PI3PCIE2415

PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Features
Description
ÎÎ4 Differential Channel, 2:1 Mux/DeMux
Pericom Semiconductor’s PI3PCIE2415 is an 8 to 4 differential
channel multiplexer/demultiplexer switch. This solution can
switch 2 full PCI Express® 2.0, lanes to one of two locations.
Using a unique design technique, Pericom has been able to
minimize the impedance of the switch such that the attenuation
observed through the switch is negligible. The unique design
technique also offers a layout targeted for PCI Express signals,
which minimizes the channel to channel skew as well as channel
to channel crosstalk as required by the PCI Express specification.
ÎÎPCI Express® 2.0 Performance, 5.0Gbps
ÎÎPinout optimized for placement between two PCIe slots
ÎÎBi-directional operation
ÎÎLow Bit-to-Bit Skew, 5ps max
ÎÎLow Crosstalk: -26dB@5 GHz
ÎÎLow Off Isolation:
-20dB@5 GHz
ÎÎVDD Operating Range: +3.3V
ÎÎESD Tolerance: 2kV HBM
ÎÎLow channel-to-channel skew, 35ps max
Application
ÎÎPackaging (Pb-free & Green):
Routing of PCIe® 2.0, signals with low signal attenuation.
àà 42-contact, TQFN (ZH42)
Block Diagram
CI
CI
DI
DI
+
–
+
–
+
–
+
–
AOa
AOa
BOa
BOa
AOb
AOb
BOb
BOb
+
–
+
–
+
–
+
–
COa
COa
DOa
DOa
+
–
+
–
AOb+
AObBI+
BIBOb+
BOb-
COb +
VDD
CI+
GND
VDD
GND
VDD
AI
AI
BI
BI
Pin Description (Top-Side View)
AI+
AI-
COb –
CI-
DOb +
COb+
CObDI+
DI-
DOb –
SEL
DOb+
DOb-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
42 41 40 39
GND
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
GND
AOa+
AOaGND
VDD
BOa+
BOaVDD
SEL
GND
COa+
COaVDD
GND
DOa+
DOaGND
18 19 20 21
Function
SEL
xIy to xOay
L
xIy to xOby
H
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GND
VDD
GND
VDD
Truth Table
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Signal Descriptions
Pin Number
Pin Name
Type
Description
1,
2
AI+,
AI-
Differential input
Differential input pair from PCIE signal source. Signal is passed
through to the AOa+, AOa- pin respectively when SEL=0. Signal
is passed through to the AOb+, AOb- pin respectively when SEL
= 1.
37,
36
AOa+,
AOa-
Differential pass-through
input
Differential analog pass-through output. Signal from AI+ and AIis passed through AOa+ and AOa- respectively when SEL=0.
3,
4
AOb+,
AOb-
Differential pass-through
input
Differential analog pass-through output. Signal from AI+ and AIis passed through AOa+ and AOa- respectively when SEL=1.
5,
6
BI+,
BI-
Differential input
Differential input pair from PCIE signal source. Signal is passed
through to the BOa+, BOa- pin respectively when SEL=0. Signal
is passed through to the BOb+, BOb- pin respectively when SEL
= 1.
33,
32
BOa+,
BOa-
Differential pass-through
input
Differential analog pass-through output. Signal from BI+ and BIis passed through BOa+ and BOa- respectively when SEL=0.
7,
8
BOb+,
BOb-
Differential pass-through
input
Differential analog pass-through output. Signal from BI+ and BIis passed through BOb+ and BOb- respectively when SEL=1.
10,
11
CI+,
CI-
Differential input
Differential input pair from PCIE signal source. Signal is passed
through the COa+, COa- pin respectively When SEL=0. Signal is
passed through to the COb+, COb- pin respectively when SEL = 1.
28,
27
COa+,
COa-
Differential pass-through
input
Differential analog pass-through output. Signal from CI+ and CIis passed through COa+, COa- pin respectively when SEL = 0.
12,
13
COb+,
COb-
Differential pass-through
input
Differential analog pass-through output. Signal from CI+ and CIis passed through COb+, COb- pin respectively when SEL = 1.
14,
15
DI+,
DI-
Differential input
Differential input pair from PCIE signal source. Signal is passed
through the DOa+, DOa- pin respectively When SEL=0. Signal is
passed through to the DOb+, DOb- pin respectively when SEL = 1.
24,
23
DOa+,
DOa-
Differential pass-through
input
Differential analog pass-through output. Signal from DI+ and DIis passed through DOa+, DOa- pin respectively when SEL = 0.
16,
17
DOb+,
DOb-
Differential pass-through
input
Differential analog pass-through output. Signal from DI+ and DIis passed through DOb+, DOb- pin respectively when SEL = 1.
18, 20, 22, 25, 29,
GND
35, 38, 40, 42
Ground input
Ground
30
SEL
3.6V tolerant low-voltage
single-ended input
SEL controls the mux through a flow-through latch.
9, 19, 21, 26, 31,
34, 39, 41
VDD
Power supply
Power, 3.3V ±10%
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Maximum Ratings
(Above which useful life may be impaired. For user guidelines, not tested.)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Supply Voltage to Ground Potential . . . . . . . . . . . . . –0.5V to +4.6V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5V to VDD
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120mA
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5W
Note:
Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
Recommended Operating Conditions
Symbol
Parameter
VDD
Conditions
Min
Typ
Max
Units
3.3V Power Supply
3.0
3.3
3.6
V
IDD
Total current from VDD
3.3V supply
0
2.5
mA
TCASE
Case temperature range
for operation within spec.
-40
85
Celsius
Max
Units
DC Electrical Characteristics (TA = –40°C to +85°C, VDD = 3.3V ± 10%)
Description
VIH-SEL(2)
Input high level, SEL input
2.0
3.6
V
VIL-SEL(2)
Input Low Level, SEL input
0
0.8
V
IIN_SEL(2)
Input Leakage Current,
SEL input
Measured with input at VIH-SEL max and
VIL-SEL min
–10
10
uA
RON
On Resistance
VDD = Min., VIN = 1.3V, IIN = 40mA
12
Ohm
On Channel Capacitance
VIN = 0, VDD = 3.3V
CON
Test Conditions
Min
Typ(1)
Parameter
2.0
pF
Note:
1. Typical values are at VDD = 3.3V, Ta = 25°C ambient and maximum loading.
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Dynamic Electrical Characteristics for xI±, xOy±
Parameter
DDIL
DDILOFF
DDRL
DDNEXT
Description
Differential Insertion Loss
Differential Off Isolation
Test Conditions
Min.
f=1.2GHz
-1.5
f=2.5GHz
-2.0
f=5.0GHz
-5.0
f=7.5GHz
-9.0
Typ.(1)
f= 0 to 3.0GHz
Differential Return Loss
Near End Crosstalk
Max.
Units
-20.0
f= 0 to 2.8GHz
-14.0
f= 2.8 to 5.0GHz
-8.0
f= 5.0 to 7.5GHz
-4.0
dB
f= 0 to 2.5GHz
-32.0
f= 2.5 to 5.0GHz
-26.0
f= 5.0 to 7.5GHz
-20.0
Switching Characteristics (TA= -40º to +85ºC, VDD = 3.3V±10%)
Parameter
Description
Test Conditions
tPZH, tPZL
Line Enable Time - SEL to xI±, xOy±
tPHZ , tPLZ
Line Disable Time - SEL to xI±, xOy±
tb-b
Bit-to-bit skew within the same differential See "Test Circuit for
pair
Electrical Characteristics"
tch-ch
Channel-to-channel skew
See "Test Circuit for
Electrical Characteristics"
See "Test Circuit for
Electrical Characteristics"
Min.
Max.
Units
0.5
12.0
ns
0.5
12.0
ns
7
ps
35
ps
See "Test Circuit for
Electrical Characteristics"
Typ.
5.0 Gbps Receive Eye Mask -3.5dB WITH the Switch
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Differential Insertion Loss
Differential Return Loss
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Differential Off Isolation
Differential Crosstalk
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
R
Notes:
1.CL = Load capacitance: includes jig and probe capacitance.
2. RT = Termination resistance: should be equal to ZOUT of the Pulse Generator
3. Output 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Output 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
4. All input impulses are supplied by generators having the following characteristics: PRR ≤ MHz, ZO = 50Ω, tR ≤ 2.5ns, tF ≤ 2.5ns.
5. The outputs are measured one at a time with one transition per measurement.
Switching Waveforms
SEL
VDD/2
VDD
VDD/2
0V
Output 1
tPZL
tPLZ
VDD/2
VOH
VOL + 0.15V
tPHZ
tPZH
VOH – 0.15V
VDD/2
VOL
VOH
VOL
Output 2
Voltage Waveforms Enable and Disable Times
+
+
+
+
+
+
+
+
+
Diff. Insertion Loss and Return Test
Circuit
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Diff. Off Isolation Test Circuit
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Diff. Near End Xtalk Test Circuit
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Application Information
Differential Inputs/Output Characteristics for PCIe® 2.0 speeds
Symbol
Parameter
Min
Nom
Max
Units
Comments
Tbit
Unit Interval
199.94
200.00
200.06
ps
Defined by PCIe 2.0 spec.
VRX-Diffp-p
Differential Input Peak-toPeak Voltage
TBD
1.200
V
VRX-DIFFp-p = 2*|VRX-D+
- VRX-D-|. Applies to IN_S
and RX_IN signals.
TRX-EYE
Minimum Eye Width at
IN_D input pair.
TBD
Tbit
VCM-AC-pp = |VRX-D+ +
VRX-D-|/2 - VRX-CM-DC.
VCM-AC-pp
AC Peak Common-Mode
Input Voltage
100
mV
VRX-CM-DC = DC(avg) of
|VRX-D++VRX-D-|/2
VCM-AC-pp includes all
frequencies above 30kHz.
ZRX-DIFF-DC
Dc Differential Input
Impedance
80
ZRX-DC
DC Input Impedance
40
VRX-Bias
Rx input termination voltage
0
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100
50
8
W
Rx DC Differential Mode
impedance
60
W
Required IN_D+ as well as
IN_D- DC impedance (50 W
± 20% tolerance). Includes
mux resistance.
2.0
V
Intended to limit power-up
stress on PCIe output buffers.
120
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PI3PCIE2415
3.3V PCI Express® 2.0, 2-Lane, 2:1 Mux/DeMux Switch
Packaging Mechanical: 42-Contact TQFN (ZH)
Notes:
1. All dimensions are in millimeters. Angles in degrees.
2. Coplanarity applies to the exposed pad as well as the terminals.
3. Refer JEDEC MO-220.
4. Recommended land pattern is for reference only.
5. Thermal pad soldering area
DATE: 11/14/12
DESCRIPTION: 42-contact Thin Fine Pitch Quad Flat No-Lead (TQFN)
PACKAGE CODE: ZH42
DOCUMENT CONTROL #: PD-2035
REVISION:D
12-0529
Note: For latest package info, please check: http://www.pericom.com/products/packaging/mechanicals.php
Ordering Information
Ordering Code
Package Code
Package Description
PI3PCIE2415ZHE
ZH
Pb-free & Green, 42-contact TQFN
Notes:
• Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
• "E" denotes Pb-free and Green
• Adding an "X" at the end of the ordering code denotes tape and reel packaging
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