SMT POWER INDUCTORS Shielded Drum Core - P1174NL Series Height: 2.8mm Max Footprint: 6.7mm x 4.5mm Max Current Rating: up to 3.0A Inductance Range: 1µH to 5000µH Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C Inductance @ 0ADC (uH ±20%) 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 150 220 330 470 600 680 1000 3300 5000 Part 2,3 Number P1174.102NL P1174.152NL P1174.222NL P1174.332NL P1174.472NL P1174.682NL P1174.103NL P1174.153NL P1174.223NL P1174.333NL P1174.473NL P1174.683NL P1174.104NL P1174.154NL P1174.224NL P1174.334NL P1174.474NL P1174.604NL P1174.684NL P1174.105NL P1174.335NL P1174.505NL Inductance @ Irated Typical 0.7 1.0 1.6 2.3 3.4 4.8 7.2 14 18 26 32 45 74 109 161 208 350 412 500 744 2300 4900 Irated 5 (ADC) Ω) DCR (mΩ (MAX) 3 2.0 1.7 1.3 1.0 0.90 0.80 0.60 0.50 0.40 0.35 0.32 0.28 0.22 0.15 0.14 0.13 0.12 0.10 0.07 0.065 0.05 13 15 18 21 30 51 73 90 120 188 230 370 470 620 950 1340 1800 2550 2650 4000 11000 18500 Saturation 6 Current -30% (A) 3 2.0 1.7 1.3 1.0 0.90 0.80 0.60 0.50 0.40 0.35 0.32 0.28 0.22 0.15 0.14 0.13 0.12 0.10 0.07 0.065 0.05 Heating 7 Current +30°C (A) 3.0 2.8 1.8 1.6 1.4 1.2 1.0 0.8 0.7 0.6 0.5 0.4 0.3 0.26 0.22 0.20 0.19 0.18 0.17 0.15 0.09 0.05 Core Loss 8 Factor (K2) 1600 1900 2300 3400 4100 4500 5400 6300 8000 10000 11000 14000 17000 21000 26000 32000 39000 43000 47000 57000 99000 130000 SRF (MHz) >40 >40 >40 >40 >40 34 31 25 20 16 14 11 9.0 8.0 6.0 5.0 3.9 3.7 3.6 2.6 1.6 1.2 NOTES FROM TABLE: (See page 43) Mechanical .110 2,79 MAX XXX Schematic .180 4,57 .265 6,73 MAX .075 1,91 2 .039 0,98 .175 4,45 MAX TYPICAL INDUCTANCE VS. DC BIAS P1174.105 .138 3,50 .315 8,00 .630 16,00 INDUCTANCE (µH) 1000.0 .285 7,25 1 Weight . . . . . . . . 0.1 grams Tape & Reel . . . . . 2500/reel Dimensions: Inches mm Unless otherwise specified, all tolerances are ± .010 0,25 SUGGESTED PAD LAYOUT P1174.102 1.0 4.30 3.80 3.30 2.80 2.30 1.80 1.30 0.80 0.30 0.25 0.20 0.15 0.10 0.05 0.00 TAPE & REEL LAYOUT P1174.103 10.0 0.1 USER DIRECTION OF FEED P1174.104 100.0 CURRENT (A) USA 858 674 8100 • Germany 49 7032 7806 0 • Singapore 65 6287 8998 • Shanghai 86 21 54643211 / 2 • China 86 755 33966678 • Taiwan 886 3 4641811 www.pulseeng.com 31 SPM2007 (11/07) SMT POWER INDUCTORS Shielded Drum Core Series Notes from Tables (pages 27 - 42) 1. Unless otherwise specified, all testing is made at 100kHz, 0.1VAC. 8. In high volt*time (Et) or ripple current applications, additional heating in the component can occur due to core losses in the inductor which may necessitate derating the current in order to limit the temperature rise of the component. In order to determine the approximate total loss (or temperature rise) for a given application, both copper losses and core losses should be taken into account. 2. Optional Tape & Reel packaging can be ordered by adding a "T" suffix to the part number (i.e. P1166.102NL becomes P1166.102NLT). Pulse complies with industry standard Tape and Tape & Reel specification EIA481. 3. The "NL" suffix indicates an RoHS-compliant part number. Non-NL suffixed parts are not necessarily RoHS compliant, but are electrically and mechanically equivalent to NL versions. If a part number does not have the "NL" suffix, but an RoHS compliant version is required, please contact Pulse for availability. Estimated Temperature Rise: Trise = [Total loss (mW) / K0].833 (oC ) 4. Temperature of the component (ambient plus temperature rise) must be within specified operating temperature range. Total loss = Copper loss + Core loss (mW) 5. The rated current (Irated) as listed is either the saturation current or the heating current depending on which value is lower. Copper loss = IRMS2 x DCR (Typical) (mW) Irms = [IDC2 + ΔI2/12]1/2 (A) 6. The saturation current, Isat, is the current at which the component inductance drops by the indicated percentage (typical) at an ambient temperature of 25°C. This current is determined by placing the component in the specified ambient environment and applying a short duration pulse current (to eliminate self-heating effects) to the component. Core loss = K1 x f (kHz)1.23 x Bac(Ga)2.38 (mW) Bac (peak to peak flux density) = K2 x ΔI (Ga) [= K2/L(µH) x Et(V-µSec) (Ga)] where f varies between 25kHz and 1MHz, and Bac is less than 2500 Gauss. Part No. PG0085/86 PG0087 PG0040/41 P1174 PF0601 PF0464 PF0465 P1166 P1167 PF0560NL P1168/69 P1170/71 P1172/73 PF0552NL PF0553NL Trise Factor (K0 ) 2.3 5.8 0.8 0.8 4.6 3.6 3.6 1.9 2.1 5.5 4.8 4.3 5.6 8.3 7.1 Core Loss Factor (K1) 5.29E-10 15.2E-10 2.80E-10 6.47E-10 14.0E-10 24.7E-10 33.4E-10 29.6E-10 42.2E-10 136E-10 184E-10 201E-10 411E-10 201E-10 411E-10 Core Loss / K1 (mW) 7. The heating current, Idc, is the DC current required to raise the component temperature by the indicated delta (approximately). The heating current is determined by mounting the component on a typical PCB and applying current for 30 minutes. The temperature is measured by placing the thermocouple on top of the unit under test. K2 is a core size and winding dependant value and is given for each p/n in the proceeding datasheets. K0 & K1 are platform and material dependant constants and are given in the table below for each platform. CoreLoss/K1 Vs Flux Density 3.00E+10 100KHz 2.50E+10 200KHz 2.00E+10 300KHz 1.50E+10 400KHz 1.00E+10 500KHz 700KHz 0.50E+10 0 1.0MHz 0 500 1000 1500 DB (Gauss) 2000 2500 where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)] Take note that the component's temperature rise varies depending on the system condition. It is suggested that the component be tested at the system level, to verify the temperature rise of the component during system operation. USA 858 674 8100 • Germany 49 7032 7806 0 • Singapore 65 6287 8998 • Shanghai 86 21 54643211 / 2 • China 86 755 33966678 • Taiwan 886 3 4641811 www.pulseeng.com 43 SPM2007 (11/07)