To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET GaAs INTEGRATED CIRCUIT μPG2413T6M SP3T SWITCH FOR Bluetooth TM AND 802.11b/g DESCRIPTION The μPG2413T6M is a GaAs MMIC SP3T switch which was developed for Bluetooth, wireless LAN. This device can operate frequencies from 0.5 to 3.0 GHz, with low insertion loss. This device is housed in a 12-pin plastic TSQFN (Thin Small Quad Flat Non-leaded) (T6M) package and is suitable for high-density surface mounting. FEATURES • Switch Control voltage : Vcont (H) = 3.0 V TYP., Vcont (L) = 0 V TYP. • Low insertion loss : Lins = 0.35 dB TYP. @ f = 1.0 GHz : Lins = 0.45 dB TYP. @ f = 2.0 GHz : Lins = 0.50 dB TYP. @ f = 2.5 GHz • High isolation : ISL = 26 dB TYP. @ f = 1.0 GHz : ISL = 20 dB TYP. @ f = 2.0 GHz : ISL = 18 dB TYP. @ f = 2.5 GHz • Handling power : Pin (0.1 dB) = +28.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 12-pin plastic TSQFN (T6M) package (2.0 × 2.0 × 0.37 mm) APPLICATIONS • Bluetooth and IEEE802.11b/g etc. ORDERING INFORMATION Part Number Order Number Package Marking μPG2413T6M-E2 μPG2413T6M-E2-A 12-pin plastic TSQFN 2413 (T6M) (Pb-Free) Supplying Form • Embossed tape 8 mm wide • Pin 10, 11, 12 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2413T6M Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10792EJ01V0DS (1st edition) Date Published February 2010 NS Printed in Japan 2010 μPG2413T6M PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) 11 GND GND RF3 11 12 10 12 10 2413 1 2 3 4 5 Pin Name 1 RFC 2 GND 3 Vcont1 4 RF1 5 GND 6 RF2 7 Vcont2 8 GND 9 Vcont3 10 RF3 11 GND 12 GND (Bottom View) 10 11 12 RFC 9 1 Vcont3 9 9 1 8 GND 2 GND 8 8 2 7 Vcont1 3 Vcont2 7 7 3 5 4 6 RF1 GND RF2 6 Pin No. 6 5 4 Remark Exposed pad : GND TRUTH TABLE 2 Vcont1 Vcont2 Vcont3 RFC−RF1 RFC−RF2 RFC−RF3 High Low Low ON OFF OFF Low High Low OFF ON OFF Low Low High OFF OFF ON Data Sheet PG10792EJ01V0DS μPG2413T6M ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings +6.0 Vcont Unit Note V Input Power (Vcont (H) = 1.8 V) Pin +26 dBm Input Power (Vcont (H) = 2.3 V) Pin +28 dBm Input Power (Vcont (H) = 3.0 V) Pin +32 dBm Input Power (Vcont (H) = 3.6 V) Pin +34 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note ⎪Vcont (H) − Vcont (L)⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit f 0.5 − 3.0 GHz Switch Control Voltage (H) Vcont (H) 1.8 3.0 3.6 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V ΔV −0.1 0 0.1 V ΔV −0.1 0 0.1 V Operating Frequency Control Voltage Difference (H) cont (H) Note1 Control Voltage Difference (L) cont (L) Note2 Notes 1. ΔVcont (H) is a difference between the maximum and the minimum control voltages among Vcont1 (H), Vcont2 (H) and Vcont3 (H). 2. ΔVcont (L) is a difference between the maximum and the minimum control voltages among Vcont1 (L), Vcont2 (L) and Vcont3 (L). Data Sheet PG10792EJ01V0DS 3 μPG2413T6M ELECTRICAL CHARACTERISTICS 1 (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Symbol Pass Test Conditions MIN. TYP. MAX. Unit Lins RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz − 0.35 0.60 dB f = 1.0 to 2.0 GHz − 0.45 0.70 dB f = 2.0 to 2.5 GHz − 0.50 0.75 dB f = 2.5 to 3.0 GHz − 0.60 − dB RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz 23 26 − dB (OFF) f = 1.0 to 2.0 GHz 17 20 − dB f = 2.0 to 2.5 GHz 15 18 − dB f = 2.5 to 3.0 GHz − 16 − dB RLC f = 0.5 to 3.0 GHz 15 20 − dB Return Loss (RF1, 2, 3) RL1, 2, 3 f = 0.5 to 3.0 GHz 15 20 − dB 0.1 dB Loss Compression Pin (0.1 dB) RFC to RF1, 2, 3 f = 2.5 GHz +25.0 +28.0 − dBm Pin (1 dB) RFC to RF1, 2, 3 f = 2.5 GHz, − +27.0 − dBm − +31.0 − dBm − +33.0 − dBm − 75 − dBc − 75 − dBc Insertion Loss Isolation ISL Return Loss (RFC) Input Power Note 1 1 dB Loss Compression Note 2 Input Power Vcont (H) = 2.3 V f = 2.5 GHz, Vcont (H) = 3.0 V f = 2.5 GHz, Vcont (H) = 3.6 V 2nd Harmonics 2f0 f = 2.5 GHz, Pin = 23 dBm 3rd Harmonics 3f0 f = 2.5 GHz, Pin = 23 dBm Switch Control Current Icont No RF input − 0.1 5.0 μA Switch Control Speed tSW 50% CTL to − 50 − ns 90/10% RF Notes 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. Caution It is necessary to use DC blocking capacitors with this device. 4 Data Sheet PG10792EJ01V0DS μPG2413T6M ELECTRICAL CHARACTERISTICS 2 (TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Symbol Pass Test Conditions MIN. TYP. MAX. Unit Lins RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz − 0.35 0.65 dB f = 1.0 to 2.0 GHz − 0.45 0.75 dB f = 2.0 to 2.5 GHz − 0.50 0.80 dB f = 2.5 to 3.0 GHz − 0.65 − dB RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz 22.5 25.5 − dB (OFF) f = 1.0 to 2.0 GHz 16.5 19.5 − dB f = 2.0 to 2.5 GHz 14.5 17.5 − dB f = 2.5 to 3.0 GHz − 15.5 − dB RLC f = 0.5 to 3.0 GHz 15 20 − dB Return Loss (RF1, 2, 3) RL1, 2, 3 f = 0.5 to 3.0 GHz 15 20 − dB 0.1 dB Loss Compression Pin (0.1 dB) RFC to RF1, 2, 3 f = 2.5 GHz +19.0 +22.0 − dBm Pin (1 dB) RFC to RF1, 2, 3 f = 2.5 GHz +21.0 +25.0 − dBm f = 2.5 GHz, − 75 − dBc − 75 − dBc Insertion Loss Isolation ISL Return Loss (RFC) Input Power Note 1 1 dB Loss Compression Input Power Note 2 2nd Harmonics 2f0 Pin = 17 dBm 3rd Harmonics 3f0 f = 2.5 GHz, Pin = 17 dBm Switch Control Current Icont No RF input − 0.1 5.0 μA Switch Control Speed tSW 50% CTL to − 50 − ns 90/10% RF Notes 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. Caution It is necessary to use DC blocking capacitors with this device. Data Sheet PG10792EJ01V0DS 5 μPG2413T6M EVALUATION CIRCUIT RF3 56 pF 12 11 10 56 pF RFC 1 Vcont3 9 1 000 pF Vcont1 2 8 3 7 Vcont2 1 000 pF 1 000 pF 4 5 6 56 pF 56 pF RF1 RF2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION CB Switch LESD CB CB • CB are DC blocking capacitors external to the device. A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. 6 Data Sheet PG10792EJ01V0DS μPG2413T6M TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2/RF3 ISOLATION vs. FREQUENCY RFC-RF1/RF2/RF3 INSERTION LOSS vs. FREQUENCY 0 –0.1 –5 Isolation ISL (dB) Insertion Loss Lins (dB) –0.2 –0.3 Vcont (H) = 3.0 V –0.4 –0.5 –0.7 0.0 –20 –25 3.0 V 1.8 V –35 0.5 1.0 2.0 1.5 2.5 –40 0.0 3.0 0.5 1.0 2.0 1.5 2.5 3.0 Frequency f (GHz) Frequency f (GHz) RETURN LOSS (RFC) vs. FREQUENCY RETURN LOSS (RF1, 2, 3) vs. FREQUENCY Return Loss (RF1, 2, 3) RL1, 2, 3 (dB) 0 Return Loss (RFC) RLC (dB) Vcont (H) = 1.8 V –15 –30 –0.6 –5 –10 –15 Vcont (H) = 3.0 V –20 –25 –30 –35 1.8 V –40 0.0 0.5 1.0 2.0 1.5 2.5 3.0 0 –5 –10 –15 Vcont (H) = 3.0 V –20 –25 –30 –35 1.8 V –40 0.0 0.5 1.0 2.0 1.5 2.5 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2/RF3 INSERTION LOSS vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2/RF3 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) –0.1 0 –0.2 –5 Isolation ISL (dB) Insertion Loss Lins (dB) –10 –0.3 f = 1.0 GHz –0.4 –0.5 –0.6 –0.7 1.5 2.0 2.5 3.0 –10 –15 f = 2.5 GHz –20 –25 2.5 GHz 3.5 4.0 3.0 –30 1.5 1.0 GHz 2.0 2.5 3.0 3.5 4.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10792EJ01V0DS 7 μPG2413T6M RETURN LOSS (RF1, 2, 3) vs. SWITCH CONTROL VOLTAGE (H) RETURN LOSS (RFC) vs. SWITCH CONTROL VOLTAGE (H) Return Loss (RF1, 2, 3) RL1, 2, 3 (dB) –5 –10 –15 –20 f = 2.5 GHz –25 –30 1.0 GHz –35 –40 1.5 2.0 2.5 3.5 3.0 4.0 –5 –10 –15 –20 –30 1.0 GHz –35 –40 1.5 2.0 2.5 3.0 3.5 4.0 RFC-RF1/RF2/RF3 Pin (1 dB), Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) 18 15 –0.5 Lins –1.0 Vcont (H) = 3.0 V 12 1.8 V 9 –1.5 6 –2.0 3.0 V 3 –2.5 Icont –3.0 10 15 1.8 V 20 25 30 0 35 Input Power Pin (dBm) 1 dB Loss Compression Input Power Pin (1 dB) (dBm) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) RFC-RF1/RF2/RF3 INSERTION LOSS, Icont vs. INPUT POWER f = 2.5 GHz 34 f = 2.5 GHz 32 30 Pin (1 dB) 28 26 Pin (0.1 dB) 24 22 20 1.5 Remark The graphs indicate nominal characteristics. 8 f = 2.5 GHz –25 Switch Control Voltage (H) Vcont (H) (V) 0 Insertion Loss Lins (dB) 0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Current Icont (μA) Return Loss (RFC) RLC (dB) 0 Data Sheet PG10792EJ01V0DS 1.8 2.1 2.4 2.7 3.0 3.3 3.6 Switch Control Voltage (H) Vcont (H) (V) 3.9 μPG2413T6M MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 12-PIN PLASTIC TSQFN (T6M) (UNIT: mm) MOUNTING PAD 0.77 0.5 0.94 1.15 12–0.23 1.15 0.77 1.15 0.77 0.5 0.5 1.15 0.77 0.5 0.94 SOLDER MASK 12–0.18 1.125 1.125 0.5 0.795 0.73 0.795 1.125 0.795 0.5 0.5 1.125 0.795 0.5 0.73 Solder thickness : 0.1 mm Remark The mounting pad and solder mask layouts in this document are for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. Data Sheet PG10792EJ01V0DS 9 μPG2413T6M PACKAGE DIMENSIONS 12-PIN PLASTIC TSQFN (T6M) (UNIT: mm) 0.37+0.03 –0.05 2.0±0.1 2.0±0.1 (Bottom View) 0.50±0.06 0.94±0.1 A 0.11 MIN. A 0.23+0.07 –0.05 (C 0.17) 0.23±0.1 0.94±0.1 Remark A > 0 ( ): Reference value 10 Data Sheet PG10792EJ01V0DS μPG2413T6M RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10792EJ01V0DS 11 μPG2413T6M Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of February, 2010. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E 12 Data Sheet PG10792EJ01V0DS μPG2413T6M Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.