HKT100***F/HKT100Y01F µ-Chip (RFID) REJ03P0002-0100 Rev.1.00 Feb 16, 2006 Overview • HKT100***F/HKT100Y01F is RFID (Radio Frequency Identification) for 2.45 GHz. • It has a unique ID inside, then it is applicable for management of individual object. Note: "***" or "Y01" is a ROM code. Feature • • • • Thin and small package: COA (Chip on Aluminum) Including unique µ-Chip ID which is not alterable Including a unique ID Communication without contact Note: "µ-Chip" and the µ-Chip Logo are either registered Trademarks or Trademarks of Hitachi,Ltd. in Japan and in other countries. Rev.1.00 Feb 16, 2006 page 1 of 9 HKT100***F/HKT100Y01F Order Type Name Order Type Name HKT100***F HKT100Y01F Unit of Packaging 8,000 min 10,000 Packing Form Reel Reel Outline and Mark Outline Mark First three digits indicate ROM code. Rev.1.00 Feb 16, 2006 page 2 of 9 Unit of Order 75,000 10,000 Note HKT100***F/HKT100Y01F Absolute Maximum Ratings Item Symbol Storage temperature Ambient operation temperature Received power Specification Tstg Min –30 Typ — Max 75 Ta Pr 0 — 25 — 40 13.8 Unit Condition Remark °C °C dBm No condensation Electrical Characteristics Measurement conditions: Unless otherwise specified, Ta = 25°C, fc = 2.416 ± 0.010 GHz, reader power = 150 mW Single-patch antenna, linearity polarized waves, clock cycle = 10 µs, clock duty cycle = 85% Period of reading operations: 8 clock cycles, number of read bits: 128 bits Item Communication distance µ-Chip ID Check Notes: 1. 2. 3. 4. Specification Min 6 — Typ — Max 15 Passed — Unit cm — Condition Remark Note4 Note1 EDC Check Note2, Note3 The distance at which the read µ-Chip ID value matches the indicated value and the EDC check is passed. Verification value calculated from the read µ-Chip ID value. Detail data of µ-Chip ID is describe on the commodity specification. Relation between the inlet and antenna positions; The planes of the copper-foil pattern for the antenna and the antenna itself should be parallel, the center of the inlet should be on the line that passes through the center of the antenna plane, and the inlet copper-foil pattern's longer side should be within the antenna's plane of polarization. Reader Specifications and Type No.: MR-STD2 Item Symbol Specification Unit Ta fc 25 2.416 ± 0.010 °C GHz Power Clock cycle Pw Tclk 150 10 mW µs Clock duty ratio Data read cycle duty Tfm 85 8 % Clock Nb 128 Bits Symbol Specification Unit — L semi-rigid 20 — cm Operation temperature Carrier frequency Data read bit count Remarks Cable Specifications Item Cable material Total length of cable Remarks Antenna Specifications and Type No.: PA1-2450AS Symbol Specification Unit Operation temperature Polarization Item Ta — 25 Linear °C — Number of patches Gain — — 1 7 pcs dBi Rev.1.00 Feb 16, 2006 page 3 of 9 Remarks HKT100***F/HKT100Y01F Dimension of Inlet Outline Tape Dimensions The products, each of which consists of an antenna and chip, are aligned and mounted on tape as shown in the figure below. The chip-mounting section is punched through if the chip is defective. 70.0 ± 0.6 51.5 ± 0.25 All dimensions: mm Antenna 2.375 ± 0.05 Recognition mark: " " (square) type Recognition mark: " " (cross) type 1.5 28.0 1.5 Section A 1.5 ± 0.25 30.0 34.4 Note: Dimensional tolerance is ± 0.2 mm unless otherwise specified. Details for Section A Chip-mounting section (Area of sealant coverage is less than φ1.5 mm) Punched hole for defective part: φ2.0 mm (Typ) Deformations that require punching twice or more are passed over Rev.1.00 Feb 16, 2006 page 4 of 9 HKT100***F/HKT100Y01F Leader and Trailer Sections This product includes leader and trailer sections that precede and follow the product section, i.e. the section that carries the chips, as shown in the figure below. Splicing tape (polyester) Thickness: 0.055 mm All dimensions: mm 2000 ± 200 Leader section (PET) 10.0 ± 0.5 Punched hole for defective part a) First Part Unwound Splicing tape (polyester) Thickness: 0.055 mm 2000 ± 200 Trailer section (PET) 10.0 ± 0.5 b) Final Part Unwound Punched Holes for Defective Part Chips of defective parts will be punched through with the hole size of φ2.0 mm. Rev.1.00 Feb 16, 2006 page 5 of 9 Punched hole for defective part HKT100***F/HKT100Y01F Jointed Segments of Tape This product may include splices, where two tapes are pasted together, as shown below. The number of splices is no more than 5 per reel (excluding the attachment of leader/trailer tapes Note). Products covered by the splicing tape will be punched through as defective parts. A Splicing tape (polyester) Thickness: 0.055 mm Punched hole for defective part B D C Tape on both sides Dimension Description Specification A B The antenna pitch at spliced part Misalignment at spliced point 2.375 ± 0.2 mm ± 0.2 mm C D Splicing tape width Overflow of splicing tape 10.0 ± 0.5 mm < 0.5 mm Note: If leader/trailer parts are broken or spoiled by creases, the tape will be cut and jointed again. The attachment of leader/trailer will not be punched through as defective parts. Rev.1.00 Feb 16, 2006 page 6 of 9 HKT100***F/HKT100Y01F Packing Specifications Packing Specifications and Quantity (1) As shipped, this product is packed in reel. (2) Quantity is 8,000 good pieces/reel Min.Note However, quantity of HKT100Y01F is 10,000 good pieces/reel. (3) Quantity of punched hole for defective part is 10% or less of total quantity of antenna. Note: Tapes can be joined to increase the quantity. Example of Labeling (9) Notes: (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (1) P I D 05480P10CV-001 (2) D / N RKZ6.8TKJR1 (3) QTY 8000 (4) (5) (6) SPN RKZ6.8TKJR1 ZZZZ WP MADE IN JAPAN AS MADE IN JAPAN Pb-Free T. 2005/11/23 (7) T/C 0548 FL90030E0 S.LOT FL90030E0 (8) Pack-ID Device Name Quantity SAP Name Country of Wafer Process Country of Assembly (Japan → MADE IN JAPAN / Malaysia → MADE IN MALAYSIA) Trace code Lot code Pb-Free indication (Only for Pb-free product) Date of Label issuance Rev.1.00 Feb 16, 2006 page 7 of 9 (10) HKT100***F/HKT100Y01F Form of Delivery (1) Paper tape for spacers Paper tape is inserted as a spacer for the product tape. When wound onto the reel, the product tape is oriented so that the antenna face is on the inner side. All dimensions: mm Paper tape 22 16 22 Leader 0.08 0.183 71 Reel Antenna face is the inner side Paper tape (material: kraft paper) Product-tape winding direction (2) Packing and reel dimensions 1.6 ± 0.5 72 ± 0.6 All dimensions: mm φ200 ± 1.5 φ76.2 ± 0.6 Material: cardboard External View of the Reel Label (On reel) Label (On bag) Antistatic bag Cellophane tape Inner packing box Packing Form Rev.1.00 Feb 16, 2006 page 8 of 9 HKT100***F/HKT100Y01F Appearance There should not be any scratch or/and dirt that affect characteristics. Quality Level (Compliant with the JIS Z 9015) Electrical characteristics: AQL = 4.0% Appearance: AQL = 4.0% Precautions on Usage 1. Renesas Technology does not guarantee the product characteristics after it has been through assembly on the customer side. 2. Please refer to the mounting manual. (Document No.: REJ11P0002-0100) System Outline µ-Chip Inlet µ-Chip Antenna Supply voltage / modulator Logic circuit Reader Reset circuit 128-bit ROM Clock demodulator Function Blocks Block Name Description of Functions Supply voltage/modulator Generates power-supply voltage from carrier signals, varies the output impedance of the modulator circuit to match the input impedance of the antenna, and handles communications. The IC incorporates a power limiter for the protection of internal devices. Reset circuit Determines whether or not a clock signal is being supplied and cancels the reset mode in synchronization with the first clock cycle. Clock demodulator Logic circuit Demodulates the clock signal from the envelope signal of the received signal. The IC includes an on-chip 128-bit ROM from which data signals are sent out in synchronization with the clock signal. Rev.1.00 Feb 16, 2006 page 9 of 9 Sales Strategic Planning Div. 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