Datasheet

Thermoelectric Cooling Solutions
HHL09.1MC10049XX
Performance Parameters
Mounted TEC
Type
ΔTmax
K
Qmax
W
Imax
A
Umax
V
Rt
K/W
H
mm
1MC10-049-xx (n=49)
1MC10-049-05
64
27.5
7.8
1MC10-049-10
69
15.9
4.3
1MC10-049-15
71
11.1
3.0
1MC10-049-20
72
8.6
2.3
1.6
6.0
0.051
2.1
2.6
3.1
Performance data is specified at 300K, vacuum (thermal resistance incl.)
Dimensions
Manufacturing options
A. Header material:
CuW (20%-80%) base,
Kovar frame
D. TEC Ceramics Material:
1.Pure Al2O3(100%) - used by default
2.Alumina (Al2O3- 96%)
F. Thermistor (optional)
Can be mounted to cold side
ceramics edge.
3.Aluminum Nitride (AlN)
B. Header surface finish:
Au plaiting (base and pins)
G. Thermistor mounting:
E. TEC Cold Side Finish:
Epoxy gluing
1. Blank ceramics (not metallized)
C. TEC to Header mounting:
Solder 206 (Tmelt =206°C,
Sn-Ag-In-Cu, flux-free process)
2. Metallized (Au plaiting)
3. Metallized and pre-tinned
(various solder for pre-tinning available)
H. Pinout configuration:
the drawing contains standard
pinout, can be revised by
request)
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 1 of 7
Thermoelectric Cooling Solutions
1MC10-049-05
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MC10-049-05
64
27.5
7.8
6.0
1MC10-049-05
69
29.9
7.7
6.4
Note: Performance data is specified at optimal heatsink. HHL Package base thermal resistance is included into estimations.
Use TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly.
1MC10-049-10
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MC10-049-10
69
15.9
4.3
6.0
1MC10-049-10
74
17.3
4.2
6.6
Note: Performance data is specified at optimal heatsink. HHL Package base thermal resistance is included into estimations.
Use TECCad Software for estimations under different conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 2 of 7
Thermoelectric Cooling Solutions
1MC10-049-15
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MC10-049-15
71
11.1
3.0
6.0
1MC10-049-15
75
12.1
2.9
6.7
Note: Performance data is specified at optimal heatsink. HHL Package base thermal resistance is included into estimations.
Use TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly.
1MC10-049-20
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1MC10-049-20
72
8.55
2.3
6.0
1MC10-049-20
75
9.35
2.3
6.7
Note: Performance data is specified at optimal heatsink. HHL Package base thermal resistance is included into estimations.
Use TECCad Software for estimations under different conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 3 of 7
Thermoelectric Cooling Solutions
Application Tips
1. Never heat up the sub-assembly more than 200˚C.
2. Never use the sub-assembly without an attached
heat sink. Header is NOT a heatsink by itself.
3. Connect TE cooler to DC power supply according
to specified polarity.
4. Do not apply current/voltage higher than specified
max values
Mounting to TEC cold side
1. Soldering of object to be cooled.
Method suitable for a TE module with the metallized cold side
(Ordering Options. Item E). Soldering requires careful
Mounting to the
cold side
TEC
procedures:
A. Never overheat TEC (Application Tips. Item 1).
B. Use solder with melting point less than 200ºC.
2. Gluing of object to be cooled.
Method available by glues with good thermoconductive
properties. Not recommended for high vacuum applications
and long operations at high temperature.
HHL Package
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 4 of 7
Thermoelectric Cooling Solutions
Sub-assembly Overview
HHL 9pin Package
(CuW base, Kovar frame)
Laser Labeling is available
for HHL package (optional)
Thermoelectric Cooler
1MC10-049-XX
TEC to Package High-Temp.
Mounting by Soldering
(Lead-Free Solder 206,
Sn-Ag-In-Cu, vacuum flux-free
process)
TE Cooler Lead Free
Internal Assembly Solder
(Lead-Free
Solder 230, Sn-Sb)
Thermistor (optional)
CuW Base (20%-80%)
NTC Thermistor
2.2kOhm or
10kOhm
Flexible pinout for TEC
and thermistor
HHL 9pin Package Drawing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 5 of 7
Thermoelectric Cooling Solutions
Contacts
RMT Ltd. Headquarters
Warshavskoe sh. 46, 115230, Moscow,
Russia
Phone: +7-499-678-2082
Fax: +7-499-678-2083
Web: www.rmtltd.ru
Email: [email protected]
EUROPE/USA - TEC Microsystems GmbH
Schwarzschildstrasse 3, 12489 Berlin,
Germany
Tel. +49 30 6789 3314
Fax+49 30 6789 3315
Web: www.tec-microsystems.com
Email: [email protected]
CHINA - ProTEC Ltd.
深圳市南山区登良路恒裕中心B座207
电话:+86-755-61596066
传真:+86-755-61596036
邮编:518054
Web: www.protecltd.com
Email: [email protected]
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 6 of 7
Thermoelectric Cooling Solutions
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46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 7 of 7