Datasheet

Thermoelectric Cooling Solutions
Performance Parameters
TE Cooler Type
ΔTmax
K
Qmax
W
1MD06-015-03H
Imax
A
Umax
V
ACR
Ohm
H
mm
1.9
0.27
1.4
1MD06-015-xx (n=15)
1MD06-015-03H
68
5.7
5.2
Performance values are specified at 300K ambient temperature, Vacuum.
Dimensions
Manufacturing options
A. TEC Assembly Solder
1. Lead-free Solder Sn-Sb
(Tmelt =230ºC) - default
2. Lead-free Solder Au-Sn
(Tmelt = 280ºC) available by
request
B. TEC Ceramics
1. Al2O3 100%
2. AlN 100% - default
3. Mixed solution (AlN/Al2O3)
С. Ceramics Surface Options
1. Blank ceramics
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1. In-Sn, Tmelt =117°C
3.2. Sn-Bi, Tmelt = 138°C
3.3. In-Ag, Tmelt = 143°C
3.4. In, Tmelt = 157°C
3.5. Pb-Sn, Tmelt =183°C
3.6. Optional type (can be
specified by Customer)
D. Thermistor (optional)
Can be mounted to TEC cold
side. Calibration is available by
request. Various thermistor
solutions are available
E. TEC Terminal Wires
1. Blank, tinned Copper - default
2. Insulated Wires
3. Insulated, color-coded Wires
4. WB pads or WB posts
5. Flip-Chip Terminal Solution
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Thermoelectric Cooling Solutions
Voltage, V
dT, K
Performance Data
1MD06-015-03H
@27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, Dry N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD06-015-03H
68
5.7
5.2
1.9
1MD06-015-03H
72
6.3
5.1
2.1
80
80
70
70
60
60
50
50
40
40
30
30
20
20
10
10
3
3
2
2
2
1
1
0
0
0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50 6.00
0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50 6.00
Operating Current, A
Voltage, V
dT, K
Heatload, W
0.0
1.15
2.29
Operating Current, A
3.44
Heatload, W
4.58
@75ºC, Dry N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD06-015-03H
78
6.8
5.0
2.2
90
90
80
80
70
70
60
60
50
50
40
40
30
30
20
20
10
10
3
3
2
2
1
1
0
0.0
1.25
2.51
3.76
5.02
@85ºC, Dry N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD06-015-03H
80
7.0
5.0
2.3
0
0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50 6.00
0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50 6.00
Operating Current, A
Heatload, W
0.0
1.35
2.71
Operating Current, A
4.06
5.42
Heatload, W
0.0
1.39
2.78
4.17
5.56
Note: TEC performance data is specified at optimal conditions, Thot=Tamb. Please, use TECCad Software or iTECPad app for
estimations under different conditions, or contact RMT Ltd or it’s branches directly.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2015. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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Thermoelectric Cooling Solutions
External Cooling Concept
TO56/TO9 Laser Diode
(or similar object)
Final product item
(packaged assembly
on a header)
Heatsink
Thermal
Contact area
TE Cooler
(Cut view)
Heatsink
“External” TE Cooling
TEC cools the entire
assembly
Heatsink
Center Hole
for LD wires feed
through
Heatsink
“Internal” TE Cooling
TEC on a header, cools the
heat-generating object directly
Description
“External cooling” with center-hole thermoelectric coolers is the solution for objects without a possibility to integrate
TEC inside (or where a built-in TEC is not sufficient enough because of large heatload). For example there is a wide
range of uncooled LD types that use industrial standard TO-56 or TO-9 headers. The typical design and pins
layout for such headers assume uncooled solution with no space to integrate a thermoelectric cooler directly on a
header. In the same time thermal stabilisation can improve LD performance and lifetime and give additional features
in final application. In such cases the “external” thermoelectric cooling can be an optimal choice. TEC has a center
hole (or multiple holes) to feed LD pins through and provide a thermal contact between header and cold side
surface. Center-hole TECs and “external” cooling are optimal for creating environmental testing setups for LD
manufacturers, laboratory researches and temperature sensitive experiments.
Application Tips
1. An appropriate heatsink is required to be attached to TE cooler hot side. TEC operates as a heatpump. The
heat pumped from TEC cold side has to be spread from a hot side with a heatsink.
2. TEC built it on a header (internal cooling) is more optimal solution by power consumption comparing with
“external” one (TEC under the header). The external cooling is good if there is no way to integrate a suitable TE
cooler on a header. The external cooling can be an extension for standard un-cooled packaged devices.
3. With the external cooling the temperature on TEC cold side may differ from temperature of the object inside a
packaged assembly. This is a result of header thermal resistance availability.
4. Recommended methods of mounting: thermal grease or gluing. In case of Copper or Aluminium heatsink
materials it is strongly recommended to use a thermal grease or elastic silicon-based thermoconductive glues.
Copper and Aluminium heatsink materials have high thermal expansion coefficient (CTE), different to TEC
materials.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
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Thermoelectric Cooling Solutions
Additional Options
TEC Polarity
TEC Polarity can be modified by request. The
specified polarity in this datasheet is typical.
It can be reversed in accordance to Customer
application requirements.
-
+
+
Standard polarity
-
Reversed polarity
Terminal Wires Options
The wires are of tinned Copper, blank (not
insulated) by default. Various options for insulated
wires are available by request. The available
solutions include insulated wires, insulated colorcoded wires, flexible multicore wires and more.
S t a n d a rd w i re s ,
tinned Copper
Insulated wires
Customized Au Patterns
Customized Au patterns on thermoelectric cooler
cold side are available by request. Selective Pretinning over pattern is also available. Please,
contact RMT Ltd for additional information about
customized Au patterns requirements.
Customized Au pattern
on cold side
Selective pre-tinning
over pattern
Hole Modifications
TEC center hole can be modified by request. Wide
range of options is available - different hole shape
sand dimensions and multi-hole configurations.
RMT Ltd has the full-featured flexibility with
ceramics cutting process.
Multi-hole solution
for TO-56 header
layout
Quad-shaped
customized center
hole
TEC Height modification
Standard TEC height can be modified without
performance changes by using ceramics of
different thickness. Standard thermoelectric cooler
height (specified in this datasheet) may be
modified (reduced or increased) in a range
-0.5..+1.0 mm by request.
Standard height
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Modified height,
another ceramics
thickness
Thermoelectric Cooling Solutions
Thermoelectric Cooler Overview
AlN Ceramics by default
(Al2O3 solution is available
by request)
Cold side Ceramics
(top side)
Center Hole
TE Cooler Lead Free
Internal Assembly
(Lead-Free Solder 230,
Sn-Sb)
-
Pellets (BiTe posts)
TEC Polarity
(can be modified by
request)
Hot Side Ceramics
(bottom side)
+
Terminal Wires
Application Tips
1. Never heat TE module more than 200˚C (TEC
assembled at 230˚C).
2. Never use TE module without an attached heat sink
at hot (bottom) side.
3. Connect TE module to DC power supply according
to polarity.
4. Do not apply DC current higher than Imax.
Installation
1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in
another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types
require other assembling methods in most cases.
1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option
and also makes pre-tinning for TE modules.
2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good
thermoconductive properties. A glue is usually based on some epoxy compound filled with some
thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a
specific type depends on application features and the type of a TE module.
Object being cooled
Object being cooled
TEC
TEC
1
3
2
Screw mounting
Heatsink
Soldering
Heatsink
Gluing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2015. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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Thermoelectric Cooling Solutions
Important notes
1. TEC Performance in this datasheet is specified in typical ambient condition modes (Vacuum, +27ºC; Dry N2,
+50ºC; Dry N2, +75ºC; and Dry N2, +85ºC). The performance may differ under other conditions. Please, use RMT
TECCad software or iTECPad for iPad for detailed analysis, or contact RMT specialists for additional TEC
performance info.
2. TEC ACR and Umax values are sensitive to ambient temperature. These values can be different from those
specified in the datasheet at other ambient conditions. ACR and Umax raise with ambient temperature increasing.
3. TEC dTmax is specified at zero heatload, while Qmax is specified at zero dT (check Fig.1 for example). TEC
dTmax and Qmax values raise with ambient temperature (check Fig. 2 for example). Please, use RMT TECCad
software or iPad app for additional info, or contact RMT specialists directly.
4. Thermoelectric coolers have the best performance in the temperature range from near room up to +80..90ºC. TEC
cooling performance is less at ambient temperatures below 0ºC. TECs are not suitable to operate at cryogenic
temperatures.
5. Driving a TEC at Imax or Umax doesn’t mean max performance mode. The real optimal mode may depend on
operating conditions, required dT level and application heatload. In fact a better performance can be reached at
operating current and voltage lower than Imax and Umax values specified in datasheet.
6. It is strongly recommended to avoid a direct mounting of thermoelectric cooler to pure Copper, Aluminium or
Nickel materials as well as a mounting of objects from these materials on TEC cold side. Any material with high
CTE (Coefficient of Thermal Expansion) may affect on TEC lifetime and even damage TEC in case of improper
mounting, thermal shock and/or temperature cycling. In case of above mentioned materials necessity, it is
recommended to use elastic “soft” solders or glues with large modulus of elasticity (Indium-based solders or
silicon-based thermoconductive glues).
7. RMT Ltd confirms that all RMT thermoelectric coolers are qualified and meet the requirements of Telcordia GR-468
Standard. The up-to-date Reliability Report is available by request. RMT Ltd warranties thermoelectric coolers
lifetime no less than 250K-300K operating hours under normal application conditions.
Fig. 1 - Understanding dTmax and Qmax
Fig. 2 - Single-stage TEC dTmax and Qmax example
parameters at different ambient temperatures
dTmax
dT
70max
80
60
Operating point
50
Tamb=27ºC
Tamb=75ºC
70
Tamb=50ºC
Tamb=90ºC
60
dT, K
dT, K
40
30
50
40
30
20
20
10
0
90
10
0
0
Heatload,W
Qmax
0
2
4
6
8
10
Heatload,W
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
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12
Qmax14
Thermoelectric Cooling Solutions
Contacts
Russia - RMT Ltd. Headquarters
Warshavskoe sh. 46, 115230, Moscow
Russia
Tel: +7-499-678-2082
Fax: +7-499-678-2083
Web: www.rmtltd.ru
Email: [email protected]
Europe/USA - TEC Microsystems GmbH
Korea - Sunflower Energy
Schwarzschildstrasse 8, 12489 Berlin
1F, 665-6, Pungdeokcheon-dong
Germany
Suji-gu, Yongin-si, Gyeonggi-do
Tel: +49 30 6789 3314
South Korea
Fax: +49 30 6789 3315
Tel: +82 312767992
Web: www.tec-microsystems.com
Fax: +82 312767993
Email: [email protected]
web: www.sunfl.co.kr
China - ProTEC Ltd.
Taiwan - Wellspring & Vim Tech Corp
深圳市南⼭山区登良路恒裕中⼼心B座207
9F-1, No.657 Pei-an Rd.
电话:+86-755-61596066
Taipei 104
传真:+86-755-61596036
Taiwan
邮编:518054
Tel: +886 2-85091756
Web: www.protecltd.com
Fax: +886 2-85091846
Email: [email protected]
web: www.wellvim.com.tw
Email: [email protected]
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
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Thermoelectric Cooling Solutions
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of its affiliates, or subsidiaries, or other respective owners that have granted RMT Ltd the permission and/or
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RMT Ltd, TEC Microsystems GmbH and ProTEC Ltd. do not grant a copyright license (express or implied) to
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Page 8
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Source Data
Tamb, K
Amb
dTmax, K
Qmax, U
Imax, A
Umax, V
ACR,
Ohm
1MD06-015-03H
300
Vacuum
68
5.73
5.18
1.86
0.27
1.40
1MD06-015-03H
323
Nitrogen
(N2)
72
6.27
5.13
2.05
0.30
1.40
1MD06-015-03H
348
Nitrogen
(N2)
78
6.77
5.04
2.23
0.33
1.40
1MD06-015-03H
358
Nitrogen
(N2)
80
6.95
5.02
2.30
0.34
1.40
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