Reflow Soldering Profile, Per J-STD-020D, Table 5-2, Pb-Free Devices - Supplier Tp > Tc - User Tp < Tc Tc Tc -5°C Supplier tp User tp Te m p e r a t u r e Tp Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TL Tsmax tp Tc -5°C tL Preheat Area Tsmin ts 25 Time 25°C to Peak Profile Feature Preheat/Soak Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) Ramp-up rate (TL to TP) Liquidous temperature (TL) Time (tL) maintained above TL Time (t p)* within 5 °C of the specified classification temperature (Tc)**, see Reflow Soldering Profile above. Ramp-down rate (Tp to TL) Time 25 °C to peak temperature Time Sn-Pb Eutectic Assembly 100 °C 150 °C 60-120 seconds IPC-020d-5-1 Pb-Free Assembly 150 °C 200 °C 60-120 seconds 3 °C/second max. 3 °C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds 20* seconds 30* seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. SaRonix-eCera™ is a Pericom® Semiconductor company • US: +1-408-435-0800 TW: +886-3-4518888 • www.pericom.com All specifications are subject to change without notice. REFLOW Rev E 07/18/12 Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures refer to JEP140 for recommended thermocouple use. Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 5-2. For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user. For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds. For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds. Note 3: All components in the test load shall meet the classification profile requirements. Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak classification temperature is desired. (Source Reference: J-STD-020-D1) Reliability Test Ratings This product is rated to meet the following test conditions: Type Parameter Test Condition Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Solderability JESD22-B102-D Method 2 (Preconditioning E) Mechanical Terminal strength MIL-STD-883, Method 2004, Condition D Mechanical Gross leak MIL-STD-883, Method 1014, Condition C Mechanical Fine leak MIL-STD-883, Method 1014, Condition A2 (R1 = 2x10 -8 atm cc/s) Mechanical Solvent resistance MIL-STD-202, Method 215 Environmental Thermal shock MIL-STD-883, Method 1011, Condition A Environmental Moisture resistance MIL-STD-883, Method 1004 Environmental Vibration MIL-STD-883, Method 2007, Condition A Environmental Resistance to soldering heat J-STD-020D Table 5-2 Pb-free devices (2 cycles max) SaRonix-eCera™ is a Pericom® Semiconductor company • US: +1-408-435-0800 TW: +886-3-4518888 • www.pericom.com All specifications are subject to change without notice. REFLOW Rev E 07/18/12