Reliability Report AE Series SOIC-8 Package AE Series Part Number AE368, AE367, AE514, AE617, AE618 Description This document describes the reliability performance of AE368, AE367, AE514, AE617 Package : SOIC-8 and AE618 based on a series of reliability tests conducted. AE368, AE367, AE514, AE617 and AE618 reliability performances were leveraged on AE368, based on similarities in wafer fabrication, packaging process and technologies. AE368, AE367, AE514, AE617 and AE618 are RFHIC’s proprietary E-pHEMT (Enhancement Mode Pseudomorphic High Electron Mobility Transistor) MMIC specifically designed for various applications such as Cellular, GSM, PCS, DCS, W-CDMA, Wibro, WiMax, WiFi, RFID, Femtocell, Multi-metering, HDTV, CATV set-top box, HD cable modem, HD satellite set-top box, VOD and IPTV. These MMICs are based on Gallium Arsenide Enhancement Mode E-pHEMT which generates low current draw and very low noise. All RFHIC’s AD series is valid only for 50ohm and 75ohm application. Qualification Methodology RFHIC’s qualification process consists of a series of tests designed to stress various potential failure mechanisms. This testing is performed to ensure that RFHIC products are robust against potential failure modes that could arise from the various die and package failure mechanisms stressed. The qualification testing is based on JEDEC test methods common to the semiconductor industry, and the specifications are used as the PASS/FAIL criteria for initial and final DC/RF tests. 1. Estimates for various channel temperature are as follows <Graph-1>MTTF For product information and a complete list of distributors, please go to our web site: www.rfhic.com RFHIC and its logo are trademarks of RFHIC Corporation in Korea and other countries. Data subject to change. Copyright @ 2010 RFHIC Corporation. All rights reserved. <Graph-2>FIT RHQD-1009-008 Reliability Report AE Series SOIC-8 Package 2. Thermal information <Figure-1>Infrared Thermal Image of AE368 Condition Tc = 85℃, Tj = 141℃ Vdd = 5V, Ids = 301mA 3. Product Qualification - Operational Life Test Results Test Name Standard Test Condition Duration Sample Size Results JESD22-A108B Tj=150°C 1000hours 77 Pass JESD22-A110C +130°C/85%/230kPa 96hours 77 Pass High Temperature Operating Life(HTOL) High Accelerated Temperature and Humidity Stress Test(HAST) 4. Product Qualification - Environment Stress Results Test Name Temperature Cycling(TC) Unbiased Autoclave(UA) Standard Test Condition Duration Sample Size Results JESD22-A104D -65°C to +150°C 2cycle=1hours 500cycles 77 Pass JESD22-A102C +121°C/100%/205kPa 96hours 77 Pass 11 Pass Dip & Look Sn/Ag/Cu solder Solderability JESD22-B102E Steam Age Condition C Dip Condition B, 245°C For product information and a complete list of distributors, please go to our web site: www.rfhic.com RFHIC and its logo are trademarks of RFHIC Corporation in Korea and other countries. Data subject to change. Copyright @ 2010 RFHIC Corporation. All rights reserved. RHQD-1009-008 AE Series Reliability Report SOIC-8 Package 5. Electrostatic Discharge Test Results ESD TEST Human Body Model(HBM) Machine Model(MM) Standard Part Number Results AE617, AE618 Class1A AE368 Class1B AE379, AE514 Class1C JESD22-A114F JESD22-A115A AE368, AE379 Class A AE514, AE617, AE618 6. Moisture Sensitivity Level 1 Test Standard JESD020C Test Condition +85℃/85% 168hours Sample Size Results 38 Pass Reflow Pack Temperature 260℃ 3Cycles For product information and a complete list of distributors, please go to our web site: www.rfhic.com RFHIC and its logo are trademarks of RFHIC Corporation in Korea and other countries. Data subject to change. Copyright @ 2010 RFHIC Corporation. All rights reserved. RHQD-1009-008