Datasheet

Thermoelectric Cooling Solutions
BTF14.1MD10024xx
Performance Parameters
Mounted TEC
Type
ΔTmax Qmax
K
W
Imax
A
Umax
V
Rt
K/W
H
mm
1MD10-024-xx (n=24)
1MD10-024-08
70
9.8
5.5
1MD10-024-10
71
8.1
4.5
1MD10-024-15
72
5.6
3.0
1MD10-024-20
72
4.3
2.3
1.9
3.0
0.06
2.1
2.6
3.1
Performance data is specified at 300K, vacuum
Dimensions
Manufacturing options
A. Header material:
CuW base, Kovar frame
D. TEC Ceramics Material:
1.Pure Al2O3(100%) - used by default
2.Alumina (Al2O3- 96%)
B. Header surface finish:
3.Aluminum Nitride (AlN)
G. Thermistor mounting:
Au plaiting (base and pins)
E. TEC Cold Side Finish:
C. TEC to Header mounting:
F. Thermistor (optional)
Can be mounted to cold side
ceramics edge.
Epoxy gluing
1. Blank ceramics (not metallized)
Solder 206 (Tmelt =206°C,
2. Metallized (Au plaiting)
Sn-Ag-In-Cu, flux-free process)
3. Metallized and pre-tinned
(various solder for pre-tinning available)
H. Pinout configuration:
the drawing contains standard
pinout, can be revised by
request)
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 1 of 9
Thermoelectric Cooling Solutions
1MD10-024-08
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD10-024-08
70
9.82
5.5
3.0
1MD10-024-08
75
10.71
5.4
3.3
Note: Performance data is specified at optimal heatsink. “Butterfly” 14pin Package thermal resistance is included into
estimations. Use TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly.
1MD10-024-10
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD10-024-10
71
8.08
4.5
3.0
1MD10-024-10
76
8.81
4.4
3.3
Note: Performance data is specified at optimal heatsink. “Butterfly” 14pin Package thermal resistance is included into
estimations. Use TECCad Software for estimations under different conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 2 of 9
Thermoelectric Cooling Solutions
1MD10-024-15
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD10-024-15
72
5.59
3.0
3.0
1MD10-024-15
77
6.10
3.0
3.3
Note: Performance data is specified at optimal heatsink. “Butterfly” 14pin Package thermal resistance is included into
estimations. Use TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly.
1MD10-024-20
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MD10-024-20
72
4.28
2.3
3.0
1MD10-024-20
76
4.68
2.3
3.3
Note: Performance data is specified at optimal heatsink. “Butterfly” 14pin Package thermal resistance is included into
estimations. Use TECCad Software for estimations under different conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 3 of 9
Thermoelectric Cooling Solutions
Application Tips
1. Never heat up the sub-assembly more than 200˚C.
2. Never use the sub-assembly without an attached
heat sink. Header is NOT a heatsink by itself.
3. Connect TE cooler to DC power supply according
to specified polarity.
4. Do not apply current/voltage higher than specified
max values
Mounting to TEC cold side
1. Soldering of object to be cooled.
Method suitable for a TE module with the metallized cold side
(Ordering Options. Item E). Soldering requires careful
procedures:
A. Never overheat TEC (Application Tips. Item 1).
B. Use solder with melting point less than 200ºC.
Mounting to the
cold side
TEC
Package
2. Gluing of object to be cooled.
Method available by glues with good thermoconductive
properties. Not recommended for high vacuum applications
and long operations at high temperature.
Important notes
1. TEC Performance in this datasheet is specified in two standard ambient condition modes (vacuum, +27ºC and dry
nitrogen (N2), +50ºC). The performance may differ under other conditions. Please, use TECCad software from
RMT Ltd web site or contact RMT or its branch specialists directly for additional TEC performance info.
2. TEC ACR and Umax values are sensitive to ambient temperature. These values can be different from those
specified in the datasheet at other ambient conditions. ACR and Umax raise with ambient temperature increasing.
3. TEC cooling capacity (Qmax) raises with ambient temperature. Please, use TECCad software for additional info or
contact RMT specialists directly.
4. Thermoelectric coolers have the best performance in the temperature range from near room up to +80..90ºC. The
performance is lower at temperatures below 0ºC. TEC is not suitable to work at cryogenic temperatures.
5. Driving a TEC at Imax or Umax doesn’t mean max performance mode. The real optimal mode may depend on
operating conditions and heatload. In fact a better performance can be reached at operating current and voltage
lower than Imax and Umax values specified in the datasheet.
6. It is strongly recommended to avoid a direct mounting of objects from pure Copper, Aluminum or Nickel materials
to TEC cold side. The materials with high CTE may affect TEC lifetime and/or damage it in case of improper
mounting, thermal shock or temperature cycling. In case of above mentioned materials necessity, it is
recommended to use soft solders or glues with large modulus of elasticity (Indium-based solders or silicon-based
thermoconductive glues).
7. RMT Ltd confirms that all thermoelectric coolers meet the requirements of Telcordia GR-468 standard. The up-todate Reliability Report is available by request. RMT Ltd warranties thermoelectric coolers lifetime no less than
250K-300K operating hours under normal application conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 4 of 9
Thermoelectric Cooling Solutions
Sub-assembly Overview
Thermistor (optional)
NTC Thermistor
2.2kOhm or
10kOhm
Thermoelectric Cooler
1MD10-024-XX
“Butterfly” 14pin Header
(CuW base, Kovar Frame)
TE Cooler Lead Free
Internal Assembly Solder
(Lead-Free
Solder 230, Sn-Sb)
TEC to Package High-Temperature
Mounting by Soldering
(Lead-Free Solder 206,
Sn-Ag-In-Cu, vacuum flux-free process)
Laser Labeling (optional)
is available for Header
Flexible pinout configuration
for TEC and thermistor
“Butterfly” 14pin Package Drawing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 5 of 9
Thermoelectric Cooling Solutions
Additional Options
TEC Polarity
TEC Polarity can be modified by request. The
specified polarity in this datasheet is typical.
It can be reversed in accordance to Customer
application requirements.
-
+
+
Standard polarity
-
Reversed polarity
Terminal Wires Options
The standard solution is with terminal wires. TEC
can be modified for WB process by request. In this
case terminal wires are not mounted, TEC has Au
plated WB pads.
Standard solution,
terminal wires
WB Solution, Au
played WB pads
Optimization for WB process
In case of WB optimization, the standard WB
solution is with WB pads (no posts) by default. WB
posts are available by request. The dimensions of
WB posts can be modified and optimized for
Customers application. WB posts are made of
Copper, Au plated.
WB posts
WB pads
Customized Au Patterns
Customized Au patterns on thermoelectric cooler
cold side are available by request. Selective Pretinning over pattern is also available. Please,
contact RMT Ltd for additional information about
customized Au patterns requirements.
Customized Au pattern
on cold side
Selective pre-tinning
over pattern
TEC Height modification
Standard TEC height can be modified without
performance changes by using ceramics of
different thickness. Standard thermoelectric cooler
height (specified in the datasheet) may be modified
in a range -0.5..+1.0mm for single-stage TEC by
request.
Standard height
M o d i fi e d h e i g h t ,
another ceramics
thickness
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 6 of 9
Thermoelectric Cooling Solutions
Thermoelectric Cooler Overview
Cold side Ceramics
(top side)
Al2O3 Ceramics by default
(AlN solution is available by
request)
TE Cooler Lead Free
Internal Assembly
(Lead-Free Solder 230,
Sn-Sb)
Pellets (BiTe posts)
TEC Polarity
(can be modified by
request)
Hot Side Ceramics
(bottom side)
+
Terminal Wires
(or WB pads by request)
Application Tips
1. Never heat TE module more than 200˚C (TEC
assembled at 230˚C).
2. Never use TE module without an attached heat sink
1. Connect TE module to DC power supply according
to polarity.
2. Do not apply DC current higher than Imax.
at hot (bottom) side.
Installation
1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in
another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types
require other assembling methods in most cases.
1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option
and also makes pre-tinning for TE modules.
2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good
thermoconductive properties. A glue is usually based on some epoxy compound filled with some
thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a
specific type depends on application features and the type of a TE module.
Object being cooled
Object being cooled
TEC
TEC
1
3
2
Screw mounting
Heatsink
Soldering
Heatsink
Gluing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 7 of 9
Thermoelectric Cooling Solutions
Contacts
RMT Ltd. Headquarters
Warshavskoe sh. 46, 115230, Moscow
Russia
Phone: +7-499-678-2082
Fax: +7-499-678-2083
Web: www.rmtltd.ru
Email: info@rmtltd.ru
EUROPE/USA - TEC Microsystems GmbH
Schwarzschildstrasse 3, 12489 Berlin
Germany
Tel. +49 30 6789 3314
Fax+49 30 6789 3315
Web: www.tec-microsystems.com
Email: info@tec-microsystems.com
CHINA - ProTEC Ltd.
深圳市南山区登良路恒裕中心B座207
:+86-755-61596066
真:+86-755-61596036
:518054
Web: www.protecltd.com
Email: info@protecltd.com
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 8 of 9
Thermoelectric Cooling Solutions
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46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 9 of 9