AP1ADT01LL8: Rad-Hard Solid State SPDT 28V

Model # AP1ADT01LL8E1
Rad-Hard Solid State SPDT Latching Relay (AC version)
Manufactured in a Certified Class-K Facility
Features
•
•
•
•
•
•
•
100 V Breakdown Voltage (N.O. contact)
20 V Breakdown Voltage (N.C. contact)
1 Amp Design
Neutron Fluence Level >1.8E12 n/cm2
Optically Coupled
Total Dose Capability >300 Krad (Si)
Break-before-Make operation option
available
• Industry’s First Solid-State Rad-Hard
SPDT 1A Latching Relay
• >1,000 VDC Input to Output and Output
to Output Isolation
• Buffered Input Stage
• 2.0 V Compatible Logic Level Input
• DC version available (lower “on”
resistance)
Description
The AP1ADT01LL8E1 is a radiation hardened SPDT solid-state latching relay in a hermetic package. It is configured as a set
of two contacts, one being normally open and the other being normally closed (See Figure 3.). When actuated, they
perform the function of a single-pole-double-throw relay. The timing of these contacts is break-before-make. This device
is characterized for >100 Krad (Si) total ionizing dose, and neutron fluence level of >1.8E12 n/cm2. The output FETs utilize
advanced technology, and the device is actuated by standard inputs (i.e. 3.3 V and higher logic levels).
Table 1 – Absolute Maximum Ratings (Tc = +25oC Unless Otherwise Noted)
(Exceeding maximum ratings may damage the device.)
Symbol
Parameters / Test Conditions (Notes Page 3)
Value
Unit
100
V
VS
Output N.O. Switch Voltage (5)
IO
Output N.O. Switch Current (4) (5)
1
A
VS
Output N.C. Switch Voltage (5)
20
V
IO
Output N.C. Switch Current (4) (5)
1
A
Vset or reset
Input Actuation Voltage (Pin 1 & 3) (3)
48
V
Vset or reset
Input Actuation Current
2.5
mA
VR
Input Supply Voltage (Pin 6) (7)
40
V
IR
Input Supply Current (7)
12
mA
PDISS
Power Dissipation (4) (5)
2.5
W
TJ
Operating Temperature Range
-55 to +125
oC
TS
Storage Temperature Range
-65 to +150
oC
TL
Lead Temperature
300
oC
Rev Date: 6/12/2015
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AP1ADT01LL8E1
Table 2 – General Characteristics per Channel @ -55°C < TC < +125°C
(Unless Otherwise Specified)
Group A
Subgroups
Test Conditions
Symbol
Min.
Typ.
Max.
Units
--
VR = 12 V, IO = 1 A
VIN(TH)
-
--
2.5
V
Input-to-Output
Leakage Current (1)
--
VI-O = 1.0KVdc, dwell = 5.0s
TC = 25°C
II-O
--
--
1.0
mA
Output Capacitance (1)
--
VIN = 0.1V, f = 1.0MHz,
VS = 25V, TC = 25°C
COSS
--
110
--
pF
Thermal Resistance (1)
--
VIN = 3.3V, VDD = 5.0V (1, 4)
RTHJC
--
--
20
°C/W
MTBF (Per Channel)
--
MIL-HDBK-217F, [email protected]= 25°C
6.0
--
--
MHrs
Weight
--
--
--
--
25
grams
Units
Parameter
Input Latch
Threshold Voltage (1) (3)
W
Table 3 – Pre-Irradiation Electrical Characteristics per Channel
@ -55°C < TC < +125°C (Unless Otherwise Specified)
Parameter
Output On-Resistance
Output Leakage Current
N.O. output (N.C.
output)
Group A
Subgroups
Test Conditions
1
2
VR = 12 V
IO= 1A
1
VS = 100V (20 V)
2
VS = 80V (15 V)
Symbol
RDS(ON)
IO
VR = 12.0V
Input Supply Current
IDD
1, 2, 3
Min.
Typ.
Max.
--
--
0.8
--
--
1.6
--
--
25
--
--
250
--
10
15
--
--
--
--
1.0
2, 3
IIN
--
--
1.5
Turn-On Delay (6)
1, 2, 3
VIN = 3.3V, VR = 12V, VS = 50V
RL = 5Ω, P.W. = 50ms
ton
--
--
TBD
Turn-Off Delay (6)
1, 2, 3
VIN = 0.1V, VR = 12V, VS = 50V
RL = 5Ω, P.W. = 50ms
toff
--
--
TBD
Rise Time (2) (6)
1, 2, 3
VIN = 3.3V, VR = 12V, VS = 50V
RL = 5Ω, P.W. = 50ms
tr
--
--
TBD
Fall Time (2) (6)
1, 2, 3
VIN = 0.1V, VDD = 12V, VS = 50V
RL = 5Ω, P.W. = 50ms
tf
--
--
TBD
mA
mS
Rev Date: 6/12/2015
© API Technologies Corp. Proprietary Information
uA
mA
Vin = 10V
1
Input Set/Reset Current
Ohms
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AP1ADT01LL8E1
Table 4 – Post Total Dose Irradiation (8, 9)
Electrical Characteristics per Channel @ 25°C (unless otherwise specified)
Group A
Subgroups
Test Conditions
Symbol
Output On-Resistance
1
VR = 12 V, IO= 1 A
RDS(ON)
Input Supply Current
1
VR= 12V
IDD
Output Leakage Current
1
VR = 0.1V, VS = 100V
IO
25
Input Set/Reset Current
1
VIN = 10V
IIN
1.2
Turn-On Delay (6)
1
VIN = 3.3V, VDD = 5.0V, VS = 50V
RL = 5W, PW = 50ms
ton
TBD
1
VIN = 0.1V, VDD = 5.0V, VS = 50V
RL = 5W, PW = 50ms
toff
TBD
Rise Time (2) (6)
1
VIN = 3.3V, VDD = 5.0V, VS = 50V
RL = 5W, P.W. = 50ms
tr
TBD
(2) (6)
1
VIN = 0.1V, VDD = 5.0V, VS = 50V
RL = 5W, P.W. = 50ms
tf
TBD
Parameter
Turn-Off Delay
Fall Time
(6)
Min.
Typ.
10
Max.
Units
1
Ohms
15
mA
mA
ms
Notes for Maximum Ratings and Electrical Characteristic Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
Specification is guaranteed by design.
Rise and fall times are controlled internally.
Set and Reset inputs protected for VIN > -10 V to < +48 V.
Optically coupled Solid State Relays (in reality a FET with isolated Gate drive) have relatively slow turn on
and turn off times. Care must be taken to insure that transient currents during these times do not cause
violation of SOA limits for the particular switch used. If transient conditions are present, we recommend
that a complete simulation be performed by the end user to insure compliance with SOA requirements as
specified in the data sheet of the applicable switching transistor.
While the SSR design meets the design requirements specified in MIL-PRF-38534, the end user is
responsible for product derating, as required for the application.
Reference Figures 3 & 4 for Switching Test Circuits and Waveform; Output Voltage (VO) of Figure 4,
Switching Test Waveform, is representative of the Output FET Drain-to-Source Voltage.
Input Supply voltage shall not exceed 4 0 V .
Total Dose Irradiation takes place with an Input Voltage of 24 V applied and VDS = 80 V.
API Technologies’ Marlborough Operations does not currently have a DLA certified Radiation Hardness
Assurance Program.
“Flag” output is open collector, and is normally “open” when relay is set. Some models have functionality
such that this “sense” can be reversed.
Radiation Performance
API’s Radiation Hardened Solid State Relays are tested to verify their hardness capability. The hardness assurance
program uses a Cobalt-60 (60 Co) Source and heavy ion irradiation. Both pre- and post-irradiation performance are
tested and specified using the same drive circuitry and test conditions to provide a direct comparison.
Rev Date: 6/12/2015
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AP1ADT01LL8E1
Table 5 - Ordering Information
AP
1A
DT
Breakdown Voltage
06 = 60 V DC
10 = 100 V DC
25 = 250 V DC
A6=60 V AC
1A=100 V AC
2A=200 V AC
01
LL
Max Output Current
01 = 1 A
10 = 10 A
12 = 12 A
etc
Contact Type
NC = Normally Closed
NP = Normally Open
DT = SPDT
DN=Dual Normally Open
DC=Dual Normally Closed
DD=DPDT
“T” suffix indicates negative
Voltage set/reset style.
E
8
Pkg & Lead Bend Options,
Flat-Pack style assumed UOS
0 = Plug In style package
1 = No Bend
2 = Surface Mount
3 = Pkg with mounting tabs,
no leadbend
4 = Pkg with mounting tabs,
SMT leadbend
Voltage
5=5V
8 = 28 V
Timing
AA = First Series
NN = No set timing
MM = Make/Make
MB = Make/Break
BM = Break/Make
BB = Break/Break
LL=Latching (no
specific timing)
BL=Break-BeforeMake Latching
1
Screening Level
K = Class-K Compliant
H = Class-H Compliant
E = Engineering Model
“P” suffix indicates “out of
phase” Flag. See note 10.
“E” suffix indicates Power-up
in the “set” state as opposed
to power-up in the more
common “reset” state.
Table 6 - Screening Options
Screening Levels
Tests
Mil-Std-883Method
H
K
Compliant- MIL-PRF-38534
100 % Non-Destruct Wire-Pull
Sample
100%
2023
Pre-Cap Visual
N/A
100%
2017
Temperature Cycle
100%
100%
1010
Constant Acceleration
100%
100%
2001
PIND
N/A
100%
2020
Pre-Burn-In Electrical (Ta= 25C)
100%
100%
Burn-In
100% (240 Hours)
100% (320 Hours)
1015
Final Electrical
100%
100%
(6)
Hermeticity (Fine & Gross Leak)
100%
100%
1014
X-Ray (5)
N/A
100%
2012
External Visual
100%
100%
2009
Rev Date: 6/12/2015
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Figure 1 – Maximum Drain Current vs. Case Temperature per Channel
Figure 2 – Functional Block Diagram
Rev Date: 6/12/2015
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Figure 3 – Switching Test Circuit
Figure 4 – Switching Test Waveform
Rev Date: 6/12/2015
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AP1ADT01LL8E1
Figure 5 – Plug-in Package, Dimensions, bottom view
1
10
20
11
Figure 6 – Flat Pak Package, Dimensions, top view
Rev Date: 6/12/2015
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AP1ADT01LL8E1
L
Table 7 – Pin Designations
Pin #
Pin Description
Either Package Style
1
RESET
2
SET
3
FLAG
4
VR
5
VR
6
N/C
7
N.O. Switch (+)
8
N.O. Switch (+)
9
N.O. Switch (-)
10
N.O. Switch (-)
11
N.C. out/in
12
N.C. out/in
13
N.C. in/out
14
N.C. in/out
15
Not Connected
16
Not Connected
17
Not Connected
18
Not Connected
19
Power Return
20
Power Return
1.- Dimensioning and Telebanking per ASME Y14.53M-1994
2.- Controlling Dimension: Inch
3.- Dimensions are shown in inches
4.- Tolerances are +/-0.005 UOS
5.- Lead Dimensions are prior to Hot Solder Dip (if used)
6.- Lead finish per MIL-PRF-38534, Finish A, hot solder dip (Sn 63/Pb37) only on SMT
lead bend option.
7.- For no leadbend, leads exit package as above and extend out 0.5” minimum.
Rev Date: 6/12/2015
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