Material Declaration Report Package Type: TQFN 28L (5.5x3.5mm) Component Weight (mg): 45.388 Pericom Package Code: ZH28(Pb-free) MSL Rating: 2 Termination Plating: NiPdAu RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e4 Applicable Exemption: N/A Max Time (sec): 30 Plating Thickness (um): 0.5~2.2 Reflow Cycles: 3 Tin Whisker Mitigation: N/A Rev Date: 2/3/2009 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) ASSEMBLY SUBCON OSE MATERIAL COMPOSITION CAS NO. COMPOSITION % COMPOSITION WEIGHT(mg) Silica Fused Phenolic Resin Epoxy Resin 1 Epoxy Resin 2 Aromatic Phosphate Carbon Black 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 90.800 3.000 3.000 2.000 1.000 0.200 15.4452 0.5103 0.5103 0.3402 0.1701 0.0340 Copper Iron Zinc Phosphorus Nickel Palladium Gold 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 96.953 2.350 0.111 0.065 0.473 0.041 0.007 24.1508 0.5854 0.0276 0.0162 0.1177 0.0102 0.0018 MOLD COMPOUND 17.010 LEADFRAME 24.910 SILICON DIE 2.098 Silicon (Si) Non-hazardous Metal 7440-21-3 Proprietary 99.192 0.808 2.0808 0.0170 DIE ATTACH EPOXY 0.920 Silver Bismaleimide Polymer Methacrylate Ester 7440-22-4 Proprietary Proprietary Proprietary 80.000 10.000 7.000 3.000 0.7360 0.0920 0.0644 0.0276 GOLD WIRE 0.450 Gold(Au) Impurities 7440-57-5 - 99.990 0.010 0.4498 0.0000 NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) Device MATERIAL Pb Hg Cr+6 Cd PBB Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 PBDE <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive <1000ppm O Hg <1000ppm O Cr+6 <1000ppm O Cd <100ppm O PBB <1000ppm PBDE <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. O