PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: [email protected] DATA SHEET PART NO. : L319EGW REV : PARA LIGHT ENGINEERING: CUSTOMER'S APPROVAL: DRAWING NO. : DS-33-02-0001 B/3 DCC: DATE : 2010-07-10 Page : 1 3.0 mm DIA LED LAMP L319EGW REV:B / 3 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page : 2 3.0 mm DIA LED LAMP L319EGW REV:B / 3 FEATURES * High-brightness * High reliability * Low-voltage characteristics * Narrow view angle * Pb FREE Products * RoHS Compliant CHIP MATERIALS * Dice Material : GaAsP/GaP & GaP/GaP * Light Color : MULTICOLOR(HI.EFFI RED & YELLOW GREEN) * Lens Color : WHITE DIFFUSED ABSOLUTE MAXIMUM RATING : ( Ta = 25BC ) SYMBOL DESCRIPTION HI.EFFI RED YELLOW GREEN UNIT PD Power Dissipation 85 85 mW VR Reverse Voltage 5 5 V IF Average Forward Current 30 30 mA IPF Peak Forward Current (Duty=0.1,1KHZ) 120 120 mA Derating Linear From 25°C 0.4 0.4 mA/°C Topr Operating Temperature Range -40°C to 100°C Tstg Storage Temperature Range IFP Condition : Pulse Width≤10msec, 10% duty cycle -40°C to 85°C ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25BC ) SYMBOL PARAMETER VF Forward Voltage IR Reverse Current lD Dominant Wavelength Δl Spectral Line Half-Width 2θ1/2 Half Intensity Angle IV Luminous Intensity DRAWING NO. : DS-33-02-0001 TEST CONDITION Hi.effi Red IF=20mA Yellow Green Hi.effi Red VR=5V Yellow Green Hi.effi Red IF=20mA Yellow Green Hi.effi Red IF=20mA Yellow Green Hi.effi Red IF=20mA Yellow Green Hi.effi Red IF=20mA Yellow Green MIN. DATE : 2010-07-10 TYP. 2.1 2.2 622 570 35 30 60 60 30 18 MAX. UNIT 2.8 V 2.8 V 100 mA 100 mA nm nm nm nm deg deg mcd mcd Page : 3 3.0 mm DIA LED LAMP L319EGW █ DRAWING NO. : DS-33-02-0001 REV:B / 3 TJ= 25℃ DATE : 2010-07-10 Page : 4 3.0 mm DIA LED LAMP L319EGW REV:B / 3 Label Explanation 光鼎电子股份有限公司 PARA NO. : L319EGW Refer to page 12 LOT NO. : E L L 4 7 0009 A B C D E F A---E: For Serial number B---L: Local F: Foreign C---L: LAMP D---Year E---Month F---Serial number BIN : Bin Code List Luminous Intensity(IV), Unit:mcd@20mA Bin Code(E) Min Max Bin Code(G) Min Max I 15.1 21.1 G 7.7 10.8 J 21.1 29.5 H 10.8 15.1 K 29.5 41.3 I 15.1 21.1 L 41.3 57.8 J 21.1 29.5 M 57.8 80.9 K 29.5 41.3 Tolerance of each bin are±15% N.W : Net Weight DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page : 5 3.0 mm DIA LED LAMP L319EGW REV:B / 3 —SOLDERING METHOD SOLDERING CONDITIONS REMARK — Solder no closer than 3mm from the DIP SOLDERING Bath temperature: 240℃ Immersion time: within 5 sec, 1 time base of the package — Using soldering flux,” RESIN FLUX” is recommended. — During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 300℃ or lower (To prevent heat from being IRON Soldering time: within 3 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering) 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. Lead wries Panel (Fig.1) 2) When soldering wire to the lead, work with a jig (See Fig.2) to avoid stressing the package. Lead wries Leave a slight clearance (Fig.2) Regarding tinning the leads, compound made of tin ,copper and sliver is proposed with the temperature of 260℃. The proportion of the alloyed solution is 95.5% tin, 3.5 % copper, 0.5% silver. The time of tinning is 3 seconds. DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page : 6 3.0 mm DIA LED LAMP L319EGW REV:B / 3 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid stressing the leads (See Fig.3). PC board （F ig.3 ） jig 4) Repositioning after soldering should be avoided as much as possible. If inevitable: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. — STORAGE 1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA and the storage life limit is 1 year . 2) PARA LED lead frames are comprised of a tin plated iron alloy. The surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. 3) Please avoid rapid changes in ambient temperature, especially, in high humidity environments where condensation can occur. DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page : 7 3.0 mm DIA LED LAMP L319EGW REV:B / 3 — STATIC ELECTRICITY 1) Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band and an anti-electrostatic glove be used when handling the LEDs. 2) All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the LED mounting equipment. 3) When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity. To find static-damaged LEDs, perform a light-on test or a VF test at a lower current (below 1mA is recommended). 4) Damaged LEDs will show some unusual characteristics such as the leakage current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : ( VF>2.0V at IF=0.5mA ) —LED MOUNTING METHOD 1) When mounting the LED to a housing, as shown on Fig.4, ensure that the mounting holes on the PC board match the pitch of the leads correctly. Tolerance of dimensions of the respective components including the LEDs should be taken into account especially when designing the housing, PC board, etc. to prevent pitch misalignment between the leads and holes on PCB, the diameter of the holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes could be made oval. (See Fig.4) case pc board Fig.4 DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page : 8 3.0 mm DIA LED LAMP L319EGW REV:B / 3 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of plastic (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 —FORMING LEAD 2mm 1) The lead should be bent at least 2mm away from the package. Bending should be performed with base fixed to a jig to pliers (Fig.7) Fig.7 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the holes on PCB, so that stress against the LED is prevented. (Fig.8) DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page :9 3.0 mm DIA LED LAMP L319EGW REV:B / 3 —LEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10 — HEAT MANAGEMANT 1) Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when designing the system. The temperature increase is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. 2) The operating current (IF) should be decided after considering the ambient maximum temperature of LEDs. DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page :10 3.0 mm DIA LED LAMP L319EGW REV:B / 3 —CHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be used. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ resin body differ depending on factors such Isopropyl Alcohol ⊙ as the oscillator output, size of the PC board Thinner ╳ Acetone ╳ Trichloroethylene ╳ and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed by confirming an ultrasonic cleaning trial run. ⊙--Usable ╳--Do not use. NOTE: Influences of ultrasonic cleaning of the LED —OTHER CONSIDERTIONS 1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. 2) The LEDs described in this data sheet are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult PARA’s sales staff in advance for information on the applications in which exceptional quality and reliability are required , particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, spacecraft, automobiles, traffic control equipment etc). 3) The formal specifications must be exchanged and signed by both parties before large volume purchase begins. DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page :11 3.0 mm DIA LED LAMP L319EGW REV:B / 3 LED Lamps: Part Number Rules L X R X XXX C XXX X 特殊代码：没有特殊情况不加. 如 A：美国开发的产品. 流水号 胶体颜色（C：无色透明、T：有色透明、 W：白色雾状、D：有色雾状） 发光颜色（ G : Gap Green E : GaAs/Gap Orange & Hi-effi-Red H : Gap Red SR,LR,UR : GaAlAs Red Y : GaAsP/Gap Yellow VG3 : GaAlInp Green HUR : GaAlInP Red LE,VE : GaAlInP Orange LY,UY,VY : GaAlInP Yellow SPG4,LPG4 : GaInN Green UB5,VB5 : GaInN Blue UW5,VW5,UWT: GaInN White PU4: GaInN Purple) 外观尺寸(2:2 、3:3 、4：4 、 5：5 ..... ） 产品外观形状（R：圆形、E：椭圆形、 S：方形、F：食人鱼） 开发年份：2006=F/2007=G/2008=H 2009=J/2010=K/2011=L/2012=M 2013=N/2014=O/2015=P L-LAMP产品 DRAWING NO. : DS-33-02-0001 DATE : 2010-07-10 Page :12