A-564SR-L6 - Para Light Electronics Co. Ltd.

PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: para@para.com.tw
DATA SHEET
PART NO. : A-564SR-L6
REV :
A/0
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-14-05-0044-1
DCC : ____________
DATE : 2005-12-02
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PACKAGE DIMENSIONS
NOTES : 1. All dimensions are in millimeters. (inches)
2. Tolerance is ± 0.25(0.010") unless otherwise specified.
3. We would like to offer you samples and mass production after
you confirmed the DS and signed to return us
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FEATURES
14.20mm (0.56inch ) DIGIT HEIGHT
EXCELLENT CHARACTER APPEARANCE
COMMON ANODE
I.C. COMPATIBLE
LOW POWER CONSUMPTION
Raw Material : GaAlAs/GaAs
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
SYMBOL
PARAMETER
SUPER RED
UNIT
PAD
Power Dissipation Per Segment
60
mW
VR
Reverse Voltage Per Segment
5
V
IAF
Continuous Forward Current Per Segment
20
mA
IPF
Peak Forward Current Per Segment (Duty-0.1,1KHz)
100
mA
-
Derating Linear From 25°C Per Segment
0.33
mA/°C
Topr
Operating Temperature Range
-35°C to 85°C
Tstg
Storage Temperature Range
-35°C to 85°C
Solder Temperature 1/16 inch Below Seating Plane for 5 Seconds at 260°C
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
PARAMETER
TEST CONDITION
MIN. TYP. MAX. UNIT
VF
Forward Voltage , Per Segment
IF = 20mA
IR
Reverse Current , Per Segment
VR = 5V
λP
Peak Emission Wavelength
IF = 20mA
660
nm
λD
Dominant Wavelength
IF = 20mA
643
nm
∆λ
Spectral Line Half-Width
IF = 20mA
20
nm
IV
Luminous Intensity Per Segment
IF = 10mA
21.0
mcd
1.8
8.4
2.2
V
100
µA
BIN CODE ( IF = 10mA )
Dice Bin
IV(mcd)
H
8.40-12.28
I
J
K
L
12.29-17.82 17.83-23.31 23.32-31.44 31.45-42.82
M
42.83-54.18
TOLERANCE IS: 3%
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PARA
LIGHT
Q A PASS
PARA
LIGHT
Q A PASS
30 TUBE/BOX
4 BOX/CTN
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Experiment Item:
Item
Test Condition
Display
OPERATION LIFE
HIGH
TEMPERATURE
HIGH HUMIDITY
STORAGE
Ta: 25 ± 5℃
IF:10~20 mA PER SEGMENT
TEST TIME:
168HRS(-24HRS,+24HRS)
500HRS(-24HRS,+24HRS)
1000HRS(-24HRS,+72HRS)
Reference Standard
MIL-STD-750:1026
MIL-STD-883:1005
JIS C 7021:B-1
Ta: 65℃ ± 5℃
RH: 90〜95%RH
TEST TIME:240HRS±2HRS
MIL-STD-202:103B
JIS C 7021 :B-1
TEMPERATURE
CYCLING
85℃〜25℃〜-35℃〜25℃
30min 5min
30min 5min
10CYCLES
(COB:Thot:65℃ Tcold:-25℃)
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021 :A-4
THERMAL SHOCK
85℃ ± 5℃〜-35℃ ± 5℃
10min
10min
10CYCLES
(COB:Thot:65℃ Tcold:-25℃)
MIL-STD-202:107D
MIL-STD-750:1051
MIL-SYD-883:1011
SOLDER
RESISTANCE
SOLDERABILITY
T,sol:250℃ ± 5℃
DWELL TIME:5 ± l sec
T,sol:230℃ ± 5℃
DWELL TIME:5 ± l sec
DRAWING NO. : DS-14-05-0044-1
MIL-STD-202:210A
MIL-STD-750-2031
JIS C 7021:A-1
MIL-STD-202:208D
MIL-STD-750:2026
MIL-STD-883:2003
JIS C 7021 :A-2
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SOLDERING
METHOD
DIP
SOLDERING
SOLDERING CONDITIONS
REMARK
Solder no closer than 2mm from
the base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
Bath temperature: 260 max
Immersion time: within 5 sec
During soldering, take care not to
Soldering iron: 30W or smaller
press the tip of iron against the
SOLDERING
Temperature at tip of iron: 260℃ or lower PIN.
IRON
Soldering time: within 5 sec.
(To prevent heat from being
transferred directly to the PIN.)
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package is
fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
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2) Similarly, when a jig is used to solder the Display to PC board, take care as much as possible to
avoid steering the PIN (See Fig.2).
Fig.2
3) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the Display.
4) PIN cutting after soldering should be performed only after the Display temperature has returned to
normal temperature.
LED MOUNTING METHOD
1) When mounting the Display by using a case, as shown Fig.3, ensure that the mounting holds on
the PC board match the pitch of the PIN correctly-tolerance of dimensions of the respective
components including the Display should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the PIN and board holes, the
diameter of the board holes should be slightly larger than the size of the PIN. Alternatively, the
shape of the holes should be made oval. (See Fig.3)
Fig.3
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2) Use Display with holder made of resin (Fig.4) to position the PIN.
Fig.4
FORMED LEAD
1) The PIN should be bent at a point located at least 2mm away from the package. Bending should
be performed with base fixed means of a jig or pliers (Fig.5)
Fig.5
2) Forming PIN should be carried our prior to soldering and never during or after soldering.
3) Form the PIN to ensure alignment between the PIN and the hole on board, so that stress against
the Display is prevented. (Fig.6)
Fig.6
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LEAD STRENGTH
1) Bend strength
Do not bend the PIN more than twice. (Fig.7)
Fig.7
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.8)
ok!
Fig.8
1Kg
HANDLING PRECAUTIONS
Although rigid against vibration, the Display may damaged or scratched if dropped. So take care
when handling.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the Display surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
SOLVENT
ADAPTABILITY
Freon TE
⊙
Chlorothene
╳
Isopropyl Alcohol
⊙
Thinner
╳
Acetone
╳
Trichloroethylene
╳
⊙--Usable
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╳--Do not use.
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HEAT GENERATION
1) The Display should be stored at 30℃ or less and 70% RH or less after being shipped from PARA
and the storage life limits are 3 months.
2) PARA Display lead frames are comprised of a stannum plated iron alloy. The silver surface may
be affected by environments which contain corrosive gases and so on. Please avoid conditions
which may cause the Display to corrode, tarnish or discolor. This corrosion or discoloration may
cause difficulty during soldering operations. It is recommended that the Display be used as soon
as possible.
3) Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
HEAT GENERATION
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the Display when making the system design. The coefficient of temperature increase
per input electric power is affected by the thermal resistance of the circuit board and density of
Display placement on the board, as well as other components. It is necessary to avoid intense
heat generation and operate within the maximum ratings given in this specification.
2) The operating current should be decided after considering the ambient maximum temperature of
Display .
OTHERS
1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the Display with matrix drive.
2) Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had
Display incorporated into it.
3) The Display described in this brochure are intended to be used for ordinary electronic equipment
(such as office equipment, communications equipment, measurement instruments and household
appliances). Consult PARA’s sales staff in advance for information on the applications in which
exceptional quality and reliability are required , particularly when the failure or malfunction of the
Display may directly jeopardize life or health (such as for airplanes, aerospace, submersible
repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support
systems and safety devices).
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4) User shall not reverse engineer by disassembling or analysis of the Display without having prior
written consent from PARA. When defective Display are found, the User shall inform PARA
directly before disassembling or analysis.
5) The formal specifications must be exchanged and signed by both parties before large volume
purchase begins.
6) The appearance and specifications of the product may be modified for improvement without
notice.
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