Preliminary Data Sheet PD166105GS R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 MOS INTEGRATED CIRCUIT Description The PD166105 is a high-voltage, dual output, and N-channel low-side intelligent power device with built-in overtemperature-protection, overcurrent-limitation, and disconnection-detection circuits. It protects itself by shutting down or limiting current when it detects overtemperature or overcurrent. Output MOS shut down is restarted automatically by cooling of the chip temperature. When load is normal, a diagnostic output is produced on detection of a flyback voltage. When load is disconnected, diagnostic output stops. Features High voltage dual output low side driver Built-in overcurrent limitation circuits and overtemperature protection circuits Shuts down by overtemperature detection Restarts automatically after cooling Built-in dynamic clamping circuit (100 V Min.) Built-in disconnection-detection circuit A diagnostic output is produced on detection of a flyback voltage. Diagnostic output stops on disconnection. Low on-state resistance High temperature operation (Tch = 175°C Max.) Small 20-pin SOP package Application Injector driver Ordering Information Part No. PD166105GS-E1-AY PD166105GS-E2-AY R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Lead Plating Sn Sn Packing Tape 2500 p/reel Tape 2500 p/reel Package 20-pin plastic SOP (7.62 mm (300)) 20-pin plastic SOP (7.62 mm (300)) Page 1 of 15 PD166105GS Block Diagram VCC1 IN1 Dynamic Clamping Circuit OUT1 Input Circuit Overtemperature Protection Output MOS (N-ch) Current Limitation DIAG1 Disconnection Detection OUT1 Ch1 VCC2 OUT2 DIAG2 IN2 GND2 Ch2 Pin Configuration 20-pin plastic SOP (7.62 mm (300)) OUT1 IN1 DIAG1 VCC1 OUT1 OUT2 IN2 DIAG2 VCC2 OUT2 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 OUT1 GND1 GND1 GND1 OUT1 OUT2 GND2 GND2 GND2 OUT2 (Top view) Pin Name Pin No. 1 2 3 4 5 Pin Name OUT1 IN1 DIAG1 VCC1 OUT1 R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Pin No. 6 7 8 9 10 Pin Name OUT2 IN2 DIAG2 VCC2 OUT2 Pin No. 11 12 13 14 15 Pin Name OUT2 GND2 GND2 GND2 OUT2 Pin No. 16 17 18 19 20 Pin Name OUT1 GND1 GND1 GND1 OUT1 Page 2 of 15 PD166105GS Absolute Maximum Ratings (Ta = 25°C, unless otherwise specified) Item Input voltage Power supply voltage Output voltage Output current DIAG output voltage DIAG output current Power dissipation Channel temperature Storage temperature Note: Symbol VIN VCC1 VCC2 VCC3 VOUT IO(DC) VDIAG IDIAG PD Tch Tstg Rating –1.5 to +7.0 –0.5 to +18 24 35 100 SELF LIMITED 7 20 2.4 –40 to +175 –55 to +175 Unit V V V V V A/ch V mA W °C °C Condition DC 60 s 1s Except the clamping voltage at the flyback time VIN = 5 V, DC Ta = 25°C, both channels are ON Note When mounted on 50 mm 50 mm 1.6 mm epoxy PCB FR4 substrate with 600 mm2 70 m copper foil. Caution: Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameters. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and conditions indicated for DC characteristics and AC characteristics represent the quality assurance range during normal operation. R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Page 3 of 15 PD166105GS Electrical Characteristics (VCC = 5 to 18 V, Tch = –40 to +175°C, unless otherwise specified) Item High level input voltage Low level input voltage High level input current Low level input current Power supply current Output on-state resistance Symbol VIH VIL IIH IIL ICC1 ICC2 RDS(ON)1 MIN. 3.0 — — –10 — — — TYP. — — — — — — 64 MAX. — 1.5 300 +10 10 10 91 Unit V V A A mA/ch mA/ch m Condition Rin = 1 k, VDS = 0.3 V, IO = 1.4 A Rin = 1 k, VDS = 20 V, IO = 1 mA VIN = 5.5 V, VDS = 0 V VIN = 0 V, VDS = 20 V VIN = 16 V, ON condition VIN = 16 V, OFF condition RDS(ON)2 — 117 207 m IO = 1.4 A, Tch = 175°C, VIN = VIH, VCC = 16 V — — — — — — 130 35 35 30 15 350 130 — s s s s A V mV/°C Turn on time Rise time Turn off time Fall time Output leakage current Clamp voltage ton tr toff tf IDSS VOUT Temperature characteristics of clamp voltage VZ 3.5 — — — — 100 — Overtemperature detection temperature Current limitation Flyback detection voltage DIAG response time THI 175 — — °C ILIM VFB tDIAG 1.7 33 0 — — — — 83 5 A V s DIAG on-state resistance RDIAG(ON)1 RDIAG(ON)2 DIAG output leakage current IDIAGLEAK — — — — — — 1.4 40 0.83 1.54 3.0 60 k k A A R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 IO = 1.4 A, Tch = 25°C, VIN = VIH, VCC = 16 V VIN = 0 5 V, Rin = 1 k, RL = 8 , VCC = 12 V, Tch = 0 to 175°C VIN = 5 0 V, Rin = 1 k, RL = 8 , VCC = 12 V, Tch = 0 to 175°C VIN = 0 V, VDS = 18 V IO = 10 mA, Tch = 25°C, VIN = 0 V IO = 1.4 A, VIN = VIL, L = 1 mH VIN = 5 V, VCC = 6 to 18 V IO = 1.4 A, L = 1 mH, VDIAG = 5 V, RDIAG = 51 k VCC = 16 V, IODIAG = 2.4 mA VCC = 6 V, IODIAG = 1.3 mA VDIAG = 5 V, Tch = 25°C VDIAG = 5 V, Tch = 175°C Page 4 of 15 PD166105GS Switching Measurement Waveform IN Waveform 50% 50% toff ton tr OUT Waveform tf 90% 90% 10% 10% DIAG Output Measurement Waveform IN Waveform 50% 50% ton toff OUT Waveform tr VFB tf 90% 10% 10% tDIAG DIAG Waveform tDIAG 90% 10% 12 V 12 V 5V R L: 8 Ω DIAG VCC VO OUT Rin: 1 kΩ RDIAG: 51 kΩ VODIAG DIAG L: 1 mH VCC VO OUT Rin: 1 kΩ IN IN GND VIN Switching Measurement Circuit R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 GND VIN DIAG Output Measurement Circuit Page 5 of 15 PD166105GS Outline of Functions Input Circuit (On/Off Control) Output MOS turns on when the high-level input voltage (3.0 V or more) is applied to IN terminal. Output MOS turns off when the low-level input voltage (1.5 V or less) is applied to IN terminal. "H" 5V VIN GND VOUT VOUT (Resistance load) GND "H" "H" "L" "L" "L" "L" OFF OFF OFF OFF ON ON ON Dynamic Clamp Circuit This circuit is for protection of output and other circuits from the overvoltage by back electromotive force when inductive load turns off. The clamp diode is connected between drain and gate of output. Output voltage is clamped by this circuit when the voltage of the OUT terminal exceeded the output clamping voltage. "H" 5V VIN GND VOUT VOUT (Inductive load) GND "L" "L" VZ OFF OFF ON Current Limitation Circuit This circuit prevents destruction from the overcurrent when the short-circuit occurs. When the overcurrent flows to the OUT terminal such as short-circuit condition, the output current is limited. Power supply voltage to OUT terminal should be 18 V or less when the short-circuit occurs. Overtemperature Protection Circuit This circuit prevents destruction from overtemperature. The channel temperature of the output is monitored and the output is shut down when overtemperature is detected. Output restarts automatically after the channel cooled down. VIN VOUT Tch R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 "H" 5V GND VCC GND "L" "L" OFF OFF ON OFF ON THI Page 6 of 15 PD166105GS Disconnection Detection Circuit The signal on the DIAG pins goes to the low level in synchronization with the generation of flyback voltage when an inductive load is being driven. The high level is output on the DIAG pin when the inductive load is disconnected. VIN "H" 5V GND "L" "L" "L" Disconnection VOUT VOUT (Inductive load) GND VDIAG R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 5V OFF OFF ON "H" OFF ON "H" GND Page 7 of 15 PD166105GS Typical Characteristics HIGH LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE HIGH LEVEL INPUT VOLTAGE vs. SUPPLY VOLTAGE 3.5 VIH - High Level Input Voltage - V VIH - High Level Input Voltage - V 3.5 3.0 2.5 2.0 1.5 1.0 0 5 10 15 2.0 1.5 0 50 100 150 200 VCC - Supply Voltage - V Ta - Ambient Temperature - °C LOW LEVEL INPUT VOLTAGE vs. SUPPLY VOLTAGE LOW LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE 3.5 VIL - Low Level Input Voltage - V VIL - Low Level Input Voltage - V 2.5 1.0 –50 20 3.5 3.0 2.5 2.0 1.5 1.0 0 5 10 15 3.0 2.5 2.0 1.5 1.0 –50 20 0 50 100 150 200 VCC - Supply Voltage - V Ta - Ambient Temperature - °C HIGH LEVEL INPUT CURRENT vs. SUPPLY VOLTAGE HIGH LEVEL INPUT CURRENT vs. AMBIENT TEMPERATURE 300 300 IIH - High Level Input Current - μA IIH - High Level Input Current - μA 3.0 250 200 150 100 50 0 0 5 10 15 VCC - Supply Voltage - V R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 20 250 200 150 100 50 0 –50 0 50 100 150 200 Ta - Ambient Temperature - °C Page 8 of 15 PD166105GS OPERATING CURRENT vs. AMBIENT TEMPERATURE OUTPUT LEAKAGE CURRENT vs. AMBIENT TEMPERATURE 300 5.0 ICC2 3.0 2.0 1.0 0 50 100 150 250 200 150 100 50 0 –50 200 100 150 200 TURN ON TIME vs. AMBIENT TEMPERATURE TURN OFF TIME vs. AMBIENT TEMPERATURE 25 20 20 15 10 5 0 50 100 150 15 10 5 0 –50 200 0 50 100 150 200 Ta - Ambient Temperature - °C Ta - Ambient Temperature - °C RISE TIME vs. AMBIENT TEMPERATURE FALL TIME vs. AMBIENT TEMPERATURE 25 25 20 20 15 10 15 10 5 5 0 –50 50 Ta - Ambient Temperature - °C 25 0 –50 0 Ta - Ambient Temperature - °C toff - Turn Off Time - μs ton - Turn On Time - μs ICC1 4.0 0 –50 tr - Rise Time - μs IDSS - Output Leakage Current - μA 6.0 tf - Fall Time - μs ICC - Operating Current - mA 7.0 0 50 100 150 Ta - Ambient Temperature - °C R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 200 0 –50 0 50 100 150 200 Ta - Ambient Temperature - °C Page 9 of 15 PD166105GS ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 3.0 PT - Total Power Dissipation - W 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 –50 0 50 100 150 VFB - Flyback Detection Voltage - V 2.0 1 unit 1.5 1.0 0.5 0 50 100 150 Ta - Ambient Temperature - °C Ta - Ambient Temperature - °C FLYBACK DETECTION VOLTAGE vs. AMBIENT TEMPERATURE DIAG ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE 90 80 70 60 50 40 30 –50 2.5 2 units 0 –50 200 0 50 100 150 200 Ta - Ambient Temperature - °C RDIAG(ON) - DIAG On-state Resistance - kΩ RDS(ON) - On-state Resistance - Ω 0.16 200 1.0 0.8 0.6 VCC = 6 V 0.4 VCC = 16 V 0.2 0 –50 0 50 100 150 200 Ta - Ambient Temperature - °C IDIAGLEAK - DIAG Leakage Current - μA DIAG LEAKAGE CURRENT vs. AMBIENT TEMPERATURE 60 50 40 30 20 10 0 –50 0 50 100 150 200 Ta - Ambient Temperature - °C R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Page 10 of 15 PD166105GS Transient Thermal Resistance Characteristics TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH Rth(t) - Transient Thermal Resistance - °C/W 1000 Device on 50 mm × 50 mm × 1.6 mm epoxy PCB FR4 with 600 mm2 of 70 μm copper area 100 Rth(ch-a) = 62.5°C/W Rth(ch-c) = 16.5°C/W 10 1 0.1 1m 10 m 100 m 1 10 100 1000 PW - Pulse Width - s Application Example 1 VBAT Rin: ex. 470 Ω R1: ex. 1 kΩ Q1: ex. Part No. GN4N2M(0)-T1-AT VCC1 VCC2 Injector Rin IN1 Rin Rin OUT1 DIAG1 μPD166105 Injector IN2 DIAG2 Rin GND1 OUT2 GND2 Power GND 5V Micro computer VCC1 Q1 IN1 VCC2 OUT1 DIAG1 μPD166105 R1 Injector IN2 DIAG2 GND1 GND Injector OUT2 GND2 Power GND Caution: This application circuit is example and not intended for use in actual mass production design. R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Page 11 of 15 PD166105GS Application Example 2 VBAT Rin: ex. 470 Ω VCC1 VCC2 Injector Rin IN1 Rin OUT1 DIAG1 μPD166105 Rin Injector IN2 DIAG2 Rin GND1 OUT2 GND2 Power GND 5V Micro computer R1 R2 VCC1 IN1 VCC2 Injector OUT1 DIAG1 μPD166105 Injector IN2 DIAG2 GND1 GND OUT2 GND2 Power GND Caution: This application circuit is example and not intended for use in actual mass production design. R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Page 12 of 15 PD166105GS Package Drawing 20-Pin Plastic SOP (7.62 mm (300)) 20 11 detail of lead end 3° +7° –3° 1 10 12.7±0.3 7.7±0.3 5.6±0.2 1.55±0.05 1.1 S 1.27 0.42+0.08 –0.07 0.78 MAX. 0.12 M 0.6±0.2 0.22+0.08 –0.07 0.10 S 0.1±0.1 1.8 MAX. R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Page 13 of 15 PD166105GS Taping Information There are two types (E1, E2) of directions of the device in the career tape. E1: Pin 1 of the device faces toward the open end of the tape, away from the reel Pin 1 indication Tape drawout direction E2: Pin 1 of the device faces away from the open end of the tape, toward the reel Pin 1 indication Marking Information This figure indicates the marking items and arrangement. However, details of the letterform, the size and the position aren't indicated. D166105GS JAPAN Pin 1 indication R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Part No. Lot number Lead-free mark Page 14 of 15 PD166105GS Recommended Soldering Conditions The PD166105 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact a Renesas Electronics sales representative. For technical information, see the following website. Semiconductor Package Mount Manual (http://www.renesas.com/prod/package/manual/) PD166105GS-E1-AY: 20-pin plastic SOP (7.62 mm (300)) PD166105GS-E2-AY: 20-pin plastic SOP (7.62 mm (300)) Soldering Method Soldering Conditions Infrared reflow Peak package's surface temperature: 260°C, Reflow time: 60 seconds or less (220°C or higher), Maximum allowable number of reflow processes: 3, Exposure Note : 7 days (10 to 72 hours pre-backing is required at 125°C afterwards), limit Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. <Caution> Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before unpacking. Partial Heating Method Pin temperature: 350°C or below, Heat time: 3 seconds or less (per each side of the device), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Note: Symbol IR60-107-3 — The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a relative humidity of 20 to 65% after dry-pack package is opened. R07DS0604EJ0100 Rev.1.00 Jan 19, 2012 Page 15 of 15 PD166105GS Data Sheet Revision History Rev. 1.00 Date Jan 19, 2012 Description Summary Page — First Edition Issued All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. 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