P4C150 ULTRA HIGH SPEED 1K X 4 RESETTABLE STATIC CMOS

P4C150
ULTRA HIGH SPEED 1K X 4
RESETTABLE STATIC CMOS RAM
FEATURES
Separate Input and Output Ports
Full CMOS, 6T Cell
Three-State Outputs
High Speed (Equal Access and Cycle Times)
– 10/12/15/20/25 ns (Commercial)
– 15/20/25/35 ns (Military)
Fully TTL Compatible Inputs and Outputs
Standard Pinout (JEDEC Approved)
– 24-Pin 300 mil DIP
– 24-Pin 300 mil SOIC
– 28-Pin LCC (350 x 550 mils)
– 24-Pin CERPACK
Chip Clear Function
Low Power Operation
Single 5V ± 10% Power Supply
DESCRIPTION
The P4C150 is a 4,096-bit ultra high-speed static RAM
organized as 1K x 4 for high speed cache applications.
The RAM features a reset control to enable clearing all
words to zero within two cycle times. The CMOS memory
requires no clocks or refreshing, and has equal access
and cycle times. Inputs and outputs are fully TTLcompatible. The RAM operates from a single 5V ± 10%
tolerance power supply.
Time required to reset is only 20 ns for the 10 ns SRAM.
CMOS is used to reduce power consumption to a low
level.
The P4C150 is available in 24-pin 300 mil DIP and SOIC
packages providing excellent board level densities.
The device is also available in a 28-pin LCC package as
well as a 24-pin FLATPACK for military applications.
Access times as fast as 10 nanoseconds are available
permitting greatly enhanced system operating speeds.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATIONS
DIP (P4, C4, D4), SOIC (S4)
CERPACK (F3) SIMILAR
LCC (L5)
Document # SRAM105 REV A
1
Revised October 2005
P4C150
MAXIMUM RATINGS(1)
Symbol
Parameter
Value
Unit
VCC
Power Supply Pin with
Respect to GND
– 0.5 to +7
V
VTERM
Terminal Voltage with
Respect to GND
(up to 7.0V)
– 0.5 to
VCC +0.5
V
TA
Operating Temperature
– 55 to +125
°C
Symbol
Parameter
Value
Unit
TBIAS
Temperature Under
Bias
– 55 to +125
°C
TSTG
Storage Temperature
– 65 to +150
°C
PT
Power Dissipation
1.0
W
IOUT
DC Output Current
50
mA
CAPACITANCES(4)
RECOMMENDED OPERATING
CONDITIONS
(VCC = 5.0V, TA = 25°C, f = 1.0MHz)
Symbol
Parameter
Conditions Typ. Unit
Grade(2)
Ambient Temp
Gnd
VCC
Commercial
0°C to 70°C
0V
5.0V ± 10%
CIN
Input Capacitance
VIN = 0V
5
pF
-55°C to +125°C
0V
5.0V ± 10%
COUT
Output Capacitance VOUT= 0V
7
pF
Military
DC ELECTRICAL CHARACTERISTICS
Over recommended operating temperature and supply voltage (2)
Symbol
P4C150
Test Conditions
Parameter
Max.
Min.
Unit
VOH
Output High Voltage
(TTL Load)
IOH = –4 mA, VCC = Min.
V
VOL
Output Low Voltage
(TTL Load)
IOL = +8 mA, VCC = Min
VIH
Input High Voltage
2.2
VCC =+0.5
V
VIL
Input Low Voltage
–0.5(3)
0.8
V
ILI
Input Leakage Current
VCC = Max., VIN = GND to VCC
–5
+5
µA
ILO
Output Leakage Current
VCC = Max., CS = VIH, VOUT = GND to VCC
–5
+5
µA
2.4
0.4
V
POWER DISSIPATION CHARACTERISTICS VS. SPEED
Symbol
Parameter
ICC
Dynamic Operating Current
Temperature
Range
-10
-12
-15
-20
-25
-35
Unit
Commercial
130
130
120
115
100
N/A
mA
Military
N/A
N/A
145
135
125
120
mA
Notes:
1. Stresses greater than those listed under MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to MAXIMUM rating conditions for extended periods may affect reliability.
Document # SRAM105 REV A
2. Extended temperature operation guaranteed with 400 linear feet per
minute of air flow.
3. Transient inputs with VIL and IIL not more negative than – 3.0V and
– 100mA, respectively, are permissible for pulse widths up to 20 ns.
4. This parameter is sampled and not 100% tested.
Page 2 of 11
P4C150
AC CHARACTERISTICS—READ CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Sym.
Parameter
-12
-10
-20
-15
-25
-35
Min Max Min Max Min Max Min Max Min Max Min Max
12
tRC
Read Cycle Time
tAA
Address Access Time
10
12
15
20
25
35
ns
tAC
Chip Select Access Time
8
10
12
14
15
35
ns
tOH
Output Hold from
Address Change
2
2
2
2
2
2
ns
tLZ
Chip Enable to
Output in Low Z
2
2
2
2
2
2
ns
tHZ
Chip Disable to
Output in High Z
4
6
8
10
13
15
ns
tOE
Output Enable to
Data Valid
7
9
10
14
15
20
ns
tOLZ
Output Enable to
Output in Low Z
tOHZ
Output Disable to
Output in High Z
10
2
15
2
5
20
2
7
25
2
9
35
Unit
2
11
ns
2
13
ns
16
ns
TIMING WAVEFORM OF READ CYCLE NO. 1(5,6)
CS CONTROLLED)(5, 7)
TIMING WAVEFORM OF READ CYCLE NO. 2 (CS
Notes:
5.WE is HIGH for READ cycle.
6.CS and OE are LOW for READ cycle.
7.ADDRESS must be valid prior to, or concident with, CS transition
LOW, tAA must still be met.
Document # SRAM105 REV A
8. Transition is measured ±200 mV from steady state voltage
prior to change, with loading as specified in Figure 1.
9. Read Cycle Time is measured from the last valid address to
the first transitioning address.
Page 3 of 11
P4C150
TIMING WAVEFORM OF READ CYCLE NO. 3 (OE
OE Controlled)(5)
AC CHARACTERISTICS—RESET CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Symbol
Parameter
-10
-12
-15
-20
-25
-35
Min Max
Min Max
Min Max
Min Max
Min Max
Min Max
Unit
tRRC
Reset Cycle Time
20
24
30
40
50
70
ns
tWER
Write Enable High to
Beginning of Reset
0
0
0
0
0
0
ns
tCR
Chip Select Low to
Beginning of Reset
0
0
0
0
0
0
ns
tRP
10
12
15
20
25
30
ns
tHCR
Reset Pulse Width
Chip Select Hold
after End of Reset
0
0
0
0
0
0
ns
tHWR
Write Enable Hold
after End of Reset
10
12
15
20
25
35
ns
tRLZ
Reset High to
Output in Low Z
0
0
0
0
0
0
ns
tRHZ
Reset Low to
Output in High Z
0
0
ns
8
0
10
0
12
0
16
0
20
TIMING WAVEFORM OF RESET CYCLE
Document # SRAM105 REV A
Page 4 of 11
P4C150
AC CHARACTERISTICS—WRITE CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Sym.
Parameter
-10
-25
-12
-15
-20
-35
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
tWC
Write Cycle Time
10
12
15
20
25
35
ns
tCW
Chip Enable Time to End of Write
8
10
11
13
15
20
ns
tAW
Address Valid to End of Write
8
10
13
16
20
25
ns
tAS
Address Set-up Time
0
1
1
1
2
2
ns
tWP
Write Pulse Width
8
10
11
13
15
20
ns
tAH
0
1
1
1
2
2
ns
tDW
Address Hold Time from
End of Write
Data Valid to End of Write
5
8
11
13
15
20
ns
tDH
Data Hold Time
0
1
1
1
2
2
ns
tWZ
Write Enable to Output in High Z
tOW
Output Active from End of Write
8
5
2
2
12
2
15
3
25
20
3
3
ns
ns
WE CONTROLLED)(10)
TIMING WAVEFORM OF WRITE CYCLE NO. 1 (WE
CS CONTROLLED)(10)
TIMING WAVEFORM OF WRITE CYCLE NO. 2 (CS
Notes:
10. CS and WE must be LOW for WRITE cycle.
11. If CS goes HIGH simultaneously with WE high, the output remains
in a high impedance state.
Document # SRAM105 REV A
12. Write Cycle Time is measured from the last valid address to the first
transition address.
Page 5 of 11
P4C150
AC TEST CONDITIONS
Input Pulse Levels
TRUTH TABLE
GND to 3.0V
Mode
RS
CS
OE
WE
Output
Input Rise and Fall Times
3ns
Not Selected
X
H
X
X
High Z
Input Timing Reference Level
1.5V
RESET
L
L
X
H
High Z
Output Timing Reference Level
1.5V
Output Disabled
H
L
H
H
High Z
READ
H
L
L
H
DOUT
WRITE
H
L
X
L
High Z
Output Load
See Figures 1 and 2
Figure 1. Output Load
Figure 2. Thevenin Equivalent
* including scope and test fixture.
Note:
Due to the ultra-high speed of the P4C150, care must be taken when testing
this device; an inadequate setup can cause a normal functioning part to be
rejected as faulty. Long high-inductance leads that cause supply bounce
must be avoided by bringing the VCC and ground planes directly up to the
contactor fingers. A 0.01 µF high frequency capacitor is also required
Document # SRAM105 REV A
between VCC and ground. To avoid signal reflections, proper termination
must be used; for example, a 50Ω test environment should be terminated
into a 50Ω load with 1.73V (Thevenin Voltage) at the comparator input, and
a 116Ω resistor must be used in series with DOUT to match 166Ω (Thevenin
Resistance).
Page 6 of 11
P4C150
ORDERING INFORMATION
SELECTION GUIDE
The P4C150 is available in the following temperature, speed and package options.
Speed (ns)
Temperature
Package
Range
10
12
15
20
Commercial
Temperature
Military
Temperature
Military
Processed*
25
35
Plastic DIP
-10PC
-12PC
-15PC
-20PC
-25PC
N/A
Plastic SOIC
-10SC
-12SC
-15SC
-20SC
-25SC
N/A
Side Brazed DIP
N/A
N/A
-15CM
-20CM
-25CM
-35CM
CERDIP
N/A
N/A
-15DM
-20DM
-25DM
-35DM
CERPACK
N/A
N/A
-15FM
-20FM
-25FM
-35FM
LCC
N/A
N/A
-15LM
-20LM
-25LM
-35LM
Side Brazed DIP
N/A
N/A
-15CMB
-20CMB
-25CMB
-35CMB
CERDIP
N/A
N/A
-15DMB
-20DMB
-25DMB
-35DMB
CERPACK
N/A
N/A
-15FMB
-20FMB
-25FMB
-35FMB
LCC
N/A
N/A
-15LMB
-20LMB
-25LMB
-35LMB
* Military temperature range with MIL-STD-883, Class B processing.
N/A = Not Available
Document # SRAM105 REV A
Page 7 of 11
P4C150
Pkg #
# Pins
Symbol
A
b
b2
C
D
E
eA
e
L
Q
S1
S2
Pkg #
# Pins
Symbol
A
b
b2
C
D
E
eA
e
L
Q
S1
α
C4
SIDE BRAZED DUAL IN-LINE PACKAGE
24 (300 mil)
Min
Max
0.200
0.014
0.026
0.045
0.065
0.008
0.018
1.280
0.220
0.310
0.300 BSC
0.100 BSC
0.125
0.200
0.015
0.060
0.005
0.005
-
D4
CERDIP DUAL IN-LINE PACKAGE
24 (300 mil)
Min
Max
0.200
0.014
0.026
0.045
0.065
0.008
0.018
1.280
0.220
0.310
0.300 BSC
0.100 BSC
0.125
0.200
0.015
0.060
0.005
0°
15°
Document # SRAM105 REV A
Page 8 of 11
P4C150
Pkg #
# Pins
Symbol
A
b
c
D
E
e
k
L
Q
S
S1
Pkg #
# Pins
Symbol
A
A1
B1
D
D1
D2
D3
E
E1
E2
E3
e
h
j
L
L1
L2
ND
NE
F3
CERPACK CERAMIC FLAT PACKAGE
24
Min
Max
0.060
0.090
0.015
0.022
0.004
0.009
0.630
0.330
0.380
0.050 BSC
0.008
0.015
0.250
0.370
0.026
0.045
0.085
0.005
-
L5
RECTANGULAR LEADLESS CHIP CARRIER
28
Min
Max
0.060
0.075
0.050
0.065
0.022
0.028
0.342
0.358
0.200 BSC
0.100 BSC
0.358
0.540
0.560
0.400 BSC
0.200 BSC
0.558
0.050 BSC
0.040 REF
0.020 REF
0.045
0.055
0.045
0.055
0.075
0.095
5
9
Document # SRAM105 REV A
Page 9 of 11
P4C150
Pkg #
# Pins
Symbol
A
A1
b
b2
C
D
E1
E
e
eB
L
α
Pkg #
# Pins
Symbol
A
A1
b2
C
D
e
E
H
h
L
α
P4
PLASTIC DUAL IN-LINE PACKAGE
24 (300 Mil)
Min
Max
0.210
0.015
0.014
0.022
0.045
0.070
0.008
0.014
1.230
1.280
0.240
0.280
0.300
0.325
0.100 BSC
0.430
0.115
0.150
0°
15°
S4
SOIC/SOP SMALL OUTLINE IC PACKAGE
24 (300 Mil)
Min
Max
0.093
0.104
0.004
0.012
0.013
0.020
0.009
0.012
0.598
0.614
0.050 BSC
0.291
0.299
0.394
0.419
0.010
0.029
0.016
0.050
0°
8°
Document # SRAM105 REV A
Page 10 of 11
P4C150
REVISIONS
DOCUMENT NUMBER:
DOCUMENT TITLE:
SRAM105
P4C150 ULTRA HIGH SPEED 1K x 4 RESETTABLE STATIC CMOS RAM
REV.
ISSUE
DATE
ORIG. OF
CHANGE
OR
1997
DAB
New Data Sheet
A
Oct-05
JDB
Change logo to Pyramid
Document # SRAM105 REV A
DESCRIPTION OF CHANGE
Page 11 of 11