RENESAS NESG2101M05-T1-A

Data Sheet
NESG2101M05
NPN SiGe RF Transistor for Medium Output Power Amplification (125 mW)
Flat-Lead 4-Pin Thin-Type Super Minimold (M05)
R09DS0036EJ0300
Rev. 3.00
Jun 20, 2012
FEATURES
• The device is an ideal choice for medium output power, high-gain amplification and low distortion, low noise, highgain amplification
⎯ PO (1 dB) = 21 dBm TYP. @ VCE = 3.6 V, ICq = 10 mA, f = 2 GHz
⎯ NF = 0.6 dB TYP., Ga = 19.0 dB TYP. @ VCE = 2 V, IC = 7 mA, f = 1 GHz
• Maximum stable power gain: MSG = 17.0 dB TYP. @ VCE = 3 V, IC = 50 mA, f = 2 GHz
• High breakdown voltage technology for SiGe Tr. adopted: VCEO (absolute maximum ratings) = 5.0 V
• Flat-lead 4-pin thin-type super minimold (M05) package
<R>
ORDERING INFORMATION
Part Number
NESG2101M05
Order Number
Package
NESG2101M05-A
NESG2101M05-T1 NESG2101M05-T1-A
Remark
Flat-lead 4-pin thin-type
supper minimold
(M05, 2012 PKG)
(Pb-Free)
Quantity
Supplying Form
50 pcs
(Non reel)
• 8 mm wide embossed taping
3 kpcs/reel
• Pin 3 (Collector), Pin 4
(Emitter) face the perforation
side of the tape
To order evaluation samples, please contact your nearby sales office.
Unit sample quantity is 50 pcs.
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current
Total Power Dissipation
Junction Temperature
Storage Temperature
Note:
Symbol
VCBO
VCEO
VEBO
IC
Ptot Note
Tj
Tstg
Ratings
13.0
5.0
1.5
100
500
150
−65 to +150
Unit
V
V
V
mA
mW
°C
°C
Mounted on 38 cm2 × 0.4 mm (t) polyimide PCB
CAUTION
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 1 of 13
NESG2101M05
<R>
ELECTRICAL CHARACTERISTICS (TA = +25°C)
Parameter
DC Characteristics
Collector Cut-off Current
Emitter Cut-off Current
DC Current Gain
RF Characteristics
Gain Bandwidth Product
Insertion Power Gain
Noise Figure (1)
Symbol
MIN.
TYP.
MAX.
Unit
VCB = 5 V, IE = 0
VEB = 1 V, IC = 0
VCE = 2 V, IC = 5 mA
−
−
130
−
−
190
100
100
260
nA
nA
−
14
11.5
17
13.5
−
−
GHz
dB
−
0.9
1.2
dB
−
0.6
−
dB
11.0
13.0
−
dB
−
19.0
−
dB
Cre Note 2
MSG Note 3
PO (1 dB)
VCE = 3 V, IC = 50 mA, f = 2 GHz
VCE = 3 V, IC = 50 mA, f = 2 GHz
VCE = 2 V, IC = 10 mA, f = 2 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 2 V, IC = 7 mA, f = 1 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 2 V, IC = 10 mA, f = 2 GHz,
ZS = ZSopt, ZL = ZLopt
VCE = 2 V, IC = 7 mA, f = 1 GHz,
ZS = ZSopt, ZL = ZLopt
VCB = 2 V, IE = 0, f = 1 MHz
VCE = 3 V, IC = 50 mA, f = 2 GHz
VCE = 3.6 V, ICq = 10 mA, f = 2 GHz
−
14.5
−
0.4
17.0
21
0.5
−
−
pF
dB
dBm
GL
VCE = 3.6 V, ICq = 10 mA, f = 2 GHz
−
15
−
dB
ICBO
IEBO
hFE Note 1
fT
⏐S21e⏐2
NF
Noise Figure (2)
NF
Associated Gain (1)
Ga
Associated Gain (2)
Ga
Reverse Transfer Capacitance
Maximum Stable Power Gain
Gain 1 dB Compression Output
Power
Linear Gain
Test Conditions
Notes 1. Pulse measurement: PW ≤ 350 μs, Duty Cycle ≤ 2%
2. Collector to base capacitance when the emitter grounded
3. MSG =
S21
S12
hFE CLASSIFICATION
<R>
Rank
Marking
hFE Value
FB/YFB
T1J
130 to 260
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 2 of 13
NESG2101M05
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
500
400
300
200
100
100
25
50
75
100
125
0.6
0.4
0.2
2
4
6
8
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
100
VCE = 1 V
Collector Current IC (mA)
0.1
0.01
0.001
0.5
0.6
0.7
0.8
0.9
1.0
10
1
0.1
0.01
0.001
0.0001
0.4
0.5
0.6
0.7
0.8
0.9
Base to Emitter Voltage VBE (V)
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
100
VCE = 3 V
1
0.1
0.01
0.001
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
10
VCE = 2 V
Base to Emitter Voltage VBE (V)
10
0.0001
0.4
0.8
Collector to Base Voltage VCB (V)
1
100
f = 1 MHz
Ambient Temperature TA (˚C)
10
0.0001
0.4
1.0
0
150
Collector Current IC (mA)
Collector Current IC (mA)
Mounted on Polyimide PCB
(38 × 38 mm, t = 0.4 mm)
600
0
Collector Current IC (mA)
Reverse Transfer Capacitance Cre (pF)
Total Power Dissipation Ptot (mW)
700
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
1.0
VCE = 4 V
10
1
0.1
0.01
0.001
0.0001
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 3 of 13
NESG2101M05
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
Collector Current IC (mA)
90
30
500 μ A
450 μ A
400 μ A
350 μ A
300 μ A
250 μ A
200 μ A
150 μ A
20
100 μ A
80
70
60
50
40
10
0
IB = 50 μ A
1
2
3
4
6
5
Collector to Emitter Voltage VCE (V)
DC CURRENT GAIN vs.
COLLECTOR CURRENT
DC CURRENT GAIN vs.
COLLECTOR CURRENT
1 000
1 000
100
10
0.1
VCE = 2 V
DC Current Gain hFE
DC Current Gain hFE
VCE = 1 V
1
10
100
10
0.1
100
1
10
Collector Current IC (mA)
Collector Current IC (mA)
DC CURRENT GAIN vs.
COLLECTOR CURRENT
DC CURRENT GAIN vs.
COLLECTOR CURRENT
1 000
1 000
VCE = 4 V
DC Current Gain hFE
DC Current Gain hFE
VCE = 3 V
100
10
0.1
100
1
10
100
Collector Current IC (mA)
100
10
0.1
1
10
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 4 of 13
NESG2101M05
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
Gain Bandwidth Product fT (GHz)
15
10
5
0
1
20
Gain Bandwidth Product fT (GHz)
20
VCE = 1 V
f = 2 GHz
10
15
10
5
10
100
Collector Current IC (mA)
Collector Current IC (mA)
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
20
VCE = 3 V
f = 2 GHz
15
10
5
0
1
VCE = 2 V
f = 2 GHz
0
1
100
Gain Bandwidth Product fT (GHz)
Gain Bandwidth Product fT (GHz)
20
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
10
100
Collector Current IC (mA)
VCE = 4 V
f = 2 GHz
15
10
5
0
1
10
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 5 of 13
NESG2101M05
VCE = 1 V
IC = 50 mA
35
30
MSG
MAG
25
20
15
|S21e|2
10
5
0
0.1
1
10
VCE = 2 V
IC = 50 mA
35
30
MSG
MAG
25
20
15
|S21e|2
10
5
0
0.1
1
10
100
Frequency f (GHz)
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
VCE = 3 V
IC = 50 mA
35
MSG
MAG
25
20
15
|S21e|2
10
5
0
0.1
40
Frequency f (GHz)
40
30
100
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
40
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
1
10
100
Frequency f (GHz)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
40
VCE = 4 V
IC = 50 mA
35
30
MSG
MAG
25
20
15
|S21e|2
10
5
0
0.1
1
10
100
Frequency f (GHz)
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 6 of 13
NESG2101M05
25
VCE = 1 V
f = 1 GHz
MAG
MSG
20
15
|S21e|2
10
5
0
1
10
100
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
30
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 2 V
f = 1 GHz
MAG
MSG
20
|S21e|2
15
10
5
0
1
10
100
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 1 V
f = 2 GHz
20
MSG
MAG
15
10
|S21e|2
5
0
1
10
100
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Collector Current IC (mA)
30
25
VCE = 2 V
f = 2 GHz
20
MSG
MAG
15
10
|S21e|2
5
0
1
10
100
Collector Current IC (mA)
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
20
15 MSG
VCE = 1 V
f = 3 GHz
MAG
10
|S21e|2
5
0
–5
–10
1
10
100
Collector Current IC (mA)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
20
VCE = 2 V
f = 3 GHz
15 MSG
MAG
10
|S21e|2
5
0
–5
–10
1
10
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 7 of 13
NESG2101M05
25
VCE = 3 V
f = 1 GHz
MAG
MSG
20
|S21e|2
15
10
5
0
1
10
100
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
30
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 4 V
f = 1 GHz
MAG
MSG
20
|S21e|2
15
10
5
0
1
10
100
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 3 V
f = 2 GHz
20
MSG
MAG
15
10
|S21e|2
5
0
1
10
100
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Collector Current IC (mA)
30
25
VCE = 4 V
f = 2 GHz
20
MSG
MAG
15
10
|S21e|2
5
0
1
10
100
Collector Current IC (mA)
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
20
15 MSG
VCE = 3 V
f = 3 GHz
MAG
10
|S21e|
5
2
0
–5
–10
1
10
100
Collector Current IC (mA)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
20
15 MSG
VCE = 4 V
f = 3 GHz
MAG
10
|S21e|2
5
0
–5
–10
1
10
100
Collector Current IC (mA)
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 8 of 13
80
Pout
15
60
IC
10
40
ηC
20
5
0
–20
–15
–10
–5
0
5
0
10
Output Power Pout (dBm), Power Gain GP (dB)
Input Power Pin (dBm)
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
25
20
120
VCE = 3.6 V, f = 3 GHz
Icq = 10 mA
100
15
80
GP
10
60
Pout
5
0
–5
–15
40
IC
20
ηC
–10
–5
0
5
Input Power Pin (dBm)
10
0
15
25
20
120
VCE = 3.6 V, f = 2 GHz
Icq = 10 mA
100
GP
15
80
Pout
10
60
IC
5
40
ηC
20
0
–5
–15
–10
–5
0
5
10
0
15
Input Power Pin (dBm)
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
25
20
120
VCE = 3.6 V, f = 5.2 GHz
Icq = 10 mA
100
15
80
Pout
10
60
GP
40
5
IC
0
–5
–10
20
ηC
–5
0
5
10
Input Power Pin (dBm)
15
0
20
Collector Current IC (mA), Collector Efficiency η C (%)
GP
20
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
Collector Current IC (mA), Collector Efficiency η C (%)
100
Output Power Pout (dBm), Power Gain GP (dB)
25
120
VCE = 3.6 V, f = 1 GHz
Icq = 10 mA
Output Power Pout (dBm), Power Gain GP (dB)
30
Collector Current IC (mA), Collector Efficiency η C (%)
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
Collector Current IC (mA), Collector Efficiency η C (%)
Output Power Pout (dBm), Power Gain GP (dB)
NESG2101M05
Remark The graph indicates nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 9 of 13
NESG2101M05
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
5
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
25
5
25
3
15
2
10
1
5
4
Ga
3
15
2
10
1
5
NF
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
10
5
1
NF
3
15
Ga
2
10
5
1
NF
0
0
100
10
20
VCE = 2 V
f = 2 GHz
1
0
100
10
Collector Current IC (mA)
Collector Current IC (mA)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
15
3
Ga
2
10
1
NF
1
4
20
VCE = 1 V
f = 3 GHz
10
5
0
100
Collector Current IC (mA)
Noise Figure NF (dB)
4
Noise Figure NF (dB)
Noise Figure NF (dB)
2
Associated Gain Ga (dB)
15
1
4
20
VCE = 1 V
f = 2 GHz
Ga
0
0
100
10
Collector Current IC (mA)
3
0
1
Collector Current IC (mA)
4
Noise Figure NF (dB)
10
0
20
VCE = 2 V
f = 3 GHz
15
3
Ga
2
10
1
0
NF
1
Associated Gain Ga (dB)
1
NF
0
100
Associated Gain Ga (dB)
0
20
Associated Gain Ga (dB)
20
Ga
10
5
Associated Gain Ga (dB)
4
Noise Figure NF (dB)
VCE = 2 V
f = 1 GHz
Associated Gain Ga (dB)
Noise Figure NF (dB)
VCE = 1 V
f = 1 GHz
0
100
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 10 of 13
NESG2101M05
5
25
25
20
3
15
2
10
1
5
Noise Figure NF (dB)
VCE = 4 V
f = 1 GHz
Ga
Ga
4
3
15
2
10
1
5
NF
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
20
15
10
5
1
1
Noise Figure NF (dB)
Ga
4
Associated Gain Ga (dB)
VCE = 3 V
f = 2 GHz
NF
Ga
3
15
2
10
5
1
NF
0
100
10
20
VCE = 4 V
f = 2 GHz
0
1
0
100
10
Collector Current IC (mA)
Collector Current IC (mA)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
15
3
Ga
2
10
1
NF
1
4
20
VCE = 3 V
f = 3 GHz
10
5
0
100
Collector Current IC (mA)
Noise Figure NF (dB)
4
Noise Figure NF (dB)
0
100
10
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
2
0
1
Collector Current IC (mA)
3
0
0
Collector Current IC (mA)
4
Noise Figure NF (dB)
NF
0
100
10
20
VCE = 4 V
f = 3 GHz
15
3
Ga
2
10
1
0
NF
1
10
5
0
100
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Associated Gain Ga (dB)
1
Associated Gain Ga (dB)
0
20
Page 11 of 13
Associated Gain Ga (dB)
4
5
Associated Gain Ga (dB)
VCE = 3 V
f = 1 GHz
Noise Figure NF (dB)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
Associated Gain Ga (dB)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NESG2101M05
<R>
S-PARAMETERS
S-parameters and noise parameters are provided on our web site in a form (S2P) that enables direct import of the
parameters to microwave circuit simulators without the need for keyboard inputs.
Click here to download S-parameters.
[Products] → [RF Devices] → [Device Parameters]
URL http://www.renesas.com/products/microwave/
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 12 of 13
NESG2101M05
PACKAGE DIMENSIONS
FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M05, 2012 PKG) (UNIT: mm)
(Top View)
(Bottom View)
2.05±0.1
1.25±0.1
2
1
4
0.30+0.1
–0.05
T1J
(0.65)
0.65
1.30
3
(1.05)
2.0±0.1
0.11+0.1
–0.05
0.5
0.59±0.05
<R>
PIN CONNENTION
1. Base
2. Emitter
3. Collector
4. Emitter
Remark ( ) : Reference value
R09DS0036EJ0300 Rev. 3.00
Jun 20, 2012
Page 13 of 13
Revision History
NESG2101M05 Data Sheet
Description
Rev.
−
3.00
Date
Mar 2003
Jun 20, 2012
Page
−
p.1
p.2
p.12
p.13
Summary
Previous No. : PU10190EJ02V0DS
Modification of ORDERING INFORMATION
Modification of ELECTRICAL CHARACTERISTICS
Modification of hFE CLASSIFICATION
Modification of S-PARAMETERS
Modification of PACKAGE DIMENSIONS
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C-1
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
2.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
3.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
4.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or
5.
Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on
third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product.
the product's quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; and industrial robots etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc.
Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical
implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it
in a particular application. You may not use any Renesas Electronics product for any application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses
incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics.
6.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
9.
Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or
regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the
development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and
regulations and follow the procedures required by such laws and regulations.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the
contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics
products.
11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
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