BCR16CS-12LA Datasheet

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Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
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April 1st, 2010
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1.
2.
3.
4.
5.
6.
7.
All information included in this document is current as of the date this document is issued. Such information, however, is
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confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
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“Standard”:
8.
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12.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
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“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.
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BCR16CS-12LA
Triac
Medium Power Use
REJ03G0341-0300
Rev.3.00
Nov 30, 2007
Features
• Non-Insulated Type
• Planar Passivation Type
• IT (RMS) : 16 A
• VDRM : 600 V
• IFGTI, IRGTI, IRGT III : 30 mA (20 mA)Note6
Outline
RENESAS Package code: PRSS0004AB-A
(Package name: TO-220S)
4
1
2, 4
1.
2.
3.
4.
3
2
T1 Terminal
T2 Terminal
Gate Terminal
T2 Terminal
1
3
Applications
Contactless AC switch, light dimmer, electronic flasher unit, hair drier, control of household equipment such as TV sets,
stereo systems, refrigerator, washing machine, infrared kotatsu, carpet, electric fan, solenoid driver, small motor control,
solid state relay, copying machine, electric tool, electric heater control, and other general purpose control applications
Maximum Ratings
Parameter
Symbol
Repetitive peak off-state voltageNote1
Non-repetitive peak off-state voltageNote1
REJ03G0341-0300
Page 1 of 6
Rev.3.00
Nov 30, 2007
VDRM
VDSM
Voltage class
12
600
720
Unit
V
V
BCR16CS-12LA
Parameter
RMS on-state current
Symbol
IT (RMS)
Ratings
16
Unit
A
Surge on-state current
ITSM
170
A
I2t
121
A2s
PGM
PG (AV)
VGM
IGM
Tj
Tstg
—
5
0.5
10
2
– 40 to +125
– 40 to +125
1.2
W
W
V
A
°C
°C
g
Symbol
IDRM
VTM
Min.
—
—
Typ.
—
—
Max.
2.0
1.5
Unit
mA
V
I2t for fusing
Peak gate power dissipation
Average gate power dissipation
Peak gate voltage
Peak gate current
Junction temperature
Storage temperature
Mass
Conditions
Commercial frequency, sine full wave
Note3
360° conduction, Tc = 100°C
60Hz sinewave 1 full cycle, peak value,
non-repetitive
Value corresponding to 1 cycle of half
wave 60Hz, surge on-state current
Typical value
Notes: 1. Gate open.
Electrical Characteristics
Parameter
Repetitive peak off-state current
On-state voltage
Test conditions
Tj = 125°C, VDRM applied
Tc = 25°C, ITM = 25 A,
Instantaneous measurement
Gate trigger voltageNote2
Ι
ΙΙ
ΙΙΙ
VFGTΙ
VRGTΙ
VRGTΙΙΙ
—
—
—
—
—
—
1.5
1.5
1.5
V
V
V
Tj = 25°C, VD = 6 V, RL = 6 Ω,
RG = 330 Ω
Gate trigger currentNote2
Ι
ΙΙ
ΙΙΙ
IFGTΙ
IRGTΙ
IRGTΙΙΙ
—
—
—
—
—
—
30Note6
30Note6
30Note6
mA
mA
mA
Tj = 25°C, VD = 6 V, RL = 6 Ω,
RG = 330 Ω
VGD
Rth (j-c)
0.2
—
—
—
—
1.4
V
°C/W
Tj = 125°C, VD = 1/2 VDRM
Junction to caseNote3 Note4
(dv/dt)c
10
—
—
V/µs
Tj = 125°C
Gate non-trigger voltage
Thermal resistance
Critical-rate of rise of off-state
Note5
commutating voltage
Notes: 2.
3.
4.
5.
6.
Measurement using the gate trigger characteristics measurement circuit.
Case temperature is measured on the T2 tab.
The contact thermal resistance Rth (c-f) in case of greasing is 1.0°C/W.
Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below.
High sensitivity (IGT ≤ 20 mA) is also available. (IGT item: 1)
Test conditions
1. Junction temperature
Tj = 125°C
2. Rate of decay of on-state commutating current
(di/dt)c = – 8.0 A/ms
3. Peak off-state voltage
VD = 400 V
REJ03G0341-0300
Page 2 of 6
Rev.3.00
Nov 30, 2007
Commutating voltage and current waveforms
(inductive load)
Supply Voltage
Time
Main Current
(di/dt)c
Time
Main Voltage
(dv/dt)c
Time
VD
BCR16CS-12LA
Performance Curves
103
7
5
3
2
102
7
5
3
2
Rated Surge On-State Current
200
Surge On-State Current (A)
On-State Current (A)
Maximum On-State Characteristics
Tj = 125°C
Tj = 25°C
101
7
5
3
2
140
120
100
80
60
40
20
2 3 4 5 7 101
2 3 4 5 7 102
Conduction Time (Cycles at 60Hz)
Gate Characteristics (I, II and III)
Gate Trigger Current vs.
Junction Temperature
101
7
5
3 VGT = 1.5V
2
PG(AV) = 0.5W
PGM = 5W
IGM = 2A
100
7
5
3
2
IFGT I, IRGT I, IRGT III
VGD = 0.2V
10–1
7
5
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
103
7
5
4
3
2
Typical Example
IRGT III
102
IFGT I, IRGT I
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
Gate Trigger Voltage vs.
Junction Temperature
Maximum Transient Thermal Impedance
Characteristics (Junction to case)
Typical Example
102
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
Rev.3.00
Nov 30, 2007
Transient Thermal Impedance (°C/W)
Gate Current (mA)
103
7
5
4
3
2
REJ03G0341-0300
Page 3 of 6
Gate Trigger Current (Tj = t°C)
× 100 (%)
Gate Trigger Current (Tj = 25°C)
On-State Voltage (V)
3
2 VGM = 10V
Gate Voltage (V)
160
0
100
100
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4
Gate Trigger Voltage (Tj = t°C)
× 100 (%)
Gate Trigger Voltage (Tj = 25°C)
180
102 2 3 5 7 103
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
Conduction Time (Cycles at 60Hz)
BCR16CS-12LA
Allowable Case Temperature vs.
RMS On-State Current
40
160
35
140
Case Temperature (°C)
On-State Power Dissipation (W)
Maximum On-State Power Dissipation
30 360° Conduction
Resistive,
25 inductive loads
20
15
10
5
0
0
2
4
6
8 10 12 14 16 18 20
100
80
60
40
360° Conduction
20 Resistive,
inductive loads
0
0 2 4 6 8 10 12 14 16 18 20
RMS On-State Current (A)
Allowable Ambient Temperature vs.
RMS On-State Current
Allowable Ambient Temperature vs.
RMS On-State Current
160
120
120 × 120 × t2.3
100
100 × 100 × t2.3
80
60 × 60 × t2.3
60 Curves apply
regardless of
40 conduction angle
Resistive,
20 inductive loads
Natural convection
0
0 2 4 6 8 10 12 14 16 18 20
Ambient Temperature (°C)
All fins are black painted
140 aluminum and greased
Natural convection
No fins
Curves apply regardless
of conduction angle
Resistive, inductive loads
140
120
100
80
60
40
20
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
RMS On-State Current (A)
RMS On-State Current (A)
Repetitive Peak Off-State Current vs.
Junction Temperature
Holding Current vs.
Junction Temperature
105
7 Typical Example
5
3
2
104
7
5
3
2
103
7
5
3
2
102
–60 –40 –20 0 20 40 60 80 100 120 140
REJ03G0341-0300
Page 4 of 6
Junction Temperature (°C)
Rev.3.00
Nov 30, 2007
Holding Current (Tj = t°C)
× 100 (%)
Holding Current (Tj = 25°C)
Ambient Temperature (°C)
120
RMS On-State Current (A)
160
Repetitive Peak Off-State Current (Tj = t°C)
× 100 (%)
Repetitive Peak Off-State Current (Tj = 25°C)
Curves apply regardless
of conduction angle
103
7
5
4
3
2
Typical Example
102
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
103
7
5
3
2
T2+, G–
Typical Example
Distribution
102
7
5
3
2
101
7
5
3 T +, G+
2
2
Typical Example
T2–, G–
0
10
–40
0
40
80
120
160
Breakover Voltage vs.
Junction Temperature
160
120
100
80
60
40
20
0
–60 –40 –20 0 20 40 60 80 100120 140
Junction Temperature (°C)
Breakover Voltage vs.
Rate of Rise of Off-State Voltage
Commutation Characteristics
160
Typical Example
Tj = 125°C
140
120
100
III Quadrant
80
60
40
I Quadrant
20
0
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
7
Typical Example
5
Tj = 125°C
3 IT = 4A
τ = 500µs
2
VD = 200V
f = 3Hz
1
10
7
5
Minimum
3
2
100
7 0
10
Rate of Rise of Off-State Voltage (V/µs)
Gate Trigger Current vs.
Gate Current Pulse Width
Gate Trigger Current (tw)
× 100 (%)
Gate Trigger Current (DC)
Typical Example
140
Junction Temperature (°C)
Critical Rate of Rise of Off-State
Commutating Voltage (V/µs)
Breakover Voltage (dv/dt = xV/µs)
× 100 (%)
Breakover Voltage (dv/dt = 1V/µs)
Latching Current (mA)
Latching Current vs.
Junction Temperature
Breakover Voltage (Tj = t°C)
× 100 (%)
Breakover Voltage (Tj = 25°C)
BCR16CS-12LA
103
7
5
4
3
2
Typical Example
Time
Main Voltage
(dv/dt)c
VD
Main Current
(di/dt)c
IT
τ
Time
I Quadrant
Characteristics
Value
III Quadrant
2 3
5 7 101
2 3
5 7 102
2 3
Rate of Decay of On-State
Commutating Current (A/ms)
Gate Trigger Characteristics Test Circuits
6Ω
6Ω
IFGT I
IRGT I
IRGT III
A
6V
V
102
7
5
4
3
2
Test Procedure I
A
6V
2 3 4 5 7 101
2 3 4 5 7 102
Gate Current Pulse Width (µs)
REJ03G0341-0300
Page 5 of 6
Rev.3.00
Nov 30, 2007
V
V
330Ω
Test Procedure II
6Ω
101 0
10
A
6V
330Ω
330Ω
Test Procedure III
BCR16CS-12LA
Package Dimensions
Previous Code
TO-220S
RENESAS Code
PRSS0004AB-A
1.5Max
+0.3
3.0 –0.5
Unit: mm
4.5
1.5Max
10.5Max
MASS[Typ.]
1.2g
1.3
0
+0.3
–0
(1.5)
JEITA Package Code
SC-83
8.6 ± 0.3
9.8 ± 0.5
Package Name
TO-220S
1
5
0.5
2.6 ± 0.4
4.5
0.8
Order Code
Lead form
Surface-mounted type
Surface-mounted type
Standard
packing
Taping
Quantity
Plastic Magazine
(Tube)
1000
50
Type name – T +Direction (1 or 2) +1
Standard order
code example
BCR16CS-12LA-T11
Type name
BCR16CS-12LA
Standard order code
Note : Please confirm the specification about the shipping in detail.
REJ03G0341-0300
Page 6 of 6
Rev.3.00
Nov 30, 2007
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
http://www.renesas.com
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Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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© 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2