SURFACE MOUNT PPTC FSMD 0603 Series FEATURES • • • • • • RoHS AGENCY RECOGNITION •UL E211981 •C-UL E211981 •TÜV R50090556 0603 size Surface Mount Application: All high-density boards Operation Current: 10mA ~ 200mA Maximum Voltage: 9Vdc ~ 60Vdc Temperature Range: -40°C to 85°C RoHS Compliant & Halogen Free ELECTRICAL CHARACTERISTICS (23°C) Max Time to Trip Resistance Tolerance RMIN R1MAX Hold Current Trip Current Rated Voltage Maximum Current Typical Power IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec OHMS OHMS FSMD001-0603R 0.01 0.03 60 40 0.5 0.20 1.00 15.00 100.00 FSMD002-0603R 0.02 0.06 60 40 0.5 0.20 1.00 12.00 70.00 FSMD003-0603R 0.03 0.09 30 40 0.5 0.20 1.00 6.00 50.00 FSMD004-0603R 0.04 0.12 24 40 0.5 0.20 1.00 4.00 40.00 FSMD005-0603R 0.05 0.15 15 40 0.5 0.50 0.10 3.80 30.00 FSMD010-0603R 0.10 0.25 15 40 0.5 0.70 0.10 0.90 8.00 FSMD012-0603R 0.12 0.30 9 40 0.5 0.80 0.10 1.10 5.80 FSMD016-0603R 0.16 0.40 9 40 0.5 1.00 0.10 1.00 4.20 FSMD020-0603R 0.20 0.45 9 40 0.5 2.00 0.10 0.55 3.50 Part Number Current Time IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: pure tin FSMD PRODUCT DIMENSIONS (MILLIMETERS) D E Marking B A Top and Bottom View C Side View A Part Number B C D E Min Max Min Max Min Max Min Max Min Max FSMD001-0603R 1.40 1.80 0.45 1.00 0.35 0.85 0.10 0.50 0.08 0.40 FSMD002-0603R 1.40 1.80 0.45 1.00 0.35 0.85 0.10 0.50 0.08 0.40 FSMD003-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 FSMD004-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 FSMD005-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 FSMD010-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 FSMD012-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 FSMD016-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 FSMD020-0603R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 Page 1 of 2 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED01 2014.01.09 SURFACE MOUNT PPTC FSMD 0603 Series RoHS THERMAL DERATING CURVE Thermal Derating Curve, FSMD0603 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% 4- 0 2- 0 0 20 40 60 80 Ambient Temperature (°C) TYPICAL TIME-TO-TRIP AT 23°C FSMD0603 Series A BCD E F GH I 100 A =FSMD001-0603R B =FSMD002-0603R 10 Time-to-Trip (s) C=FSMD003-0603R D=FSMD004-0603R 1 E=FSMD005 -0603R 0.1 F=FSMD010 -0603R G=FSMD012 -0603 R 0.01 H=FSMD016 -0603R 0.001 0.01 0.1 1 10 I=FSMD020 -0603R Fault Current (A) PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimensions in the table below provide the recommended pad layout for each FSMD0603 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER RELOW C B A B Solder Reflow Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for regular. This may cause damage to other components. 1. Recommended maximum past thickness is 0.25mm. 2. Devices can be cleaned by using standard industry methods and solvents. 3. Storage Environment: <30°C / 60% RH solvents. Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. Page 2 of 2 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED01 2014.01.09