Package Material Composition and Mass Calculation Customer: Package: Device Type: Pad/Cavity Size: Die Size: PLX QFP 160L (28 X 28) PCI9052 G 354 SQ MILS 188 X 175 MILS name Date: composition % mg.(ave) density Mold Compound Sumitomo G600C 4447.8 Silica Fused Epoxy Resin Cresol Novolac Phenol Resin Carbon Black Leadframe 75~95 2-8 1-3 2-8 0.1-0.5 3.32 Composition Silicon Die Attach Ablebond 8361J Cu Ni Si Mg 96.20 3.00 0.65 0.15 gamma-Butyrolactone Silver Epoxy Resin Diglycidylether of bisphenol-F 2.4 External Plating Total Sn 607,066 216,809 14,743 21,681 6,938 11.86 118,627 11.41 0.36 0.08 0.02 114,119 3,559 771 178 19.4 0.38 3,783 2.8 0.05 546 608.4 0.17 2.10 0.17 0.00 0.04 0.00 33 409 33 5~15 0.36 0.01 71 0.173533 1,735 0.173516 1.73533E-05 1,735 0.174 41.40 0.8072 0.8072 8,072 8,072 5128.7 100.00 1,000,000 19.3 Solder Plate 60.71 21.68 1.47 2.17 0.69 1~10 70~80 1~10 Wire Au Ion Impurities PPM 867,237 585.28 18.25 3.95 0.91 Silicon % 86.72 3113.46 1111.95 75.613 111.195 35.5824 C7025 Die mg. 14/09/2004 99.99 0.01 8.8991 0.0009 100 41.4 7.9 8.9