To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC4074 J-FET INPUT LOW-NOISE QUAD OPERATIONAL AMPLIFIER DESCRIPTION The µPC4074 is a J-FET input operational amplifier. This product is designed as low noise version of the µPC4084. The features of the µPC4074 are more improved input equivalent noise voltage, input offset voltage and input bias current than those of µPC4084. By these features, the µPC4074 is excellent choice for wide variety of applications including audio preamplifier and active filter. FEATURES • Low noise: en = 17 nV/ Hz (TYP.) • Very low input bias and offset currents • Output short circuit protection • High input impedance...J-FET Input stage • Internal frequency compensation • High slew rate...13 V/µs (TYP.) ORDERING INFORMATION Part Number Package µPC4074C 14-pin plastic DIP (7.62 mm (300)) µPC4074G2 14-pin plastic SOP (5.72 mm (225)) PIN CONFIGURATION (Top View) EQUIVALENT CIRCUIT (1/4 Circuit) V R1 + µ PC4074C, 4074G2 Q9 Q14 OUT1 1 Q12 II Q1 Q2 Q8 II1 2 Q16 R8 Q10 IN C1 Q6 Q7 Q3 Q4 R2 R3 R4 R9 R6 Q13 D1 R10 Q15 OUT Q11 R5 R11 D2 V − + 4 + − 13 II4 IN1 3 12 IN4 V+ 4 11 V− IN2 5 II2 6 R7 14 OUT4 1 – 10 IN3 − + 2 − + Q5 3 OUT2 7 9 II3 8 OUT3 The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G15206EJ5V0DS00 (5th edition) Date Published March 2004 N CP(K) Printed in Japan The mark shows major revised points. c 1987 µPC4074 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter + Voltage between V and V – Note 1 – –0.3 to +36 V ±30 V VID – + V – + VI V –0.3 to V +0.3 VO V –0.3 to V +0.3 V PT 570 mW G2 Package 550 mW Note 6 Indefinite sec Note 3 C Power Dissipation Unit + Note 2 Output Voltage Ratings V –V Differential Input Voltage Input Voltage Symbol Note 4 Package Note 5 Output Short Circuit Duration Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –7.6 mV/°C when operating ambient temperature is higher than 50°C. 5. Thermal derating factor is –5.5 mV/°C when operating ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter 2 Symbol MIN. Supply Voltage V± ±5 Output Current Capacitive Load (AV = +1, Rf = 0 Ω) MAX. Unit ±16 V IO ±10 mA CL 100 pF Data Sheet G15206EJ5V0DS TYP. µPC4074 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Input Offset Voltage Input Offset Current Input Bias Current TYP. MAX. Unit Note 7 Note 8 Conditions MIN. ±3 ±10 mV IIO ±5 ±50 pA IB 30 200 pA 10 mA RS ≤ 50 Ω VIO Note 7 Large Signal Voltage Gain Supply Current Symbol AV RL ≥ 2 kΩ , VO = ±10 V ICC IO = 0 A 25000 200000 8 Common Mode Rejection Ratio CMR 70 86 dB Supply Voltage Rejection Ratio SVR 70 86 dB Output Voltage Swing Vom RL ≥ 10 kΩ ±12 ±13.5 V RL ≥ 2 kΩ ±10 ±12 V Common Model Input Voltage Range VICM Slew Rate SR Unity Gain Frequency funity Input Equivalent Noise Voltage Vn Input Equivalent Noise Voltage Density en ±10 13 V/µs 3 MHz RS = 100 Ω, f = 10 Hz to 10 kHz 4 µVr.m.s. RS = 100 Ω, f = 1 kHz 17 nV/√Hz 120 dB AV = 1 Channel Separation Input Offset Voltage Average VIO Temperature Drift Input Offset Current Input Bias Current Note 7 Note 7 V VIO RS ≤ 50 Ω, TA = –20 to +70°C ±13 ∆VIO/∆T TA = –20 to +70°C IIO TA = –20 to +70°C ±2 nA IB TA = –20 to +70°C 7 nA mV µV/°C ±10 Notes 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the operating ambient temperature. 8. This current flows irrespective of the existence of use. Data Sheet G15206EJ5V0DS 3 µPC4074 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 120 AV - Open Loop Voltage Gain - dB PT - Total Power Dissipation - mW 800 600 µ PC4074C 132°C/W µ PC4074G2 400 182°C/W 200 V± = ±15 V RL = 2 kΩ 100 80 60 40 20 0 0 40 20 60 80 1 100 10 100 TA - Operating Ambient Temperature - °C INPUT OFFSET VOLTAGE 5 10 M INPUT BIAS CURRENT each 5 samples data IB - Input Bias Current - nA VIO - Input Offset Voltage - mV 10 k 100 k 1 M 100 V± = ±15 V 4 1k f - Frequency - Hz 3 2 1 0 −1 −2 V± = ±15 V 10 1.0 0.1 −3 −4 −5 −40 0.01 −20 −20 0 20 40 60 0 20 40 60 80 TA - Operating Ambient Temperature - °C 80 TA - Operating Ambient Temperature - °C LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING 40 V ± = ±15 V RL = 10 kΩ 20 V ± = ±10 V 10 V ± = ±5 V 0 100 1k 10 k RL = 10 kΩ Vom - Output Voltage Swing - Vp-p Vom - Output Voltage Swing - Vp-p 30 100 k 1M 10 M 30 20 10 0 f - Frequency - Hz 4 Data Sheet G15206EJ5V0DS ±10 V± - Supply Voltage - V ±20 µPC4074 SUPPLY CURRENT OUTPUT VOLTAGE SWING 10.0 V ± = ±15 V ICC - Supply Current - mA Vom - Output Voltage Swing - Vp-p 30 20 10 8.0 6.0 4.0 2.0 ±5 0 0 100 300 1k 3k ±10 V± 10 k ±15 ±20 - Supply Voltage - V RL - Load Resistance - Ω INPUT EQUIVALENT NOISE VOLTAGE DENSITY 10 3 10 2 V ± = ±15 V RS = 100 Ω 10 1 10 100 1k 10 k f - Frequency - Hz 100 k VOLTAGE FOLLOWER PULSE RESPONSE VO - Output Voltage - V 4 VI - Input Voltage - V / en - Input Equivalent Noise Voltage Density - nV/ Hz 10 AV = +1 RL = 2 kΩ CL = 100 pF V± = ±15 V 5 0 −5 5 0 −5 0 1 2 3 4 t - Time - µ s Data Sheet G15206EJ5V0DS 5 µPC4074 PACKAGE DRAWINGS (Unit : mm) 14-PIN PLASTIC DIP (7.62 mm (300)) 14 8 1 7 A K J L I C H G B M R F D N M NOTES ITEM 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. A MILLIMETERS 19.22±0.2 B 2.14 MAX. C 2.54 (T.P.) D F G 0.50±0.10 1.32±0.12 H 0.51 MIN. 3.6±0.3 I 3.55 J K 4.3±0.2 7.62 (T.P.) L 6.4±0.2 M 0.25 +0.10 −0.05 N R 0.25 0~15° P14C-100-300B1-3 6 Data Sheet G15206EJ5V0DS µPC4074 14-PIN PLASTIC SOP (5.72 mm (225)) 14 8 detail of lead end P 1 7 A H F J I G S C D B L N S K M M E NOTE Each lead centerline is located within 0.1 mm of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 10.2±0.26 B 1.42 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59+0.21 −0.2 G 1.49 H 6.5±0.2 I 4.4±0.1 J 1.1±0.16 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.1 N 0.10 P 3° +7° −3° S14GM-50-225B, C-6 Data Sheet G15206EJ5V0DS 7 µPC4074 RECOMMENDED SOLDERING CONDITIONS The µPD4074 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC4074G2: 14-pin plastic SOP (5.72 mm (225)) Process Infrared Ray Reflow Conditions Symbol Peak temperature: 230°C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, – Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4074C: 14-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering Solder temperature: 260°C or below, (only to leads) Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 8 Data Sheet G15206EJ5V0DS µPC4074 • The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1