data sheet part no.: l-c192lbct rev: b / 4

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PARA LIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: [email protected]
DATA SHEET
PART NO.: L-C192LBCT
REV: B / 4
CUSTOMER’S APPROVAL : _______________
DCC : ____________
DRAWING NO. : DS-75-03-0005
DATE : 2011-07-28
PAGE 1 of 14
PARA-FOR-065
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SURFACE MOUNT DEVICE LED
Part No. : L-C192LBCT
REV:B / 4
z PACKAGE OUTLINE DIMENSIONS
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ± 0.1mm (.004") unless otherwise noted.
z Features
½
½
½
½
½
½
½
½
Top view, wide view angle, single color Chip LED.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Infrared and Wave soldering reflow solder processes.
EIA STD package.
I.C. compatible.
Pb free product.
Meet RoHS Green Product.
DRAWING NO. : DS-75-03-0005
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DATE : 2011-07-28
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SURFACE MOUNT DEVICE LED
Part No. : L-C192LBCT
REV:B / 4
z Chip Materials
½
½
½
Dice Material : InGaN
Light Color : Blue
Lens Color : Water Clear
z Absolute Maximum Ratings(Ta=25℃)
Symbol
Parameter
Rating
Unit
PD
Power Dissipation
100
mW
IPF
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
100
mA
IF
Continuous Forward Current
25
mA
-
De-rating Linear From 25℃
0.25
mA/℃
5
V
150
VR
Reverse Voltage
Note A
ESD
Electrostatic Discharge Threshold(HBM)
Topr
Operating Temperature Range
-40 ~ +85
V
℃
Tstg
Storage Temperature Range
-40 ~ +85
℃
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
z Electro-Optical Characteristics(Ta=25℃)
Parameter
Luminous Intensity
Unit
Test Condition
100.0
mcd
IF=20mA
Symbol
Min.
Typ.
IV
60.0
Max.
Viewing Angle
2θ1/2
130
deg
Note 2
Peak Emission
Wavelength
λp
468
nm
Measurement @Peak
Dominant Wavelength
λd
470
nm
IF=20mA
Spectral Line
Half-Width
Δλ
25
nm
Forward Voltage
VF
3.3
Reverse Current
IR
DRAWING NO. : DS-75-03-0005
PARA-FOR-068
3.6
V
IF = 20mA
100
μA
VR = 5V
DATE : 2011-07-28
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Part No. : L-C192LBCT
REV:B / 4
z Bin Code List
Luminous Intensity(IV), Unit:[email protected]
Forward Voltage(VF), Unit:[email protected]
Bin Code
Min
Max
Bin Code
Min
Max
P
45.0
71.0
K8
2.80
2.95
Q
71.0
112.0
K9
2.95
3.10
R
112.0
180.0
K10
3.10
3.25
K11
3.25
3.40
K12
3.40
3.55
Tolerance of each bin are±15%
Tolerance of each bin are±0.1Volt
Dominant Wavelength (Hue),Unit: [email protected]
Bin Code
Min
Max
AC
465.0
470.0
AD
470.0
475.0
Including±1nm test tolerance
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
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Part No. : L-C192LBCT
REV:B / 4
z Typical Electro-Optical Characteristics Curves
Luminous lntensity(mcd)
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
Relative luminous intensity(%)
Relative Luminous lntensity
Normalized of 20mA
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.4 Relative Luminous Intensity vs.Forward Current
Fig.5 Luminous Intensity vs.Ambient Temperature
0°
Forward Current IF(mA)
50
10°
20°
30°
40
30
25
20
1.0
40°
0.9
50°
0.8
60°
70°
80°
90°
10
0.7
0
0
20
40
60
80
100
0.5 0.3
0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.6 Forward Current Derating Curve
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Fig.7 Relative Intensity vs.Angle
DATE : 2011-07-28
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Part No. : L-C192LBCT
REV: B / 1
z Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P14
IV --- Luminous Intensity Code
VF --- Forward Voltage Code
WD --- Dominant Wavelength Code
LOT NO: E L S 6 8 0001
A
B
C
D
E
F
A---E: For series number
B---L: Local
F: Foreign
C---S:SMD
D---Year
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
3000pcs for 150、170、110、155、115 series
4000pcs for 191 series
5000pcs for 192 series
DATE CODE:2006 06 08
G
H
I
G--- Year
H--- Month
I --- Day
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Part No. : L-C192LBCT
REV:B / 4
z Reel Dimensions
Notes:
1. Taping Quantity : 5000pcs
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
●
Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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DATE : 2011-07-28
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Part No. : L-C192LBCT
REV:B / 4
z Package Dimensions Of Tape And Reel
Progressive direction
Cathode
Polarity
Notes:All dimensions are in millimeters.
Label
H:\SMD\SMD\SMD° ü × ° \± ê ? ? .jpg
H:\SMD\SMD\SMD° ü × ° \± ê ? ? .jpg
H:\S
MD\
SMD
\SMD
°
°ü×
\± ê ?
? .jpg
Moisture Resistant Packaging
Reel
Label
Desiccant
Aluminum moistue-proof bag
240
×°
D° ü
D\SM
D\SM
H:\SM
? .jpg
\± ê ?
145
210
255
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
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Part No. : L-C192LBCT
REV:B / 4
z Cleaning
½
½
½
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
z Suggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
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Part No. : L-C192LBCT
●
Suggest Sn/Pb IR Reflow Soldering Profile Condition:
●
Suggest Pb-Free IR Reflow Soldering Profile Condition:
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REV:B / 4
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REV:B / 4
z CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application).Consult PARA’s sales in advance for information on
application in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life
support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be store kept at 5°C to 30°C or less and 85%RH or less.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168
hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
LEDs stored out of their original packaging for more than a week should be baked at 30°C for at 24 hours before
solder assembly.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
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Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60
solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp:150-180℃,120sec.Max.
2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature:260℃,5sec.
4、Reflow Repetition:2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp:350℃ Max.
2、Soldering Iron:30w Max.
3、Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1、Pre-Heat Temp:150℃ Max. 120 Sec. Max.
2、Bath Temp:265℃ Max.
3、Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
*Test Time= 1000HRS
(-24HRS,+72HRS)[email protected]
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90~95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,72H RS)
JIS C 7021:B-12 (1982)
Temperature
Cycling
105±5℃
10mins
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Thermal
Shock
IR-Reflow In-Board, 2 Times
105±5℃
-55℃±5℃
10mins
10mins
100 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)
Operation Life
High Temperature
Endurance Test High Humidity
Storage
High Temperature
Storage
Environmental
Test
Solder
Resistance
Solder ability
-55±5℃
10mins
100 Cycles
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
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Part No. : L-C192LBCT
z PART NO. SYSTEM :
L–C 1 9 2 X C X X - X X X X
REV:B / 4
XXXX : Special specification for
customer
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
TH : IV half binning
TP : Wavelength binning
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
G : Gap 570nm Green
Y : GaAsp 585 nm Yellow
E : GaAsp 620 nm Orange
SR : GaAlAs 634 nm Red
KG : AlInGap 570nm Super Green
KY : AlInGap 590nm Super Yellow
KF : AlInGap 605nm Super Amber
KR : AlInGap 630 nm Super Red
LB : InGaN 470nm Blue
LG : InGaN 525nm Green
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
C : Top View Type
S : Side View Type
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150 : 1206 1.1T
170 : 0805 0.8T
191 : 0603 0.6T
192 : 0603 0.4T
110 : 1206 1.0T
DATE : 2011-07-28
Type
Type
Type
Type
Type
PAGE 14 of 14