0001 L-319EGW B3.DOC - Para Light Electronics Co. Ltd.

PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: [email protected]
DATA SHEET
PART NO. : L319EGW
REV :
PARA LIGHT ENGINEERING:
CUSTOMER'S APPROVAL:
DRAWING NO. : DS-33-02-0001
B/3
DCC:
DATE : 2010-07-10
Page : 1
3.0 mm
DIA LED LAMP
L319EGW
REV:B / 3
PACKAGE DIMENSIONS
ITEM
MATERIALS
RESIN
Epoxy Resin
LEAD FRAME
Sn Plating iron Alloy
Note:
1.All Dimensions are in millimeters.
2.Tolerance is ±0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
Page : 2
3.0 mm
DIA LED LAMP
L319EGW
REV:B / 3
FEATURES
* High-brightness
* High reliability
* Low-voltage characteristics
* Narrow view angle
* Pb FREE Products
* RoHS Compliant
CHIP MATERIALS
* Dice Material : GaAsP/GaP & GaP/GaP
* Light Color : MULTICOLOR(HI.EFFI RED & YELLOW GREEN)
* Lens Color : WHITE DIFFUSED
ABSOLUTE MAXIMUM RATING : ( Ta = 25BC )
SYMBOL
DESCRIPTION
HI.EFFI
RED
YELLOW
GREEN
UNIT
PD
Power Dissipation
85
85
mW
VR
Reverse Voltage
5
5
V
IF
Average Forward Current
30
30
mA
IPF
Peak Forward Current (Duty=0.1,1KHZ)
120
120
mA
Derating Linear From 25°C
0.4
0.4
mA/°C
Topr
Operating Temperature Range
-40°C to 100°C
Tstg
Storage Temperature Range
IFP Condition : Pulse Width≤10msec, 10% duty cycle
-40°C to 85°C
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25BC )
SYMBOL
PARAMETER
VF
Forward Voltage
IR
Reverse Current
lD
Dominant Wavelength
Δl
Spectral Line Half-Width
2θ1/2
Half Intensity Angle
IV
Luminous Intensity
DRAWING NO. : DS-33-02-0001
TEST CONDITION
Hi.effi Red
IF=20mA
Yellow Green
Hi.effi Red
VR=5V
Yellow Green
Hi.effi Red
IF=20mA
Yellow Green
Hi.effi Red
IF=20mA
Yellow Green
Hi.effi Red
IF=20mA
Yellow Green
Hi.effi Red
IF=20mA
Yellow Green
MIN.
DATE : 2010-07-10
TYP.
2.1
2.2
622
570
35
30
60
60
30
18
MAX. UNIT
2.8
V
2.8
V
100
mA
100
mA
nm
nm
nm
nm
deg
deg
mcd
mcd
Page : 3
3.0 mm
DIA LED LAMP
L319EGW
█
DRAWING NO. : DS-33-02-0001
REV:B / 3
TJ= 25℃
DATE : 2010-07-10
Page : 4
3.0 mm
DIA LED LAMP
L319EGW
REV:B / 3
Label Explanation
光鼎电子股份有限公司
PARA NO. : L319EGW
Refer to page 12
LOT
NO. : E
L
L
4
7
0009
A
B
C
D
E
F
A---E: For Serial number
B---L: Local
F: Foreign
C---L: LAMP
D---Year
E---Month
F---Serial number
BIN : Bin Code List
Luminous Intensity(IV), Unit:[email protected]
Bin
Code(E)
Min
Max
Bin
Code(G)
Min
Max
I
15.1
21.1
G
7.7
10.8
J
21.1
29.5
H
10.8
15.1
K
29.5
41.3
I
15.1
21.1
L
41.3
57.8
J
21.1
29.5
M
57.8
80.9
K
29.5
41.3
Tolerance of each bin are±15%
N.W : Net Weight
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
Page : 5
3.0 mm
DIA LED LAMP
L319EGW
REV:B / 3
—SOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
— Solder no closer than 3mm from the
DIP
SOLDERING
Bath temperature: 240℃
Immersion time: within 5 sec, 1 time
base of the package
— Using soldering flux,” RESIN FLUX”
is recommended.
— During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 300℃ or lower (To prevent heat from being
IRON
Soldering time: within 3 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering)
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a jig (See Fig.2) to avoid stressing the package.
Lead wries
Leave a slight
clearance
(Fig.2)
Regarding tinning the leads, compound made of tin ,copper and sliver is proposed with the
temperature of 260℃. The proportion of the alloyed solution is 95.5% tin, 3.5 % copper, 0.5%
silver. The time of tinning is 3 seconds.
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
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DIA LED LAMP
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REV:B / 3
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid stressing the leads (See Fig.3).
PC board
(F
ig.3
)
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable: select a
best-suited method that assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
— STORAGE
1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA
and the storage life limit is 1 year .
2) PARA LED lead frames are comprised of a tin plated iron alloy. The surface may be affected by
environments which contain corrosive gases and so on. Please avoid conditions which may
cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause
difficulty during soldering operations. It is recommended that the LEDs be used as soon as
possible.
3) Please avoid rapid changes in ambient temperature, especially, in high humidity environments
where condensation can occur.
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
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DIA LED LAMP
L319EGW
REV:B / 3
— STATIC ELECTRICITY
1) Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band and an anti-electrostatic glove be used when handling the
LEDs.
2) All devices, equipment and machinery must be properly grounded. It is recommended that
measures be taken against surge voltage to the LED mounting equipment.
3) When inspecting the final products in which LEDs were assembled, it is recommended to
check whether the assembled LEDs are damaged by static electricity. To find static-damaged
LEDs, perform a light-on test or a VF test at a lower current (below 1mA is recommended).
4) Damaged LEDs will show some unusual characteristics such as the leakage current
remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low
current.
Criteria : ( VF>2.0V at IF=0.5mA )
—LED MOUNTING METHOD
1) When mounting the LED to a housing, as shown on Fig.4, ensure that the mounting holes on
the PC board match the pitch of the leads correctly. Tolerance of dimensions of the
respective components including the LEDs should be taken into account especially when
designing the housing, PC board, etc. to prevent pitch misalignment between the leads and
holes on PCB, the diameter of the holes should be slightly larger than the size of the lead.
Alternatively, the shape of the holes could be made oval. (See Fig.4)
case
pc board
Fig.4
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
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DIA LED LAMP
L319EGW
REV:B / 3
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of plastic (Fig.6) to position the
LEDs.
Tube
Stand-off
Fig.5
Fig.6
—FORMING LEAD
2mm
1) The lead should be bent at least 2mm away from the package. Bending should be performed
with base fixed to a jig to pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the holes on PCB, so that stress
against the LED is prevented. (Fig.8)
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
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REV:B / 3
—LEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK!
1Kg
Fig.10
— HEAT MANAGEMANT
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when designing the system. The temperature increase is affected by
the thermal resistance of the circuit board and density of LED placement on the board, as
well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
2) The operating current (IF) should be decided after considering the ambient maximum
temperature of LEDs.
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
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REV:B / 3
—CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be used.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
⊙
Chlorothene
╳
resin body differ depending on factors such
Isopropyl Alcohol
⊙
as the oscillator output, size of the PC board
Thinner
╳
Acetone
╳
Trichloroethylene
╳
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed by confirming an ultrasonic
cleaning trial run.
⊙--Usable
╳--Do not use.
NOTE: Influences of ultrasonic cleaning of the LED
—OTHER CONSIDERTIONS
1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
2) The LEDs described in this data sheet are intended to be used for ordinary electronic
equipment (such as office equipment, communications equipment, measurement
instruments and household appliances). Consult PARA’s sales staff in advance for
information on the applications in which exceptional quality and reliability are required ,
particularly when the failure or malfunction of the LEDs may directly jeopardize life or health
(such as for airplanes, spacecraft, automobiles, traffic control equipment etc).
3) The formal specifications must be exchanged and signed by both parties before large volume
purchase begins.
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
Page :11
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DIA LED LAMP
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REV:B / 3
LED Lamps: Part Number Rules
L
X
R
X
XXX
C
XXX X
特殊代码:没有特殊情况不加.
如 A:美国开发的产品.
流水号
胶体颜色(C:无色透明、T:有色透明、
W:白色雾状、D:有色雾状)
发光颜色( G : Gap Green
E : GaAs/Gap Orange & Hi-effi-Red
H : Gap Red
SR,LR,UR : GaAlAs Red
Y : GaAsP/Gap Yellow
VG3 : GaAlInp Green
HUR : GaAlInP Red
LE,VE : GaAlInP Orange
LY,UY,VY : GaAlInP Yellow
SPG4,LPG4 : GaInN Green
UB5,VB5 : GaInN Blue
UW5,VW5,UWT: GaInN White
PU4: GaInN Purple)
外观尺寸(2:2 、3:3 、4:4 、
5:5 ..... )
产品外观形状(R:圆形、E:椭圆形、
S:方形、F:食人鱼)
开发年份:2006=F/2007=G/2008=H
2009=J/2010=K/2011=L/2012=M
2013=N/2014=O/2015=P
L-LAMP产品
DRAWING NO. : DS-33-02-0001
DATE : 2010-07-10
Page :12