To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. 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HD74LS06 Hex Inverter Buffers / Drivers (with Open Collector High-Voltage Output) REJ03D0392–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS06P DILP-14 pin PRDP0014AB-B (DP-14AV) P — HD74LS06FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) HD74LS06RPEL SOP-14 pin (JEDEC) PRSP0014DE-A (FP-14DNV) RP EL (2,500 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement 1A 1 14 VCC 1Y 2 13 6A 2A 3 12 6Y 2Y 4 11 5A 3A 5 10 5Y 3Y 6 9 4A GND 7 8 4Y (Top view) Absolute Maximum Ratings Item Supply voltage Input voltage Output voltage Power dissipation Operating temperature range Storage temperature Symbol VCC Note VIN VOUT PT Topr Tstg Ratings 7 7 30 400 –20 to +75 –65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Rev.2.00, Feb.18.2005, page 1 of 5 Unit V V V mW °C °C HD74LS06 Recommended Operating Conditions Item Symbol VCC VOH IOL Topr Supply voltage Output voltage Output current Operating temperature Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 30 48 75 Unit V V mA °C Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Output voltage Input current Output current Supply current Symbol VIH VIL VOL IIH IIL II IOH ICCH ICCL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C min. 2.0 — — — — — — typ.* — — — — — — — max. — 0.8 0.4 0.5 20 –0.4 0.1 Unit V V µA mA mA IOL = 24 mA VCC = 4.75 V, VIH = 2 V IOL = 48 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V — — — 23 250 48 µA mA VCC = 4.75 V, VIL = 0.8 V, VOH = 30 V VCC = 5.25 V — — 21 — 51 –1.5 mA V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA V Condition Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL Rev.2.00, Feb.18.2005, page 2 of 5 min. — — typ. 10 15 max. 15 23 Unit ns ns Condition CL = 15 pF, RL = 110 Ω HD74LS06 Testing Method Test Circuit VCC Input RL P.G. Output CL Note: CL includes probe and jig capacitance. Waveform tTLH Input 10% tTHL 90% 1.3 V 90% 1.3 V tPHL 3V 10% 0V tPLH VOH Output 1.3 V 1.3 V VOL Note: Input pulse: PRR = 1 MHz, duty cycle 50%, Zout = 50 Ω , tTLH ≤ 15 ns, tTHL ≤ 6 ns. Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS06 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B MASS[Typ.] 0.97g Previous Code DP-14AV D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 L A θ bp e Dimension in Millimeters Min e1 A1 0.51 bp 0.40 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV D 0.48 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.23g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 7.4 1.30 Z ( Ni/Pd/Au plating ) 20.32 5.06 b3 c Max 8 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 Nom Max D 10.06 10.5 E 5.50 A2 7 e A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 1.42 Z L L Rev.2.00, Feb.18.2005, page 4 of 5 8° 0.50 1 0.70 1.15 0.90 HD74LS06 JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A *1 MASS[Typ.] 0.13g Previous Code FP-14DNV NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 14 8 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 8.65 9.05 E 3.95 A2 A1 7 1 Z e *3 bp x M 0.14 A c A1 θ L Detail F 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 b1 c y 0.25 1.75 bp L1 1 θ 0° HE 5.80 e 8° 1.27 0.25 x y 0.15 Z 0.635 L L Rev.2.00, Feb.18.2005, page 5 of 5 0.10 A 0.40 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. 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