Voltage Regulator of SMD IF

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Information
Voltage Regulator of SMD
SC-63 (3-pin MP-3Z)
SC-98 (5-pin MP-3Z)
SOT-89 (Power Mini Mold)
SC-74A (5-pin Mini Mold)
Document No. G11872EJ4V0IF00 (4th edition)
Date Published May 2005 NS CP(K)
2000, 2005
Printed in Japan
• The information in this document is current as of May, 2005. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
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"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
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M8E 02. 11-1
2
Information G11872EJ4V0IF
1.
INTRODUCTION
As demands for higher density have increased for electronic devices, demands for semiconductor packages that
are small, have many pins, and can be surface-mounted have grown increasingly.
To satisfy these market demands,
NEC Electronics provides surface mount packages for power ICs, such as SC-63, SC-98, SOT-89, and SC-74A.
This document describes the characteristics and taping specifications of these packages.
DRAWINGS (Unit: mm)
Figure 2−1. SC-63
2.3 ±0.2
1.5 −0.1
+0.2
6.5 ±0.2
5.0 ±0.2
0.5 ±0.1
3
1.0 MIN.
1.5 TYP.
5.5 ±0.2
2
1.1 ±0.2
0.9 MAX.
2.3
0.8 MAX.
2.3
0.5
2.0 MIN.
1
10.0 MAX.
4.3 MAX.
4
0.8
0.8
Figure 2−2. SC-98
0.5±0.1
1.0 MIN.
1.5 TYP.
5.5 0.2
1.5+Ð00..12
2.3±0.2
10.0 MAX.
6.5±0.2
5.0±0.2
0.9 MAX.
0.8 MAX.
0.5
2.0 MIN.
PACKAGE
4.3 MAX.
2.
1.27 1.27
0.8
Information G11872EJ4V0IF
3
Figure 2−3. SOT-89
1.5 ±0.1
2.5 ±0.1
4.0 ±0.25
0.8 MIN.
4.5 ±0.1
1.6 ±0.2
0.42
±0.06
0.47
1.5 ±0.06
3.0
0.42 ±0.06
0.41+0.03
−0.05
Figure 2−4. SC-74A
2.8 ±0.2
+0.1
0.16
+0.1
−0.06
0.95
1.9
0.32 +0.1
−0.06
0.95
0.65 −0.15
0 to 0.1
0.8
1.1 to 1.4
2.9 ±0.2
1.5
4
Information G11872EJ4V0IF
3.
THERMAL
RESISTANCE
The thermal performance of a surface mount package varies depending on the materials and area of a PC board
onto which it is to be mounted, because of its structure. The following graph shows, for your reference, the thermal
resistance between the junction and atmosphere of each package when the package is mounted on a glass epoxy
board.
Figure 3−1.
Thermal Resistance on Glass Epoxy Board (SC-63 and SC-98)
Rth(J-A) - Thermal Resistance - ˚C/W
140
120
100
80
60
40
20
0
0
500
1000
1500
2000
2500
Copper Foil Area A - mm2
Measurement sample: µ PC29M05AT
Board material: Glass epoxy (both side)
Board size: 50 mm x 50 mm x 1.6 mm
Copper foil thichness: 35 µ m
Ambient temperature: 25˚C
Wind velocity: 0 m/s
Image of Board for Measurement
Surface
Rear
Mount pad
50 mm
Copper foil
50 mm
The mount pad on the surface and the copper foil on the rear are joined by thermal via.
Information G11872EJ4V0IF
5
Figure 3−2.
Thermal Resistance on Glass Epoxy Board (SOT-89)
Rth(J-A) - Thermal Resistance - ˚C/W
250
200
150
100
50
0
0
500
1000
1500
2000
2500
Copper Foil Area A - mm2
Measurement sample: µ PD120N15T1B
Board material: Glass epoxy (single side)
Board size: 50 mm x 50 mm x 1.6 mm
Copper foil thichness: 35 µ m
Ambient temperature: 25˚C
Wind velocity: 0 m/s
Image of Board for Measurement
50 mm
Copper foil
50 mm
6
Information G11872EJ4V0IF
Figure 3−3. Thermal Resistance on Glass Epoxy Board (SC-74A)
350
300
250
200
150
100
50
0
0
500
1000
1500
2000
2500
Copper Foil Area A - mm2
Measurement sample: µ PD120N15TA
Board material: Glass epoxy (single side)
Board size: 50 mm x 50 mm x 1.6 mm
Copper foil thichness: 35 µ m
Ambient temperature: 25˚C
Wind velocity: 0 m/s
Image of Board for Measurement
Copper foil
50 mm
Rth(J-A) - Thermal Resistance - ˚C/W
400
50 mm
Information G11872EJ4V0IF
7
4.
MOUNT PAD
The dimensions of the mount pad are shown below (for reference).
For the recommended soldering conditions, refer to the Data Sheet.
Figure 4−1.
Dimensions of Mount Pad of SC-63
Figure 4−2.
(for Reference)
Dimensions of Mount Pad of SC-98
(for Reference)
(Unit: mm)
(Unit: mm)
7.0
2.0
2.0
2.0
11.0
7.0
6.5
6.5
1.5
1.5
2.3
Figure 4−3.
1.27
0.9
2.3
Dimensions of Mount Pad of SOT-89
Figure 4−4.
Dimensions of Mount Pad of SC-74A
(for Reference)
(for Reference)
(Unit: mm)
(Unit: mm)
2.2
0.95
1.0
0.9
0.6
2.4
1.5
45˚
0.9
2.2
45˚
1.0
1.0
1.5
8
0.95
1.0
1.5
Information G11872EJ4V0IF
5.
TAPING SPECIFICATIONS
The SC-63, SC-98, SOT-89, and SC-74A can be delivered packaged on a tape.
The taping specifications of each package (tape shape, reel shape, and taping direction) are shown below.
Figure 5−1.
Taping Specifications of SC−63 and SC-98
(1) 16 mm wide embossed taping
(a) Taping shape
Unit: mm
P0
D0
T
B
F
W
E
P2
D1
P1
A
T2
T
Symbol
Size
A
7.1 MAX.
B
10.7 MAX.
D0
φ 1.5 +0.1
D1
φ 1.5 MIN.
E
1.75 ±0.1
F
7.5 ±0.1
P0
4.0 ±0.1
P1
8.0 ±0.1
P2
2.0 ±0.1
T
0.2
−0
T2
2.7 ±0.1
W
16.0 ±0.3
(b) Reel shape
3-r
V
E
K
C
B
D
θ2
W1
W1
W
W2
Information G11872EJ4V0IF
A
F
Symbol
Size
A
329
B
100
C
13 ±0.5
D
21 ±0.8
E
2.0 ±0.5
F
2
V
8
W
16.4 +2.0
W1
(2.5)
W2
22.4 MAX.
K
260
r
1.0
θ1
120°
θ2
60°
θ1
θ1
Unit: mm
−0
9
(c) Taping direction
"-E1"
"-E2"
Draw-out direction
(2) 32 mm wide adhesive taping
Unit: mm
(a) Taping shape
Symbol
D (12-pitch)
C
2-H
G
B
A
I
d
d
A
32 +0
B
26 ±0.1
C
4.0 ±0.1
D
48 ±0.3
E
12 ±0.1
F
J
E
t2t1
F
SC-63
Size
−0.4
φ 1.0 +0.1
−0
G
6.0 ±0.2
H
R2.0
I
8.0
J
4.0
t2
0.15
t1
0.18
d
0 ±0.5
(b) Reel shape
t
t
W
F
10
Information G11872EJ4V0IF
A
B
C
Unit: mm
Symbol
Size
A
φ 300
B
φ 80
C
φ 15.5
W
34
t
2
F
38 ±1
(c) Taping direction
"-T1"
"-T2"
Draw-out direction
Figure 5−2.
Taping Specifications of SOT-89
(1) 12 mm wide embossed carrier taping
(a) Taping shape
t
H
δ
A
J
G
W
B
θ θ
C
D
E
δ
K0
K1
K
F
Unit: mm
Item
Symbol
Size
Remarks
5.0 +0.1
−0.1
+0.1
4.6 −0.1
Inside of cutout on plane 0.5 mm above inner bottom
Inner space
Depression Angular
Length
A
Hole for Device Insertion
Width
B
Depth
K0
1.8 ±0.1
Pitch
F
Accumulative pitch: −0.3 MAX./ 10 pitch
Diameter
J
8.0 ±0.1
φ 1.5 +0.1
−0.05
Pitch
H
4.0 ±0.1
Accumulative pitch: −0.3 MAX./ 10 pitch
Position
E
1.5 ±0.1
Distance from tape end to center of hole
Distance Between
Length direction
G
2.0 ±0.05
Distance from center line of pocket to that of perforation
Center-lines
Width direction
D
Distance from center line of pocket to that of perforation
Cover Tape
Width
W
5.65 ±0.05
+0.3
9.5 −0
Carrier Tape
Width
C
12 ±0.2
Thickness
t
0.3 ±0.05
K1
2.1 ±0.1
θ
30° MAX.
K
2.15 ±0.1
Round Hole for Feeding
Outer depth of hole
Device
Whole Thickness
Tilt
Inside of cutout on plane 0.5 mm above inner bottom
+0.1
+0.1
Thickness: 0.1 MAX.
Warpage δ: 0.3 MAX.
Total for cover tape and carrier tape
Information G11872EJ4V0IF
11
(b) Reel shape
Unit: mm
θ1
B
A
C
θ2
Symbol
Size
A
φ 178 ±2
W
13 ±0.5
B
φ 60 ±1
θ1
90°
C
φ 13 ±0.5
θ2
120°
W
(c) Taping direction
"-E1"
"-E2"
Draw-out direction
Figure 5−3.
Taping Specifications of SC-74A
(1) 8 mm width embossed taping
(a) Taping shape
Unit: mm
P
T
P2
Size
A0
3.18
B0
3.4
E
P0
B0
W
F
φ D0
A0
φ D1
K0
12
Symbol
Information G11872EJ4V0IF
K0
1.6
W
8.0 ±0.3
F
3.5 ±0.1
E
1.75 ±0.1
P
4.0 ±0.1
P2
2.0 ±0.1
P0
4.0 ±0.1
D0
1.5−0
+0.1
T
0.3
D1
1.0 MIN.
(b) Reel shape
D
W1
A
E
C
B
Unit: mm
Symbol
Size
A
φ 180 ±2.0
B
φ 60
C
φ 13 ±0.2
D
φ 21 ±0.8
E
2.0 ±0.5
W
9
W1
2.0 ±0.5
W1
W
(c) Taping direction
"-E1"
"-E2"
Draw-out direction
Information G11872EJ4V0IF
13
For further information,
please contact:
NEC Electronics Corporation
1753, Shimonumabe, Nakahara-ku,
Kawasaki, Kanagawa 211-8668,
Japan
Tel: 044-435-5111
http://www.necel.com/
[North America]
[Europe]
[Asia & Oceania]
NEC Electronics America, Inc.
2880 Scott Blvd.
Santa Clara, CA 95050-2554, U.S.A.
Tel: 408-588-6000
800-366-9782
http://www.necelam.com/
NEC Electronics (Europe) GmbH
Arcadiastrasse 10
40472 Düsseldorf, Germany
Tel: 0211-65030
http://www.ee.nec.de/
NEC Electronics Hong Kong Ltd.
12/F., Cityplaza 4,
12 Taikoo Wan Road, Hong Kong
Tel: 2886-9318
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Juan Esplandiu, 15
28007 Madrid, Spain
Tel: 091-504-2787
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Seoul, 135-080, Korea
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9, rue Paul Dautier, B.P. 52
78142 Velizy-Villacoublay Cédex
France
Tel: 01-3067-5800
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Room 2509-2510, Bank of China Tower,
200 Yincheng Road Central,
Pudong New Area, Shanghai P.R. China P.C:200120
Tel: 021-5888-5400
Filiale Italiana
Via Fabio Filzi, 25/A
20124 Milano, Italy
Tel: 02-667541
NEC Electronics Taiwan Ltd.
7F, No. 363 Fu Shing North Road
Taipei, Taiwan, R. O. C.
Tel: 02-2719-2377
Branch The Netherlands
Boschdijk 187a
5612 HB Eindhoven
The Netherlands
Tel: 040-2445845
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238A Thomson Road,
#12-08 Novena Square,
Singapore 307684
Tel: 6253-8311
Tyskland Filial
P.O. Box 134
18322 Taeby, Sweden
Tel: 08-6380820
United Kingdom Branch
Cygnus House, Sunrise Parkway
Linford Wood, Milton Keynes
MK14 6NP, U.K.
Tel: 01908-691-133
Document No. G11872EJ4V0IF00 (4th edition)
G04.1
Date Published May 2005 NS CP(K)
C
2000, 2005
Printed in Japan