DATA SHEET PART NO. : L-354YD REV : A / 1

PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
E-mail: para@para.com.tw
http://www.para.com.tw
DATA SHEET
PART NO. : L-354YD
REV :
A/ 1
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-33-02-0241
DCC : ____________
DATE : 2013-3-20
Page : 1
HD-R/RD012
3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
PACKAGE DIMENSIONS
Note:
1.All Dimensions are in millimeters.
2.Tolerance is ±0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
4.Lead spacing is measured where
the leads emerge from the package.
5.Specification are subject to change
without notice
DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
Page : 2
HD-R/RD013
3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
FEATURES
* 3.0mm DIA LED LAMP
* LOW POWER CONSUMPTION
* I.C. COMPATIBLE
* LONG LIFE SOLID STATE RELIABILITY
CHIP MATERIALS
* Dice Material : GaAsP/GaP
* Light Color : YELLOW
* Lens Color : YELLOW DIFFUSED
ABSOLUTE MAXIMUM RATING : ( Ta = 25 C )
PARAMETER
SYMBOL
YELLOW
UNIT
PAD
Power Dissipation Per Chip
85
mW
VR
Reverse Voltage Per Chip
5
V
IAF
Continuous Forward Current Per Chip
30
mA
IPF
Peak Forward Current Per Chip (Duty0.1,1KHz)
80
mA
Derating Linear From 25 C Per Chip
0.40
mA/ C
Topr
Operating Temperature Range
-25 C to 85 C
Tstg
Storage Temperature Range
-40 C to 85 C
Lead Soldering Temperature1.6mm(0.063 inch) From Body260°C ± 5°C for 5 Seconds
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25 C )
SYMBOL
PARAMETER
TEST CONDITION MIN. TYP. MAX. UNIT
VF
Forward Voltage
IF = 20mA
IR
Reverse Current
VR = 5V
2.15
2.8
V
100
A
Dominant Wavelength
IF = 20mA
586
nm
Spectral Line Half-Width
IF = 20mA
35
nm
2 1/2
Half Intensity Angle
IF = 20mA
60
deg
IV
Luminous Intensity
IF = 20mA
35
mcd
D
DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
Page : 3
HD-R/RD014
3.0 mm
DIA LED LAMP
L-354YD
DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
REV:A / 1
Page : 4
3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
SOLDERING
METHOD
SOLDERING CONDITIONS
DIP
Bath temperature: 260±5
SOLDERING
Immersion time: with 5 sec
REMARK
Solder no closer than 3mm from the
base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 260 or lower (To prevent heat from being
IRON
transferred directly to the lead, hold
Soldering time: within 5 sec.
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
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! "# ! DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
Page : 5
3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
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0
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
LED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
Page : 6
3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
FORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
2 33
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
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3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
LEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
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HANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care
when handling.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
Chlorothene
Isopropyl Alcohol
Thinner
Acetone
Trichloroethylene
--Usable
--Do not use.
DRAWING NO. : DS-33-02-0241
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on such factors
as the oscillator output, size of the PC board
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
DATE : 2013-3-20
Page : 8
3.0 mm
DIA LED LAMP
L-354YD
REV:A / 1
Experiment Item:
Item
OPERATION LIFE
HIGH
TEMPERATURE
HIGH HUMIDITY
STORAGE
TEMPERATURE
CYCLING
THERMAL SHOCK
SOLDER
RESISTANCE
SOLDERABILITY
Test Condition
Lamp & IR
Ta 255
IF= 20mA RH =60%RH
DYNAMIC:100mA 1ms 1/10 duty
STATIC STATE: IF20mA
TEST TIME:
168HRS-24HRS+24HRS
500HRS-24HRS+24HRS
1000HRS-24HRS+72HRS
Reference Standard
MIL-STD-7501026
MIL-STD-8831005
JIS C 7021B-1
Ta 655
RH 90
95%RH
TEST TIME240HRS2HRS
MIL-STD-202103B
JIS C 7021 B-1
105
25
-55
25
30min 5min
30min 5min
10CYCLES
MIL-STD-202107D
MIL-STD-7501051
MIL-STD-8831010
JIS C 7021 A-4
1055
-555
10min
10min
10CYCLES
Tsol2605
DWELL TIME10lsec
Tsol2305
DWELL TIME5lsec
DRAWING NO. : DS-33-02-0241
DATE : 2013-3-20
MIL-STD-202107D
MIL-STD-7501051
MIL-SYD-8831011
MIL-STD-202210A
MIL-STD-750-2031
JIS C 7021A-1
MIL-STD-202208D
MIL-STD-7502026
MIL-STD-8832003
JIS C 7021 A-2
Page :9
3.0 mm DIA LED LAMP
L-354YD
REV:A / 1
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DRAWING NO. : DS-33-02-0241
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PARA LIGHT ELECTRONICS CO., LTD.
FILE RESUME
FILE CODE
Revision
DS-33-02-0241
L-354YD
Modified Establish/Change The directions of the contents that
Date
A/0
A/1
FILE NAME
2013-3-20
Order number
be changed
PAGE
Effective
Date
1
Authorizer
New adding
Up date
LD-R/O204