Power Inductors

Power Inductors
Multilayer Power Inductors
Type:
ELGUEB
Features
● Realized
the high current by the original laminating process technology
shielded structure
● Small and thin structure (2.0×1.6×1.0mm max.)
● RoHS compliant
● Magnetic
Recommended Applications
● DC/DC
converter circuit use of the small portable device
Smart phone, mobile phone, DSC .
Standard Packing Quantity
● 4000
pcs./Reel
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
L
G
U
E
B
R
4
7
M
A
12
Suffix
T dimension
Construction
Nominal
Size
Product Code
Inductance Design Code
Inductance
Tolerance EX.
Height
Code High
ELG Multilayer Inductor Code mm (inch) Code
A High-Isat
Current Type EX.
Code
E 1.0 mm max.
B
U 2016 (0806)
±20 %
R47→0.47 µH
R Low-Rdc
M
2R2→2.2 µH
0.5±0.2
0.8±0.2
Recommended Land Pattern in mm (not to scale)
1.2 to 1.4
Dimensions in mm (not to scale)
0.8 to 1.2
2.0±0.2
1.6±0.2
2.4 to 3.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jul. 2014
Power Inductors
Ratings and Characteristics
Inductance
at 1 MHz
Part Number
●
Rated Current (A)
DC Resistance
at 20 °C
dL/L=–30% ✽1
max. (typ.)
dt/t=40 ˚C ✽2
max. (typ.)
ELGUEBR24MA
(µH)
0.24
Tol.
±20 %
(mΩ) max. (typ.)
29 (22)
3.7 (4.2)
3.7 (4.2)
ELGUEBR47MA
0.47
±20 %
52 (40)
3.2 (3.5)
3.2 (3.5)
ELGUEBR68MA
0.68
±20 %
75 (60)
2.4 (2.9)
2.9 (3.3)
ELGUEB1R0MA
1.0
±20 %
85 (70)
1.6 (1.9)
1.7 (1.9)
ELGUEB2R2MR
2.2
±20 %
108 (90)
0.7 (0.8)
1.6 (1.8)
Operating Temperature Range : –40 to 125 °C (Including self-temperature rise)
✽1 This indicate the value of current when inductance change dL/L=-30 % from initial value.
✽2 This indicates the value of current when temperature rise dt/t=40 °C (at 20 °C).
DC current bias characteristics
2.5
0.8
0.68 µH
2.2 µH
0.7
2.0
0.5
Inductance (µH)
Inductance (µH)
0.6
0.47 µH
0.4
0.3
0.24 µH
0.2
1.5
1.0 µH
1.0
0.5
0.1
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
DC Current (A)
3.4
4.0
0
0.0
4.5
0.2
0.4
0.6
0.8 1.0 1.2 1.4
DC Current (A)
1.6
1.8
2.0
2.2
Packaging Methods (Taping)
● Punched
Feeding hole
fD0
Reel
W1
Chip pocket
E
C
E
t1
● Taping
Carrier Taping (Pitch 4mm)
B
F
W
B
A
t2
D
P1
Chip component
P2
P0
Tape running direction
W2
A
(Unit : mm)
Symbol
Dim
(mm)
A
B
W
F
E
P1
P2
P0 0D0
t1
t2
2.0 2.4 8.0 3.50 1.75 4.0 2.00 4.0 1.5 1.1 1.4
±0.2 ±0.2 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1
max. max.
0
(Unit : mm)
Symbol
0A
Dim
(mm)
180–30
0B
C
D
E
W1
W2
60.0±0.5 13.0±0.5 21.0±0.8 2.0±0.5 9.0+1.0
11.4±1.0
0
● Leader
Part and Taped End
Leader part
Tape end
Cover tape
100 min.
Vacant position
400 min.
160 min.
Vacant position
(Unit : mm)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jul. 2014