on the applications in which exceptional quality and reliability are required ,
particularly when the failure or malfunction of the LEDs may directly jeopardize life or health
(such as for airplanes, spacecraft, automobiles, traffic control equipment etc).
3) The formal specifications must be exchanged and signed by both parties before large volume
purchase begins.
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
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LED Lamps: Part Number Rules
L
5
1
3
X
D
Special Operati on & Other
D: Color Diffused
T: Color Transparent
Lens Color
C: Water Clear
W: White Diffused
G: Gap Green
E: GaAs/Gap Orange & Hi-effi-Red
H: Gap Red
SR,LR,UR: GaAlAs Red
Y: GaAsP/Gap Yellow
VG3:GaAllnp Green
HUR: GaAllnP Red
LW,VE: GaAllnP Orange
LY,UY,VY: GaAllnP Yellow
SPG4,LPG4: InGaN Green
UB5,VB5: InGaN Blue
UW5 VW5,UWT:lnGaN White
1: 0.8" Length with Stand-off
2: 0.5" Length Standard
3: 1"Length with Large Reflector
4: 1"Length with Small Reflector
5: 1"WITH 3 Leads for Dual Color
7: 1"WITH 2 Leads for Dual Color
9: 1"WITH 3 Leads for Dual Color
Package Type(Style)
DRAWING NO. : DS-35-02-0132
DATE : 2009-04-10
Page :12