Material Declaration Report Package Type: SSOP 28L Component Weight (mg): 231.500 Pericom Package Code: H28(Pb-free) MSL Rating: 1 Termination Plating: Matte Tin RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e3 Applicable Exemption: N/A Max Time (sec): 40 Plating Thickness (um): 10~20 Reflow Cycles: 3 Tin Whisker Mitigation: Anneal, 150C/1hr Rev Date: 9/17/2008 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) MOLD COMPOUND ASSEMBLY SUBCON 175.914 OSE MATERIAL COMPOSITION CAS NO. COMPOSITION % COMPOSITION WEIGHT(mg) Silica Fused Epoxy Resin 1 Phenolic Resin Epoxy Resin 2 Aromatic Phosphate Carbon Black 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 90.800 3.000 3.000 2.000 1.000 0.200 159.7299 5.2774 5.2774 3.5183 1.7591 0.3518 Copper Iron Silver Zinc Phosphorus 7440-50-8 7439-89-6 7440-22-4 7440-66-6 7723-14-0 97.021 2.350 0.453 0.111 0.065 43.4355 1.0521 0.2029 0.0496 0.0291 LEADFRAME 44.769 SILICON DIE 5.435 Silicon (Si) Non-hazardous Metal 7440-21-3 Proprietary 99.192 0.808 5.3908 0.0439 DIE ATTACH EPOXY 0.501 Silver Acrylic Resin Acrylate Polybutadiene derivative Epoxy resin Additive Butadiene copolymer Peroxide 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 76.000 8.000 5.500 5.500 2.500 1.000 1.000 0.500 0.3804 0.0400 0.0275 0.0275 0.0125 0.0050 0.0050 0.0025 GOLD WIRE 1.011 Gold(Au) Impurities 7440-57-5 - 99.990 0.010 1.0113 0.0001 SOLDER PLATING 3.870 Tin (Sn) Impurity 7440-31-5 - 99.990 0.010 3.8697 0.0004 NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) Device MATERIAL Pb Hg Cr+6 Cd PBB Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating <2 <50 <2 <2 <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 PBDE <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive <1000ppm O Hg <1000ppm O Cr+6 <1000ppm O Cd <100ppm O PBB <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. PBDE <1000ppm O