HUAWEI MG323 GSM M2M Module Hardware Guide Issue 04 Date 2011-08-22 Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters. Huawei Technologies Co., Ltd. Huawei Industrial Base, Bantian, Longgang, Shenzhen 518129, People’s Republic of China Tel: +86-755-28780808 Global Hotline: +86-755-28560808 Website: www.huawei.com E-mail: [email protected] Please refer color and shape to product. Huawei reserves the right to make changes or improvements to any of the products without prior notice. Copyright © Huawei Technologies Co., Ltd. 2011. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd and possible licensors. 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HUAWEI MG323 GSM M2M Module Hardware Guide About This Document About This Document History Version Date Chapter 01 02 03 04 Issue 04 (2011-08-22) Descriptions Creation 2010-10-25 2011-07-18 2011-08-22 1 Deleted “1.2 Related Documents” 3.1 Deleted “Charging Interface (TBD)” 3.6.1 Revised “Table 3-5 UART1 interface signals” 3.8 Deleted “Charging Interface (TBD)” Added “Audio Interface” 7 Revised “Figure 7-1 Circuits of typical interfaces in the MG323 module” 2.2 Add authentication information-CCC、GCF and mode of audio services 3.5.2 Add the maximum time of TERM_ON 3.6 Add signal of the RING while receiving a message and a voice call 5.2 Revised “Table 5-1 Extreme working conditions for the MG323 module” 5.4 Revised “Table 5-3 Sequence numbers of pins and definitions of signals on the B2B interface” and “Table 5-4 Electrical features of application interfaces” 5.5.2 Revised “Table 5-6 Working current of the MG323 module” 6.3 Specify the mode of the 50-pin B2B connector 3.2 Revised “Figure 3-1 Sequence and definitions of pins on the B2B signal interface” 6.4 Revised “Figure 6-5 Structure fixing hole” Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 3 HUAWEI MG323 GSM M2M Module Hardware Guide Contents Contents 1 Introduction.................................................................................................................................... 6 1.1 Overview .......................................................................................................................................... 6 2 Overall Description ...................................................................................................................... 7 2.1 About This Chapter........................................................................................................................... 7 2.2 Function Overview ........................................................................................................................... 7 2.3 Application Block Diagram ............................................................................................................... 9 2.4 Circuit Block Diagram ....................................................................................................................... 9 3 Description of the Application Interfaces .............................................................................. 11 3.1 About This Chapter.......................................................................................................................... 11 3.2 B2B Connector Interface ................................................................................................................. 11 3.3 Power Interface .............................................................................................................................. 13 3.3.1 Overview ................................................................................................................................ 13 3.3.2 VBAT Interface....................................................................................................................... 13 3.3.3 VCOIN Interface .................................................................................................................... 14 3.3.4 VIO Interface ......................................................................................................................... 14 3.4 Power-On and Power-Off Time Sequence ..................................................................................... 15 3.4.1 Overview ................................................................................................................................ 15 3.4.2 Power-On Time Sequence .................................................................................................... 15 3.4.3 Power-Off Time Sequence .................................................................................................... 16 3.4.4 RESET ................................................................................................................................... 16 3.5 Signal Control Interface .................................................................................................................. 17 3.5.1 Overview ................................................................................................................................ 17 3.5.2 Input Signal Control Pins ....................................................................................................... 17 3.5.3 Output Signal Control Pin ...................................................................................................... 18 3.6 UART Interface ............................................................................................................................... 19 3.6.1 Overview ................................................................................................................................ 19 3.6.2 Circuit Recommended for the UART Interface ...................................................................... 20 3.7 SIM Card Interface ......................................................................................................................... 22 3.7.1 Overview ................................................................................................................................ 22 3.7.2 Circuit Recommended for the SIM Card Interface ................................................................ 22 3.7.3 ESD Protection for the SIM Card Interface ........................................................................... 23 3.8 Audio Interface ............................................................................................................................... 24 Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 4 HUAWEI MG323 GSM M2M Module Hardware Guide Contents 3.8.1 Overview ................................................................................................................................ 24 3.8.2 Speaker Interface .................................................................................................................. 24 3.8.3 Microphone Interface ............................................................................................................. 25 4 Antenna Interface........................................................................................................................ 27 4.1 About This Chapter......................................................................................................................... 27 4.2 Antenna Installation ........................................................................................................................ 27 4.3 Coaxial Cable and RF Connector .................................................................................................. 28 4.4 ESD Protection for the Antenna Interface ...................................................................................... 30 4.5 RF Specifications of the Antenna Interface .................................................................................... 30 4.6 Specifications of the Antenna Interface .......................................................................................... 32 5 Electrical and Reliability Features ........................................................................................... 33 5.1 About This Chapter......................................................................................................................... 33 5.2 Extreme Working Conditions .......................................................................................................... 33 5.3 Working and Storage Temperatures and Humidity ........................................................................ 34 5.4 Electrical Criteria of Application Interfaces ..................................................................................... 34 5.5 Power Supply Features .................................................................................................................. 38 5.5.1 Input Power Supply ............................................................................................................... 38 5.5.2 Working Current .................................................................................................................... 38 5.6 Reliability Features ......................................................................................................................... 39 5.7 ESD Features ................................................................................................................................. 41 6 Structure ........................................................................................................................................ 42 6.1 Overview ........................................................................................................................................ 42 6.2 Dimensions..................................................................................................................................... 42 6.3 Dimensions of the B2B Connector ................................................................................................. 44 6.4 MG323 Module Installation Description ......................................................................................... 45 6.5 Specification Selection for Fasteners ............................................................................................. 47 7 Appendix A Circuits of Typical Interfaces ............................................................................ 49 8 Appendix B Acronyms and Abbreviations ............................................................................ 50 Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 5 HUAWEI MG323 GSM M2M Module Hardware Guide Introduction 1 Introduction 1.1 Overview This document describes the hardware application interfaces and air interfaces that are provided when the Huawei MG323 GSM M2M module (hereinafter referred to as the MG323 module) is used. This document helps you to understand the interface specifications, electrical features, and related product information of the MG323 module. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 6 HUAWEI MG323 GSM M2M Module Hardware Guide Overall Description 2 Overall Description 2.1 About This Chapter This chapter gives a general description of the MG323 module and provides: Function Overview Application Block Diagram Circuit Block Diagram 2.2 Function Overview Table 2-1 Feature Feature Description Working bands Four supported frequency bands: GSM850 MHz/900 MHz/1800 MHz/1900 MHz Maximum transmission power GSM850 Class 4 (2 W) EGSM900 Class 4 (2 W) GSM1800 Class 1 (1 W) GSM1900 Class 1 (1 W) Receiver sensitivity < –107 dBm Working temperature Normal working temperature: –20°C to + 70°C Ambient temperature for storage – 40°C to 85°C Power voltage 3.3 V to 4.8 V (3.8 V is recommended.) Issue 04 (2011-08-22) Extreme working temperatures: – 30°C to – 20°C and + 70°C to + 75°C Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 7 HUAWEI MG323 GSM M2M Module Hardware Guide Overall Description Feature Description Power consumption (current) Power-off current: 47 µA Average standby current DRX = 2 < 3.0 mA DRX = 5 < 2.5 mA DRX = 9 < 2.0 mA GPRS Class 10 (maximum): 460 mA Protocols GSM/GPRS Phase2/2+ AT commands See the HUAWEI MG323 GSM M2M Module AT Command Interface Specification. Application interface (50pin B2B connector) UART1 (supporting 8-wire UART) One standard Subscriber Identity Module (SIM) card interface (3 V or 1.8 V) Interfaces for two analog audio channels Power Interface Network status light-emitting diode (LED) control interface Antenna interface Hirose U.FL-R-SMT-1(80) 50 ohm antenna connector Voice services Two analog voice channels SMS New message alert, text message receiving, and text message sending Antenna pad Management of text messages: read messages, delete messages, storage status, and message list Support for the protocol data unit (PDU) mode GPRS GPRS CLASS 10 Encoding schemes: CS 1, CS 2, CS 3, and CS 4 Maximum downlink transmission rate: 85.6 kbps Maximum uplink transmission rate: 42.8 kbps Packet Broadcast Control Channel (PBCCH) Embedded with TCP/IP protocols, supporting multiple links Circuit Switched Data (CSD) data services CSD data services at the maximum rate of 9.6 kbit/s Physical features Dimensions (L × W × H): 35 mm × 32.5 mm × 3.05 mm Weight: 5.8 g Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 8 HUAWEI MG323 GSM M2M Module Hardware Guide Overall Description Feature Description Certification information Restriction of the use of certain Hazardous Substances (RoHS), European Conformity (CE), Federal Communications Commission (FCC), CMIIT, China Compulsory Certification (CCC), GCF (GSM Certification Forum) 2.3 Application Block Diagram Figure 2-1 shows the application block diagram of the MG323 module. Figure 2-1 Application block diagram of the MG323 module Antenna interface MG323 GSM module Application interfaces Charge UART SIM card Analog voice Power Handset or earphone Status LED RTC power Charging circuit UART SIM Power-on/ Power-off Restart On / Off Reset 2.4 Circuit Block Diagram The circuit block diagram and major functional units of the MG323 module contain the following parts: GSM baseband controller Power management Multi-chip package (MCP) memory Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 9 HUAWEI MG323 GSM M2M Module Hardware Guide Radio frequency (RF) transceiver 26 MHz reference clock RF front-end modules Receive filter Overall Description Figure 2-2 Circuit block diagram of the MG323 module Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 10 HUAWEI MG323 GSM M2M Module Hardware Guide 3 Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MG323 module, including: B2B Connector Interface Power Interface Power-On and Power-Off Time Sequence Signal Control Interface UART Interface SIM Card Interface Audio Interface 3.2 B2B Connector Interface The MG323 module uses a 50-pin B2B connector as its external interface. For details about the model and dimensions of the B2B connector, see “6.3 Dimensions of the B2B Connector." Figure 3-1 shows the sequence and definitions of pins on the 50-pin B2B signal interface of the MG323 module. Figure 3-1 Sequence and definitions of pins on the B2B signal interface 1 49 Issue 04 (2011-08-22) 2 50 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 11 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces PIN NO. Signal name PIN NO. Signal name 1 SIM_CLK 2 INTEAR_N 3 VSIM 4 INTEAR_P 5 SIM_DATA 6 EXTEAR_P 7 SIM_RST 8 EXTEAR_N 9 NC 10 INTMIC_N 11 GND 12 INTMIC_P 13 NC 14 EXTMIC_P 15 NC 16 EXTMIC_N 17 NC 18 GND 19 NC 20 TERM_ON 21 NC 22 RESET 23 BATT_THERM 24 UART1_DCD 25 LED_STATUS 26 NC 27 NC 28 UART1_CTS 29 UART1_RD 30 NC 31 NC 32 UART1_DTR 33 UART1_TD 34 UART1_RTS 35 VCOIN 36 UART1_DSR 37 NC 38 UART1_RING 39 NC 40 VIO 41 GND 42 VBAT 43 GND 44 VBAT 45 GND 46 VBAT 47 GND 48 VBAT 49 GND 50 VBAT Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 12 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces 3.3 Power Interface 3.3.1 Overview The power supply part of the B2B interface of the MG323 module contains: VBAT interface for the power supply VCOIN interface for the standby power supply of the real-time clock (RTC) VIO interface for external power output Table 3-1 lists the definitions of the pins on the power supply interface. Table 3-1 Definitions of the pins on the power supply interface Pin No. Signal Name I/O Description 42, 44, 46, 48, 50 VBAT P Pins for power voltage input 41, 43, 45, 47, 49 GND - GND 35 VCOIN P Pin for standby power input of the RTC 40 VIO P Pin for external power output P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal input. 3.3.2 VBAT Interface When the MG323 module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.3 V to 4.8 V (typical value: 3.8 V). The 50-pin B2B connector provides five VBAT pins and five GND pins for external power input. To ensure that the MG323 module works normally, all the pins must be used efficiently. When the MG323 module is used for different external applications, pay special attention to the design for the power supply. When the MG323 module transmits signals at the maximum power, the transient current may reach the transient peak value of about 2.0 A due to the differences in actual network environments. In this case, the VBAT voltage drops. Make sure that the voltage does not decrease below 3.3 V in any case. Otherwise, exceptions such as restart of the MG323 module may occur. A low-dropout (LDO) regulator or switch power with current output of more than 2 A is recommended for external power supply. Furthermore, a 2.2 mF or above energy storage capacitor is connected in parallel at the power interface of the MG323 module. As for the energy storage capacitor, a 2.2 mF or above electrolytic capacitor is recommended. In addition, to reduce the impact of channel impedance on voltage drop, you are recommended to try to shorten the power supply circuit of the VBAT interface. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 13 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces For detailed information about power supply design and printed circuit board (PCB) design, see HUAWEI MI Module Power Management Design Guide, HUAWEI M2M Module Power Management Design Guide and HUAWEI LGA Module PCB Routing Design Guide. 3.3.3 VCOIN Interface VCOIN is an interface for standby power input of the RTC in the MG323 module. If the VBAT interface is ready for power supply, it on priority supplies the RTC with power. If the VBAT interface is not ready, the VCOIN interface provides standby power input for the RTC. In this case, the MG323 module needs 5 µA to maintain the RTC function. You can use an external battery to supply power through the VCOIN interface. The recommended voltage is 3 V. You can also use an external capacitor if you do not use a battery. The capacitance determines the duration of the RTC when the VBAT interface is not ready. The MG323 module supports charging external standby batteries. When the VBAT voltage is 3.8 V, the charging current is about 0.6 mA (typical value). Figure 3-2 shows two types of circuits for your reference. Figure 3-2 VCOIN interface circuit 3.3.4 VIO Interface Through the VIO interface, the MG323 module can supply 2.8 V power externally with an output current of 10 mA (typical value) for external level conversion or other applications. If the MG323 module is in Sleep mode, the VIO interface is in the low power consumption state (< 500 µA). If the MG323 module is in Power Down mode, the VIO is in the disabled state. If VIO pin is not in use, disconnect the pin and make sure it is not grounded. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 14 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces 3.4 Power-On and Power-Off Time Sequence 3.4.1 Overview The power-on, power-off, and reset control parts of the B2B interface of the MG323 module includes power-on/power-off interface signal (TERM_ON) and the hardware reset interface signal (RESET). Table 3-2 lists the definitions of the interface pins. Table 3-2 Definitions of pins of the power-on/power-off and reset interfaces Pin No. Signal Name I/O Description 20 TERM_ON I Pin for controlling power-on and power-off 22 RESET I Pin for resetting the hardware 3.4.2 Power-On Time Sequence Make sure that the MG323 module is powered on at the voltage and working temperature in the recommended range. Otherwise, the module may get damaged or work improperly. External application interfaces must be powered on after the module is powered on. You can power on the MG323 module through the TERM_ON interface. The software will report relevant information according to the actual settings after the module is powered on. For example, the AT command automatically reports ^SYSSTART[1]. In this case, the external VIO interface is enabled and supplies 2.8 V power. [1] For specific setting information about the power-on/power-off software, see the HUAWEI MG323 GSM M2M Module AT Command Interface Specification. Figure 3-3 shows the power-on time sequence. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 15 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-3 Power-on time sequence Fetch Ext Code in the figure is a file system in the MG323 module. 3.4.3 Power-Off Time Sequence The MG323 module supports power-off through the TERM_ON interface or the AT^SMSO command. Figure 3-4 shows the power-off time sequence. Figure 3-4 Power-off time sequence The processing of the power-off event depends on the normal stop time of the file system in the MG323 module. The processing varies with the capacity of the file system. 3.4.4 RESET The MG323 module supports hardware reset function. If the software of the MG323 module stops responding, you can reset the hardware through the RESET signal. After the hardware is reset, the software starts powering on the module and reports Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 16 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces relevant information according to the actual settings. For example, the AT command automatically reports ^SYSSTART. In this case, the external VIO interface is enabled and supplies 2.8 V power. 3.5 Signal Control Interface 3.5.1 Overview The signal control part of the B2B interface in the MG323 module consists of: Power-on/off (TERM_ON) pin Hardware reset (RESET) pin Network status LED (LED_STATUS) pin Table 3-3 lists the pins on the signal control interface. Table 3-3 Pins on the signal control interface Pin No. Signal Name I/O Description 20 TERM_ON I Pin for controlling power-on and power-off 22 RESET I Pin for resetting the hardware 25 LED_STATUS O Pin for network status LED 3.5.2 Input Signal Control Pins The MG323 module implements power-on and power-off and resets the hardware through the input signal control pins. The TERM_ON pin is used to implement power-on and power-off. If the TERM_ON pin is pulled down for 1 second to 2 seconds, the module is powered on; if the TERM_ON pin is pulled down for 1 second to 2 seconds again, the module is powered off. The RESET pin is used to reset the hardware. When the software stops responding, the RESET pin can be pulled down for at least 10 ms to reset the hardware. As the RESET and TERM_ON signals are relatively sensitive, it is recommended that you install a 10 nF capacitor near the RESET and TERM_ON pins of the B2B interface for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module may be reset due to interference. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 17 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-5 shows the connections of the TERM_ON and RESET pins. Figure 3-5 Connections of the TERM_ON and RESET pins 3.5.3 Output Signal Control Pin The MG323 module provides a network status LED pin LED_STATUS. The pulse signal output through this pin controls the status LED on the user interface board to display the network status. Different blinking modes of the status LED indicate different network status. Table 3-4 describes the status of the LED_STATUS pin. Table 3-4 Status of the LED_STATUS pin Working or Network Status Output Status of the LED_STATUS Pin Sleep mode A low-level signal is output continuously. Network-searching or non-network status (including the case when the SIM card is not inserted and the case when the PIN number is unblocked) A high-level signal is output for 0.1s in a period of 1s. Registered with a 2G network A high-level signal is output for 0.1s in a period of 3s. GPRS data service A high-level signal is output for 0.1s in a period of 0.125s. Voice call A high-level signal is output continuously. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 18 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces In practical application, the LED_STATUS pin cannot be directly used to drive the status LED. The LED_STATUS pin needs to be used with a triode. To select a suitable current-limiting resistor for the LED, check the actual voltage drop and rated current of the LED. Figure 3-6 shows the driving circuit. Figure 3-6 Driving circuit 3.6 UART Interface 3.6.1 Overview The MG323 module provides the RS-232 UART1 (8-wire UART) interface for one asynchronous communication channel. As the UART1 interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART1 interface. The UART1 has the following features: Full-duplex 7-bit or 8-bit data 1-bit or 2-bit stop bit Odd parity check, even parity check, or non-check Baud rate clock generated by the system clock Direct memory access (DMA) transmission Baud rate ranging from 600 bit/s to 230400 bit/s (115.2 kbit/s by default) Self-adapted baud rate ranging from 1200 bit/s to 115.2 kbit/s Table 3-5 lists the UART1 interface signals. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 19 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Table 3-5 UART1 interface signals Pin No. Signal Name Description Feature Direction 29 UART1_RD Data transmission end of the module The data terminal equipment (DTE) receives serial data. Data circuitterminating equipment (DCE) to DTE 33 UART1_TD Data receiving end of the module The DTE transmits serial data. DTE to DCE 38 UART1_RING Ring indicator of the module The DCE notifies the DTE of a remote call. DCE to DTE 32 UART1_DTR Data Terminal Ready The DTE is ready. DTE to DCE 34 UART1_RTS Request To Send The DTE requests the DCE to send data. DTE to DCE 36 UART1_DSR Data Set Ready The DCE is ready. DCE to DTE 28 UART1_CTS Clear To Send The DCE has switched to the data receiving mode. DCE to DTE 24 UART1_DCD Data Carrier Detect A data link is set up. DCE to DTE 3.6.2 Circuit Recommended for the UART Interface Figure 3-7 shows the connection of the UART1 interface in the MG323 module (DCE) with the host (DTE). Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 20 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-7 Connection of the UART1 interface in the MG323 module (DCE) with the host (DTE) The RS-232 chip can be used to connect the MG323 GSM module to the RS-232-C interface. In this connection, the transistor-transistor logic (TTL) level and the Electronic Industries Association (EIA) level are converted mutually. For example, it is recommended that you use the MAX3232 chip with a 2-wire serial port and the SP3238 or MAX3238 chip with an 8-wire serial port. When an MG323 module receives an SM (Short Message), a low-level signal is output through the RING (pin 38) for less than 1s, as shown in Figure 3-8 . Figure 3-8 The signal through the RING after the MG323 receives an SM When an MG323 Module receives a voice call, a periodical low level signal for 1s and a high level signal for 4s are output by RING, as shown in Figure 3-9 . Figure 3-9 The signal through the /RING after the MG323 receives a voice call Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 21 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces For detailed application of the MG323 UART1 interface, see HUAWEI Module UART Serial Port Design Guide. 3.7 SIM Card Interface 3.7.1 Overview The MG323 module provides a SIM card interface complying with the ISO 7816-3 standard and supports automatic detection of a 3.0 V SIM card or a 1.8 V SIM card. Table 3-6 lists the SIM card interface signals. Table 3-6 SIM card interface signals Pin No. Signal Name I/O Description 1 SIM_CLK O Clock signal of the SIM card 3 VSIM O Power supply of the SIM card 5 SIM_DATA I/O Data signal of the SIM card 7 SIM_RST O Reset signal of the SIM card 11 GND Ground signal of the SIM card 3.7.2 Circuit Recommended for the SIM Card Interface As the MG323 module is not equipped with a SIM card socket, you need to place a SIM card socket on the user interface board. The SIM card signals are transmitted outwards through the 50-pin B2B connector interface. Figure 3-10 shows the circuit of the SIM card interface. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 22 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-10 Circuit of the SIM card interface To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the SIM card socket should be placed near the B2B connector interface (it is recommended that the PCB circuit connecting the B2B connector interface and the SIM card socket not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the SIM_CLK and SIM_DATA signal wires with a ground wire. The GND pin of the SIM card socket and the GND pin of the SIM card must be well connected to the power GND pin supplying power to the MG323 module. A 0.1 µF capacitor or a 0.22 µF capacitor is placed between the VSIM and GND pins in parallel. Three 33 pF capacitors are placed between the SIM_DATA and GND pins, the SIM_RST and GND pins, and the SIM_CLK and GND pins in parallel to filter interference from RF signals. You do not need to pull the SIM_DATA pin up during design as a 15000-ohm resistor is used to connect the SIM_DATA pin to the VSIM pin. 3.7.3 ESD Protection for the SIM Card Interface It is recommended that you take electrostatic discharge (ESD) protection measures near the SIM card socket. Figure 3-11 shows ESD protection circuit of the SIM card, in which the transient voltage suppressor (TVS) diode is placed as near as possible to the SIM card socket, and the GND pin of the ESD protection component is well connected to the power GND pin that supplies power to the MG323 module. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 23 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-11 ESD protection circuit on the SIM card 3.8 Audio Interface 3.8.1 Overview The MG323 module provides two types of audio interfaces: one is for handsets, the other is for headsets. The audio interfaces of the MG323 module support input from handset microphones and headset microphones, and provide output that supports 32 Ω handsets and 16 Ω headsets. Differential signal lines are recommended for the microphone interface and the speaker interface. Single-ended signal lines are not recommended. The reception gain can be adjusted by using software. A microphone with an equivalent load of 2.2 kΩ is recommended, because both the pull-up resistor and the pull-down resistor of the two types of differential signal lines for the microphone are 1 kΩ. 3.8.2 Speaker Interface The MG323 module provides two types of audio interfaces that respectively support 32 Ω handsets and 16 Ω headsets. 33 pF capacitors are added for filtering radio frequency interference. Differential signal lines are recommended for the speaker interface. Consider the drive capability of the module when using a speaker with greater power. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 24 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-12 External circuit for 32 Ω handsets/16 Ω headsets Table 3-7 Required speaker power for 32 Ω handsets/16 Ω headsets Speaker Load Total Harmonic Distortion Power (Typical) 32 Ω (handset) THD < 0.1% 91 mW 32 Ω (handset) THD < 1% 96 mW 16 Ω (headset) THD < 0.1% 127 mW 16 Ω (headset) THD < 1% 144 mW The specifications listed in Table 3-7 are based on the specified working temperature of the module. 3.8.3 Microphone Interface A microphone with an equivalent load of 2.2 kΩ is recommended, because both the pull-up resistor and the pull-down resistor of the two types of differential signal lines for the microphone are 1 kΩ. It is recommended that ESD components and 33 pF capacitors be added to the interface to reduce radio frequency interference. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 25 HUAWEI MG323 GSM M2M Module Hardware Guide Description of the Application Interfaces Figure 3-13 External circuit for the microphone interface Total Harmonic Distortion Internal Settings of the Module Supported Input from Microphones THD < 1% F = 1kHz, pre-amp gain = 20dB, PGA gain = 14 dB 15.4 mV (typical) THD < 5% F = 1kHz, pre-amp gain = 0B, PGA gain = 0 dB 740 mV (typical) The specifications listed in the preceding table are based on the ambient temperature ranging from –30°C to + 75°C when the module is working. It is recommended that ESD components be added to the external circuit of the audio interface to protect the module. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 26 HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface 4 Antenna Interface 4.1 About This Chapter An RF connector or an antenna pad can be used as the connection method of an antenna interface. When the MG323 module works properly, only one of the preceding connection methods is used. In addition, the antenna interface must be used with coaxial cables with 50 ohm characteristic impedance. 4.2 Antenna Installation The MG323 module supports the following two antenna connection methods: buckled RF connector U.FL-R-SMT-1(80) manufactured by Hirose, and antenna pad. It is recommended that you use the buckled RF connector. When the MG323 module works properly, only one antenna connection method can be used; otherwise, the RF performance may deteriorate. If a buckled RF connector is used, it is recommended that you use a 50-ohm coaxial cable in the U.FL series. The height of the connector increases by 0.8 mm when this cable is used. If an antenna pad is used, you need to connect the coaxial cable core to the pad. In addition, you need to connect the shield ground of the coaxial cable to the reference ground near the pad. You can choose a suitable direction to weld the RF cable to meet the installation requirements according to the actual application. When trying to shorten the opening between the coaxial cable core and the shield ground, you also need to prevent a short circuit. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 27 HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface The properties of major materials of the MG323 module are as follows: PCB: FR4 Antenna pad: cheminal nickel-gold pad 4.3 Coaxial Cable and RF Connector The U.FL-R-SMT-1(80) RF connector manufactured by Hirose is used as the antenna interface in the MG323 module. Figure 4-1 shows the RF connector dimensions. Figure 4-1 RF connector dimensions Table 4-1 lists the major specifications of the RF connector. Table 4-1 Major specifications of the RF connector Rated Condition Environmental Condition Frequency range Direct current (DC) to 6 GHz Characteristic impedance 50 ohms Issue 04 (2011-08-22) Temperature range Type Material –40°C to +90°C Shell Phosphor and copper plated with silver Cable core Gold-plated copper wire Insulating material Socket: liquid crystal polyester (LCP) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 28 HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface You can visit http://www.hirose.com for more information about the specifications of the U.FL-R-SMT-1(80) RF connector. It is recommended that you use the Hirose coaxial cable with the RF connector. Figure 4-2 shows the specifications of the coaxial cable working with the RF connector. Figure 4-2 Specifications of the coaxial cable working with the RF connector You can visit http://www.hirose.com for more detailed information about the coaxial cable working with the RF connector. Figure 4-3 shows the connection between the RF connector and the U.FL-LP-040 cable. Figure 4-3 Connection between the RF connector and the U.FL-LP-040 cable Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 29 HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface 4.4 ESD Protection for the Antenna Interface In practical application, pay attention to the ESD protection for the antenna interface of the MG323 module. Incorrect operation may result in permanent damage to the RF components. Figure 4-4 shows the ESD protection circuit recommended for the antenna interface. Figure 4-4 ESD protection circuit recommended for the antenna interface It is recommended that you pay attention to the junction capacitance of the TVS diode when you choose the model of the TVS diode. Ensure that the junction capacitance of the TVS diode is lower than 1 pF. 4.5 RF Specifications of the Antenna Interface Table 4-2 lists the RF specifications of the antenna interface in the MG323 module. Table 4-2 RF specifications of the antenna interface in the MG323 module Specification Uplink frequency range Issue 04 (2011-08-22) Minimum Value GSM-850 Typical Value 824 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Maximum Value Unit 849 MHz 30 HUAWEI MG323 GSM M2M Module Hardware Guide Specification Antenna Interface Minimum Value (Mobile station to base transceiver station) Typical Value Maximum Value Unit EGSM-900 880 915 MHz GSM-1800 1710 1785 MHz GSM-1900 1850 1910 MHz Downlink frequency range GSM-850 869 894 MHz (Base transceiver station to mobile station) EGSM-900 925 960 MHz GSM-1800 1805 1880 MHz GSM-1900 1930 1990 MHz GSM-850 31 33 35 dBm EGSM-900 31 33 35 dBm GSM-1800 28 30 32 dBm GSM-1900 28 30 32 dBm Transmission power range Number of carrier frequencies Duplex spacing Carrier spacing Multiplex and duplex modes GSM-850 124 EGSM-900 174 GSM-1800 374 GSM-1900 299 GSM-850 25 MHz EGSM-900 45 MHz GSM-1800 95 MHz GSM-1900 60 MHz 200 kHz Frequency division duplexing–time division multiple access (FDD-TDMA) Time slots of each TDMA frame 8 Frame duration 4.615 ms Time slot duration 577 µs Modulation scheme Receiver sensitivity Issue 04 (2011-08-22) Gaussian minimum shift keying (GMSK) GSM-850 –108.5 dBm EGSM-900 –108.5 dBm GSM-1800 –108 dBm GSM-1900 –108 dBm Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 31 HUAWEI MG323 GSM M2M Module Hardware Guide Antenna Interface 4.6 Specifications of the Antenna Interface Table 4-3 lists the recommended specifications of the antenna interface. Table 4-3 Recommended specifications of the antenna interface Working bands 824 MHz–960 MHz and 1710 MHz–1990 MHz Port impedance 50 ohms Voltage standing wave ratio (VSWR) < 2.5 Maximum gain > 0 dBi Antenna efficiency > 60% Polarization Linear polarization or circular polarization Pattern Omnidirectional Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 32 HUAWEI MG323 GSM M2M Module Hardware Guide 5 Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MG323 module, including: Extreme Working Conditions Working and Storage Temperatures and Humidity Electrical Criteria of Application Interfaces Power Supply Features Reliability Features ESD Features 5.2 Extreme Working Conditions Table 5-1 lists the extreme working conditions for the MG323 module. Using the MG323 module beyond these conditions may result in permanent damage to the module. Table 5-1 Extreme working conditions for the MG323 module Symbol Specification Minimum Value Maximum Value Unit VBAT External power voltage –0.4 6.0 V VCOIN Input voltage of standby power for the RTC 2.0 3.15 V VI Data pin voltage –0.4 3.3 V Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 33 HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features 5.3 Working and Storage Temperatures and Humidity Table 5-2 lists the working and storage temperatures and humidity for the MG323 module. Table 5-2 Working and storage temperatures and humidity for the MG323 module Specification Minimum Value Maximum Value Unit Normal working temperatures [1] –20 +70 °C Extreme working temperatures [2] –30 to –20 +70 to +75 °C Ambient temperature for storage –40 +85 °C Moisture 5 95 % [1]: When the MG323 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. [2]: When the MG323 module works at this temperature, certain RF indexes do not comply with the 3GPP TS 45.005 specifications. 5.4 Electrical Criteria of Application Interfaces Table 5-3 lists the sequence numbers of pins and definitions of signals on the 50-pin B2B interface of the MG323 module. Table 5-3 Sequence numbers of pins and definitions of signals on the B2B interface Pin No. Signal Name Pin No. Signal Name 1 SIM_CLK 2 INTEAR_N 3 VSIM 4 INTEAR_P 5 SIM_DATA 6 EXTEAR_P 7 SIM_RST 8 EXTEAR_N 9 NC 10 INTMIC_N 11 GND 12 INTMIC_P 13 NC 14 EXTMIC_P 15 NC 16 EXTMIC_N 17 NC 18 GND Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 34 HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Pin No. Signal Name Pin No. Signal Name 19 NC 20 TERM_ON 21 NC 22 RESET 23 BATT_THERM 24 UART1_DCD 25 LED_STATUS 26 NC 27 NC 28 UART1_CTS 29 UART1_RD 30 NC 31 NC 32 UART1_DTR 33 UART1_TD 34 UART1_RTS 35 VCOIN 36 UART1_DSR 37 NC 38 UART1_RING 39 NC 40 VIO 41 GND 42 VBAT 43 GND 44 VBAT 45 GND 46 VBAT 47 GND 48 VBAT 49 GND 50 VBAT Table 5-4 lists electrical features (typical values) measured when no external device is connected to the MG323 module through the 50-pin B2B interface. Table 5-4 Electrical features of application interfaces Function Signal Name I/O Waveform and Level Power supply VBAT interface P VI = 3.30 V to 4.80 V VItype =3.80 V GND Issue 04 (2011-08-22) P Remarks Pins 42, 44, 46, 48, and 50 are power supply pins used to supply the MG323 module with power. When the module transmits signals at the maximum power, the transient current can reach about 2 A, which may result in VBAT voltage drop. The VBAT power voltage for the MG323 module should not be lower than 3.3 V. Pins 41, 43, 45, 47, and 49 are power GND pins. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 35 HUAWEI MG323 GSM M2M Module Hardware Guide Function Electrical and Reliability Features Signal Name I/O Waveform and Level Remarks BATT_ THERM Pin 23 is used to check the battery temperature through a negative temperature coefficient (NTC) resistor. I This pin can be left floating if it is not used. External VIO power voltage interface P Vomin = 2.70 V Votype = 2.80 V Vomax = 2.95 V Iomax = 10.00 mA Pin 40 is a pin for supplying external devices with power from the MG323 module. Ensure that the external peaks and burst do not damage the VIO interface. If the MG323 module is in Sleep mode, the VIO pin is in the enabled low consumption state (< 500 uA). If the MG323 module is in Power Down mode, the VIO pin is in the disabled state. This pin can be left floating if it is not used. Interface for VCOIN standby power input of the RTC P Vomax = 3.00 V VItype = 3.00 V Pin 35 is a pin for standby power input of the RTC. When the VBAT is not ready for power supply, the RTC can be supplied with power through an external coin battery or capacitor. VImax = 3.15 V This pin can be left floating if it is not used. VImin = 2.00 V IItype = 5.00 μA at VBAT = 0 V Power pin TERM_ON I VILmax = 0.40 V The signal Pin 20 is a pin for powering on the module. Low level is effective. can be detected when low level keeps effective for one second or more. Reset pin RESET I VILmax = 0.40 V The signal can be detected when low level keeps effective for 10 milliseconds or more. Signal of the network status LED LED_STATU S SIM card SIM_RST interface (assuming the SIM_DATA voltage is 3.0 SIM_CLK Issue 04 (2011-08-22) O VoHmin = 2.70 V Pin 22 is a pin for restarting the module. Low level is effective. This pin can be left floating if it is not used. Pin 25 is a pin for controlling the network status LED. This pin can be left floating if it is not used. O Reset signal of the SIM card I/O Data signal of the SIM card O Clock signal of the SIM card Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 36 HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Function Signal Name I/O Waveform and Level Remarks V) VSIM Power voltage of the SIM card P VoHmax = 3.00 V Votype = 2.90 V VoHmin = 2.75 V GND GND of the SIM card SIM card SIM_RST interface (assuming the SIM_DATA voltage is 1.8 SIM_CLK V) VSIM Reset signal of the SIM card Data signal of the SIM card Clock signal of the SIM card VoHmax = 1.95 V Power voltage of the SIM card Votype = 1.80 V VoHmin = 1.65 V GND GND of the SIM card UART1 UART1_RD communicatio UART1_TD n interface O VoLmax = 0.10 V I VoHmin = 2.70 V UART1_RIN G O UART1_DSR O This interface can be used to transmit AT commands and data. VILmax = 0.40 V VIHmin = 2.40 V VIHmax = 3.30 V UART1_RTS I UART1_DTR I UART1_CTS O UART1_DCD O Analog audio interface EXTMIC_N AI Negative end of differential headset MIC input through channel 2 EXTMIC_P AI Positive end of differential headset MIC input through channel 2 INTMIC_P AI Positive end of differential handset MIC input through channel 1 INTMIC_N AI Negative end of differential handset MIC input through channel 1 EXTEAR_N AO Negative end of differential speaker output through channel 2 EXTEAR_P AO Positive end of differential speaker output through channel 2 INTEAR_P AO Positive end of differential speaker audio output through channel 1 Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 37 HUAWEI MG323 GSM M2M Module Hardware Guide Function NC pin Electrical and Reliability Features Signal Name I/O Waveform and Level Remarks INTEAR_N Negative end of differential speaker audio output through channel 1 AO NC Pins 9, 13, 15, 17, 19, 21, 26, 27, 30, 31, and 39 are internal pins. These pins need to be left floating when they are used. P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal output. 5.5 Power Supply Features 5.5.1 Input Power Supply Table 5-5 lists the requirements for input power of the MG323 module. Table 5-5 Requirements for input power of the MG323 module Parameter Minimum Value Typical Value Maximum Value Unit VBAT 3.3 3.8 4.8 V VCOIN 2 3 3.15 V 5.5.2 Working Current Table 5-6 lists the working current of the MG323 module. Table 5-6 Working current of the MG323 module Working Mode Maximum Value Unit Power-off mode 47 µA Standby mode DRX = 2 mA I < 3.0 DRX = 5 mA I < 2.5 DRX = 9 mA I < 2.0 GPRS mode Issue 04 (2011-08-22) 460 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. mA 38 HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features 5.6 Reliability Features Table 5-7 lists the test conditions and results of the mechanical reliability of the MG323 module. Table 5-7 Test conditions and results of the mechanical reliability of the MG323 module Item Test Condition Standard Low-temperature storage Temperature: –40 ºC ± 2ºC IEC60068 High-temperature storage Temperature: 85 ºC ± 2ºC Low-temperature working Temperature: –30 ºC ± 2ºC High-temperature working Temperature: 75 ºC ± 2ºC Damp heat cycling High temperature: 55 ºC ± 2ºC Test duration: 24 h IEC60068 Test duration: 24 h IEC60068 Test duration: 24 h IEC60068 Test duration: 24 h IEC60068 Low temperature: 25 ºC ± 2ºC Humidity: 95% Repetition times: 4 Test duration: 12 h + 12 h Temperature shock Low temperature: –40 ºC ± 2ºC IEC60068 High temperature: 85 ºC ± 2ºC Temperature change interval: < 30s Test duration: 15 min Repetition times: 100 Condensation test Temperature: –40 ºC ± 2°C IEC60068 Time for keeping condensed: 2 h Recovery temperature: 25 ºC ± 2°C Recovery time: 5 min Repetition times: 6 Dust density: 2 kg/m3 Dust test IEC60068 Dust type: dry talcum powder Size requirement: < 75 µm Duration: 8 h Salty fog test Temperature: 35°C IEC60068 Density of the NaCl solution: 5±1% Spraying interval: 8 h Duration of exposing the module to the temperature of 35°C: 16 h Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 39 HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sun exposure Radiation strength: 1120 W/m2 IEC60068 Duration: 20 h Repetition time: 3 Sine vibration Frequency range: 5 Hz to 200 Hz Acceleration: 10 m/s IEC60068 2 Frequency scan rate: 1 oct/min Test period: 3 axial directions. Five circles for each axial direction. Shock test Half-sine wave shock Peak acceleration: 300 m/s IEC60068 2 Shock duration: 11 ms Test period: 6 axial directions. One shock for each axial direction. Clash test Half-sine wave Peak acceleration: 180 m/s IEC60068 2 Pulse duration: 6 ms Repetition time: 6 directions. 1000 times for each direction. Drop test First case: 0.3 m in height. Drop the MG323 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. IEC60068 Second case: 0.8 m in height. Drop the MG323 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 40 HUAWEI MG323 GSM M2M Module Hardware Guide Electrical and Reliability Features 5.7 ESD Features Pay great attention to ESD protection when using the MG323 module. To ensure that the working reference GND is connected to the MG323 module and user interface board properly, you are recommended not to spray a coated insulation on the structure fixing hole (connecting with the main reference GND of the user interface board) and connect the hole with the MG323 module through the metal fastener or other low-resistance fastener. For specific installation method and fastener specification, see “6.4 MG323 Module Installation Description." Table 5-8 lists the test results of the ESD performance of the MG323 module according to the EN61000-4-2 standard. Table 5-8 ESD performance ESD Test Standard Contact Discharge Air Discharge EN61000-4-2 ±4 kV ±8 kV Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 41 HUAWEI MG323 GSM M2M Module Hardware Guide Structure 6 Structure 6.1 Overview This chapter describes the dimensions of the MG323 module, including: Dimensions Dimensions of the B2B Connector MG323 Module Installation Description Specification Selection for Fasteners 6.2 Dimensions Dimensions (L x W x H): 35 mm 0.15 mm x 32.5 mm 0.15 mm x 3.05 mm 0.3 mm (the dimensions of the B2B connector are counted) 35 mm 0.15 mm x 32.5 mm 0.15 mm x 2.85 mm 0.20 mm (the dimensions of the B2B connector are not counted) Figure 6-1 shows the dimensions. Weight: 5.8 g Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 42 HUAWEI MG323 GSM M2M Module Hardware Guide Structure Figure 6-1 Dimensions of the MG323 module (unit: mm) Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 43 HUAWEI MG323 GSM M2M Module Hardware Guide Structure 6.3 Dimensions of the B2B Connector The MG323 module uses the 50-pin B2B connector whose model is DF12C(3.0)50DS-0.5V(81) and whose pin spacing is 0.5 mm to work with the connector DF12E (3.0)-50DP-0.5V (81) of the DF12 series (both connectors are manufactured by Hirose). For specific models, access http://www.hirose.com. Figure 6-2 DF12C (manufactured by Hirose) used on the MG323 module Figure 6-3 DF12E (manufactured by Hirose) recommended to be used with the MG323 module on the user interface board Table 6-1 Ordered connector model and DF12 product series working with the MG323 module Item Model Stacking Height (mm) HRS Number Connector model used with the MG323 module DF12C(3.0)-50DS0.5V(81) 3.0 537-0694-9-81 Connector model recommended to be used on the user interface board DF12E(3.0)-50DP0.5V(81) 3.0 537-0834-6-** Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 44 HUAWEI MG323 GSM M2M Module Hardware Guide Structure Figure 6-4 Dimensions of the connector used on the MG323 module (unit: mm) 6.4 MG323 Module Installation Description Three structure fixing holes (diameter: 2 mm) are reserved in the MG323 module. The holes are not sprayed with a coated insulation and connected with the main reference GND of the module, as shown in Figure 6-5 . Figure 6-5 Structure fixing hole You can insert machine screws through the structure fixing holes and metal fasteners and fasten with nuts to firmly connect the MG323 module to the user interface board [1]. The metal fastener is placed between the MG323 module and user interface Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 45 HUAWEI MG323 GSM M2M Module Hardware Guide Structure board and functions as a brace and connects the MG323 module and user interface board through the reference GND. Below the user interface board, the nuts are used to fasten the screws. Figure 6-6 shows the MG323 module installation. Figure 6-6 MG323 module installation [1]: Pay great attention to ESD protection when using the MG323 module. To ensure that the working reference GND is connected to the MG323 module and user interface board properly, you are recommended not to spray a coated insulation on the structure fixing hole (connecting with the main reference GND of the user interface board) and connect the hole with the MG323 module through the metal fastener or other low-resistance fastener. Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 46 HUAWEI MG323 GSM M2M Module Hardware Guide Structure 6.5 Specification Selection for Fasteners To ensure that the MG323 module is firmly fixed on the interface board when using the MG323 module, you are recommended to you use the M1.6 or M1.8 machine screw. You can also customize the screws. The fastener components in the following figures are recommended. The machine screw dimensions are M1.6×7.5×3.0×1.0. It is recommended that you plate gold on the metal fastener. Figure 6-7 shows the specific dimensions for the fastener components. Figure 6-7 Machine screw dimensions Protecting from Screw Loosening Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 47 HUAWEI MG323 GSM M2M Module Hardware Guide Structure Figure 6-8 Nut dimensions Figure 6-9 Metal fastener dimensions Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 48 HUAWEI MG323 GSM M2M Module Hardware Guide 7 Appendix A Circuits of Typical Interfaces Appendix A Circuits of Typical Interfaces Figure 7-1 Circuits of typical interfaces in the MG323 module Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 49 HUAWEI MG323 GSM M2M Module Hardware Guide 8 Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion B2B Board-to-Board CE European Conformity CS Coding Scheme CSD Circuit Switched Data DC Direct Current DCE Data Circuit-terminating Equipment DMA Direct Memory Access DTE Data Terminal Equipment EIA Electronic Industries Association EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Conformity FCC Federal Commnications Commission FDD-TDMA Frequency Division Duplexing–time Division Multiple Access GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service ISO International Standards Organization LCP Liquid Crystal Polyester LDO Low-Dropout LED Light-emitting Diode MCP Multi-chip Package Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 50 HUAWEI MG323 GSM M2M Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion NTC Negative Temperature Coefficient PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances RTC Real-time Clock SIM Subscriber Identity Module TTL Transistor-transistor Logic TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver-transmitter VSWR Voltage Standing Wave Ratio Issue 04 (2011-08-22) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 51