MAXIM MAX97236EWA

19-5810; Rev 0; 3/11
TION KIT
EVALUA BLE
IL
AVA A
Audio Amplifier with Jack Detection
Features
The MAX97236 is an audio amplifier with volume control and microphone preamplifier intended for use in
portable audio systems employing a headphone jack.
The audio circuit is powered from a single, dual-mode
charge pump, allowing the output signals to be ground
referenced, and eliminating the need for large and
expensive DC-blocking capacitors. The configuration of
a 3.5mm jack is determined by autoconfigure circuitry.
The IC’s functional blocks are auto-enabled after the
configuration of the jack is determined.
S Microphone Amplifier and Bias
The audio amplifier is powered from a single 1.8V power
supply that reduces overall power consumption. The
microphone preamplifier and bias are powered from a
separate power-supply input accommodating bias voltages that are greater than 2.4V.
S 25-Bump, 2.4mm x 2.3mm, 0.4mm Pitch WLP
S 30mW Headphone Amplifier Employs SecondGeneration DirectDrive® with Dual-Mode ChargePump Architecture
S Automatic Jack Detection Circuitry
S 1.8V Power Supply
S 2.4V to 3.6V Microphone Power Supply
S Headphone Amplifier Volume Control
S Decodes Data from a Passive Multibutton Headset
Remote Control
DirectDrive is a registered trademark of Maxim Integrated Products, Inc.
The automatic jack detection determines when a 3.5mm
plug is inserted into the system jack and determines the
configuration of the installed load. The configuration of
the load is then reported to the system through the I2C
interface. Multiple popular jack and load configurations
are detectable with this scheme. The IC detects headsets, headphones, and A/V cables.
The headphone amplifier is capable of over 35mW into
16I. The device is available in a small, 25-bump WLP
package with a 0.4mm pitch and is specified over the
extended -40NC to +85NC temperature range.
Applications
Simplified Block Diagram
1.8V
VDD
2.4V TO 3.0V
MICVDD
HPL
TIP
HPR
RING1
Smartphones
Mobile Handsets
CHARGE
PUMP
Notebooks
Portable Gaming Devices
Tablets
Ordering Information
PART
MAX97236EWA+
TEMP
RANGE
-40NC to +85NC
PINPACKAGE
RING2
MAX97236
I2C
ADDRESS
SDA
0x80
IRQ
25 WLP
JACK
DETECTION
AND
CONFIGURATION
SCL
I2C
INTERFACE
AND
CONTROL
SERIAL
INTERFACE
SLEEVE
+Denotes a lead(Pb)-free/RoHS-compliant package.
MOUTP
MOUTN
MIC
JACKSW
Functional Diagram/Typical Application Circuit appears at end of
data sheet.
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX97236
General Description
MAX97236
Audio Amplifier with Jack Detection
ABSOLUTE MAXIMUM RATINGS
MOUT+ and MOUT- to PGND...........-0.3V to (VMICVDD + 0.3V)
C1P to PGND.........................................-0.3V to (VPVDD + 0.3V)
C1N to PGND......................................... (VPVSS - 0.3V) to +0.3V
SDA, SCL, EXTCLK, and IRQ to PGND...................-0.3V to +6V
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (Mulitlayer Board, TA = +70NC)
25-Bump WLP (derate 19.2mW/NC above +70NC).....1536mW
Junction Temperature......................................................+150NC
Operating Temperature Range........................... -40NC to +85NC
Storage Temperature Range............................. -65NC to +150NC
Soldering Temperature (reflow).......................................+230NC
VDD to PGND...........................................................-0.3V to +2V
MICVDD to PGND.................................................-0.3V to +5.5V
PVDD to PGND.......................................... -0.3V to (VDD + 0.3V)
PVSS to PGND.........................................................-2V to +0.3V
GND to PGND.......................................................-0.1V to +0.1V
TIP, RING1, IN_ to PGND...................................... (VPVSS - 0.3V)
to (VPVDD + 0.3V)
RING2, SLEEVE to PGND....................................... (GND - 0.3V)
to (VMICVDD + 0.3V)
JACKSW to PGND............... (VPVSS - 0.3V) to (VMICVDD + 0.3V)
MBIAS to PGND........................................ -0.3V to (VDD + 0.3V)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Junction-to-Ambient Thermal Resistance (qJA)...............52°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF. Typical values tested at TA = +25NC, unless
otherwise noted. See the Functional Diagram/Typical Application Circuit.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
1.62
1.8
1.98
V
1.6
V
GENERAL
Supply Voltage Range
VDD
Undervoltage Lockout
UVLO
IVDD_SDF
In jack detect mode, TA = +25NC, fast
detect mode, external clock disabled
14
IVDD_SDS
In jack detect mode, TA = +25NC, slow
detect mode, external clock disabled
14
25
25
FA
2.3
3.9
mA
Shutdown Supply Current
Sleep Supply Current
Quiescent Supply Current
Guaranteed by PSRR test
Rising VDD, TA = +25NC
IVDD_SL
IVDD
TA = +25NC, state = LRGM
SDA, SCL Input Logic-High
VIH
1.8V logic compliant
VIL
1.8V logic compliant
SDA, SCL, EXTCLK Input
Leakage Current High
IIH
TA = +25NC
SDA, SCL, EXTCLK Input
Leakage Current Low
IIL
TA = +25NC
SDA, SCL Output Logic-Low
VOLI2C
IOLI2C = 2.3mA
IRQ Output High Current
IOH
VIRQ_OUT = 3.3V, TA = +25NC
IRQ Output Logic-Low
VOL
IOL = 3mA
2
FA
TA = +25NC, external clock disabled
SDA, SCL Input Logic-Low
25
1.4
V
0.4
V
-1
+1
FA
-1
+1
FA
0.2 x
VDD
V
1
FA
0.2 x
VDD
V
Audio Amplifier with Jack Detection
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF. Typical values tested at TA = +25NC, unless
otherwise noted. See the Functional Diagram/Typical Application Circuit.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
EXTCLK Input High Voltage
MIN
TYP
EXTCLK Frequency Range
fEXTCLK
TA = +25NC
1
D_EXTCLK
TA = +25NC
45
Maximum EXTCLK Slew Rate
Turn-On Time
tON
UNITS
V
EXTCLK Input Low Voltage
EXTCLK Duty Cycle
MAX
1.4
19.2
fEXTCLK = 1MHz, 0.4V to 1.4V
50
fEXTCLK = 10MHz, 0.4V to 1.4V
5
(Note 3)
1
0.4
V
26
MHz
55
%
ns
10
ms
JACK DETECTION
Turn-On Time
tONTIME
Jack detect time from insertion to
interrupt (Note 4)
500
ms
AUDIO AMPLIFIER (Gain = 0dB, Unless Otherwise Noted)
Output Offset Voltage
Output Power
Line Output Voltage
Total Harmonic Distortion
Plus Noise
Signal-to-Noise Ratio
Power-Supply Rejection Ratio
VOS
TA = +25NC, state = LRGM
POUT
RL = 32I, THD+N = 1%, fIN = 1kHz
RL = 16I, THD+N = 1%, fIN = 1kHz
35
1
RL = 10kI
THD+N
RL = 16I, POUT = 10mW, fIN = 1kHz
RL = 16I, POUT = 0.1mW, fIN = 1kHz
RL = 10kI, VOUT = 1VRMS, fIN = 1kHz
0.04
Referenced to 32I load, 1VRMS input
signal, A-weighted
103
Referenced to 32I load, 1VRMS input
signal, A-weighted (gain = -30dB)
85
DC 1.62V to 1.98V, gain = 0dB,
TA = +25NC
87
fIN = 217Hz, 100mVP-P ripple,
gain = 0dB
78
fIN = 10kHz, 100mVP-P ripple,
gain = 0dB
74
SNR
PSRR
VN
Peak Output Current
IOUT
Minimum Headphone Impedance
ZOUT
Crosstalk
+500
30
VO_LINE
A-weighted
Output Noise
-500 XTALK
FV
mW
VRMS
0.05
%
0.03
dB
dB
6
A-weighted, gain = -30dB
1.7
A-weighted, gain = -60dB
1.4
Peak current needed to output the rated
typical power
40
mA
12
I
RL = 16I, fIN = 1kHz, POUT = 5mW,
crosstalk between audio channels,
gain = 0dB, with ground sense
-51
RL = 32I, fIN = 1kHz, POUT = 25mW,
crosstalk between audio channels,
gain = 0dB, with ground sense
-56
FVRMS
dB
3
MAX97236
ELECTRICAL CHARACTERISTICS (continued)
MAX97236
Audio Amplifier with Jack Detection
ELECTRICAL CHARACTERISTICS (continued)
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF. Typical values tested at TA = +25NC, unless
otherwise noted. See the Functional Diagram/Typical Application Circuit.) (Note 2)
PARAMETER
Maximum Capacitive Load Drive
SYMBOL
CL
Power Consumption
CONDITIONS
MIN
470
RL = 10kI, gain < 0dB
200
RL = 32I
200
POUT = 0.5mW, RL = 32I
POUT = 4.5mW, RL = 32I,
Per channel (Note 5)
4.5
KCP
RL = 32I, peak
voltage, A-weighted,
32 samples/second
Input Capacitance
CIN
Gain = 6dB
Input Impedance
ZIN
UNITS
pF
mW
23
Output voltage needed THSH = 0
to toggle the chargeTHSH = 1
pump outputs
Click-and-Pop Level
MAX
6.8
POUT = 20mW, RL = 32I,
(Note 6)
Charge-Pump Switch Threshold
TYP
RL = 10kI, gain R 0dB
0.4
V
0.55
Into shutdown
-74
Out of shutdown
-74
dBV
150
16
pF
75
kI
AUDIO AMPLIFIER VOLUME CONTROL
Gain Range
+6
dB
Maximum Volume Setting
From min to max volume setting
-60
5.5
6
6.5
dB
Minimum Volume Setting
-60.5
-60
-59.5
dB
Mute Attenuation
80
Channel-to-Channel Gain
Matching
-0.5
Gain Change per Step
dB
+0.5
Volume setting -54dB P _VOL P 6dB
1
Volume setting -60dB P _VOL P -54dB
2
dB
dB
MICROPHONE BIAS
MIC Bias Supply Voltage
VMICVDD
Bias Output Voltage
VBIAS
Bias Output Current
IBIAS_OUT
MIC Supply Current Consumption
Bias Output Resistance
Bias Output Noise
4
Guaranteed by MIC bias PSRR test
2.4
High output voltage
2.4
2.6
2.8
Low output voltage
1.84
2
2.16
RMICBIAS = 2.2kI, high (2.6V) output
voltage, TA = +25NC
1.2
IMBIAS
RMBIAS
VN_BIAS
3.6
V
V
mA
150
400
MICR = 0b00, VMBIAS = 2.6V,
TA = +25NC
2.02
2.2
2.38
MICR = 0b01, VMBIAS = 2.6V,
TA = +25NC
2.39
2.6
2.81
MICR = 0b10, VMBIAS = 2.6V,
TA = +25NC
2.76
3
3.24
FA
kI
MICR = 0b11, VMBIAS = 2.6V,
TA = +25NC
0.07
With external capacitor, VMBIAS = 2.6V
2.8
FVRMS
Audio Amplifier with Jack Detection
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF. Typical values tested at TA = +25NC, unless
otherwise noted. See the Functional Diagram/Typical Application Circuit.) (Note 2)
PARAMETER
Bias Power-Supply Rejection
SYMBOL
PSRRMBIAS
CONDITIONS
RMBIAS = 2.2kI
VMICVDD = 2.4V to
3.6V, TA = +25NC
MIN
TYP
74
90
MAX
UNITS
dB
fIN = 2kHz, 100mVP-P
ripple
75
MICROPHONE PREAMPLIFIER
MIC Preamp Gain
AMIC
Supply Current Consumption
IDD_MAMP
MIC Preamp Noise
VN_MAMP
Total Harmonic Distortion
Plus Noise
Gain = high, fIN = 997Hz
23
24
25
Gain = low, fIN = 997Hz
11
12
13
200
300
Input referred (Note 7), gain = 24dB,
A-weighted 0.1kHz to 7kHz
3
THD+NMICPRE fIN = 1kHz, VIN = 1VRMS
dB
FA
FV
3
%
Low Corner Frequency Response
f-3dB
Relative to 997Hz
15
Hz
High Corner Frequency Response
f-3dB
Relative to 997Hz
> 300
kHz
MIC Preamplifier Power-Supply
Rejection
PSRMAMP
Output Common-Mode Voltage
VCM_MIC
VMICVDD = 2.4V to 3.6V, TA = +25NC,
gain = +24dB, RMIC = 500I
74
90
fIN = 2kHz, 100mVP-P ripple (Note 7)
58
Voltage measured from MOUTP or
MOUTN to GND
0.8
dB
V
Input Capacitance
CMAMP
AC-coupling capacitance
85
pF
Input Resistance
RMAMP
Input resistance
100
MI
10
I
Output Impedance
ZOUT
6-BIT KEY ENCODER ADC
0.64
V
Minimum ADC Course Range
Level at which the mic bias must drop to
trigger a conversion
LSB 10mV
0.128
V
Maximum ADC Course Range
LSB 10mV
0.64
V
Minimum ADC Fine Range
LSB 2mV
0
V
Maximum ADC Fine Range
LSB 2mV
0.128
V
ADC Trip Level
CHARGE PUMP
Oscillator Frequency
fOSC1
fOSC2
VOUT = 0V, RL = open, TA = +25NC
VOUT = 0.2V, RL = open
78
83
665
88
kHz
ESD CHARACTERISTICS
ESD Protection
Pins connected to the jack:
TIP, RING1, RING2, SLEEVE, JACKSW
±2
All other pins
±2
kV
5
MAX97236
ELECTRICAL CHARACTERISTICS (continued)
MAX97236
Audio Amplifier with Jack Detection
I2C TIMING CHARACTERISTICS
(TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
400
kHz
Serial-Clock Frequency
fSCL
0
Bus Free Time Between STOP and
START Conditions
tBUF
1.3
Fs
tHD,STA
0.6
Fs
SCL Pulse-Width Low
tLOW
1.3
Fs
SCL Pulse-Width High
tHIGH
0.6
Fs
Setup Time for a REPEATED
START Condition
tSU,STA
0.6
Fs
Data Hold Time
tHD,DAT
0
Data Setup Time
tSU,DAT
100
SDA and SCL Receiving Rise Time
tR
20 +
0.1CB
300
ns
SDA and SCL Receiving Fall Time
tF
20 +
0.1CB
300
ns
SDA Transmitting Fall Time
tF
20 +
0.1CB
250
ns
tSU,STO
0.6
400
pF
50
ns
Hold Time (REPEATED) START
Condition
Setup Time for STOP Condition
Bus Capacitance
CB
Pulse Width of Suppressed Spike
tSP
0
900
ns
ns
Fs
Note 2: All specifications are 100% tested at TA = +25NC. Temperature limits are guaranteed by design.
Note 3: The current listed tON is the time from the system sending the enable signal, after receiving the DDONE signal, to when
the amplifier outputs turn on.
Note 4: Total turn-on time from jack insert to output enable is dependent upon the search algorithm.
Note 5: Power consumption numbers taken with the THRH bit set high, fixing the power-supply switchover threshold at its highest value.
Note 6: Power consumption numbers taken with the high efficiency bit set low, fixing the power-supply switchover threshold at its
lowest value, providing the least amount of dynamic distortion.
Note 7: Tested with RMIC = 6kI in parallel with 5pF connected from SLEEVE to RING2.
6
Audio Amplifier with Jack Detection
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF.)
fIN = 100Hz
fIN = 6kHz
fIN = 1kHz
5
10
15
20
25
30
0.2
0
0.4
0.6
0.8
1.0
VOUT (VRMS)
HEADPHONE AMPLIFIER THD+N
vs. FREQUENCY
OUTPUT POWER
vs. LOAD RESISTANCE
VOUT = 1VRMS
0.1
VOUT = 600mVRMS
0.01
0.001
0.1
1
10
45
40
35
20
6dB GAIN
20
0
-10
0dB GAIN
-20
10
-30
5
-40
0
-50
100
1000
-30dB GAIN
0.01
0.1
1
10
100
1000
LOAD RESISTANCE (I)
FREQUENCY (kHz)
TOTAL POWER DISSIPATION
vs. TOTAL OUTPUT POWER
HEADPHONE CROSSTALK
vs. FREQUENCY
HEADPHONE AMPLIFIER POWER-SUPPLY
REJECTION RATIO vs. FREQUENCY
60
CROSSTALK (dB)
16I
50
40
33I
30
RL = 32I
POUT = 25mW
FREQ = 1kHz
70
-30
60
-40
10
-60
0
-70
20
40
60
80
TOTAL OUTPUT POWER (mW)
100
VRIPPLE = 200mVP-P
RL = 16I
80
-20
50
40
30
-50
20
90
PSRR (dB)
70
-10
100
MAX97236 toc08
0
MAX97236 toc07
80
MAX97236 toc09
FREQUENCY (kHz)
90
0
RL = 32I
30
1% THD+N
10
100
10
25
1
10
GAIN vs. FREQUENCY
30
100
1
40
10% THD+N
15
0.1
FREQUENCY (kHz)
50
0.0001
0.01
1.4
GAIN (dB)
1
1.2
MAX97236 toc05
MAX97236 toc04
RL = 10kI
TOTAL POWER DISSIPATION (mW)
0.001
0.001
35
PO = 16mW
PO = 1.9mW
0.1
0.01
POUT (mW)
10
0.01
fIN = 1kHz
0.01
0.01
0
0.1
fIN = 6kHz
fIN = 100Hz
1
MAX97236 toc06
1
RL = 32I
THD+N (%)
THD+N (%)
1
0.1
THD+N (%)
RL = 10kI
OUTPUT POWER PER CHANNEL (mW)
THD+N (%)
10
10
MAX97236 toc02
MAX97236 toc01
RL = 32I
THD+N vs. FREQUENCY
THD+N vs. OUTPUT VOLTAGE
10
MAX97236 toc03
THD+N vs. OUTPUT POWER
100
20
10
0.01
0.1
1
FREQUENCY (kHz)
10
100
0
0.01
0.1
1
10
100
FREQUENCY (kHz)
7
MAX97236
Typical Operating Characteristics
Typical Operating Characteristics (continued)
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF.)
HEADPHONE AMPLIFIER
TURN-OFF RESPONSE
MAX97236 toc10
WIDEBAND OUTPUT SPECTRUM
MAX97236 toc11
VSCL
0
VSCL
MAX97236 toc12
HEADPHONE AMPLIFIER
TURN-ON RESPONSE
RBW = 100Hz
OUTPUT AMPLITUDE (dBV)
-20
VIN
VIN
VOUT
VOUT
-40
-60
-80
-100
400µs
-120
0.001
40µs/div
0.01
0.1
1
10
100
FREQUENCY (MHz)
f = 1kHz
VOUT = -50dBV
-40
10
RL = 10kI
GAIN = 12dB
VPVDD
VOUT = 600mVRMS
1
THD+N (%)
OUTPUT AMPLITUDE (dBV)
-20
MAX97236 toc14
MAX97236 toc13
0
MICROPHONE AMPLIFIER THD+N
vs. FREQUENCY
CLASS H OPERATION
-60
VIN
-80
MAX97236 toc15
INBAND OUTPUT SPECTRUM
VOUT = 100mVRMS
0.1
-100
VPVSS
-120
-140
0.1
1
10
0.01
100
0.01
20ms/div
0.1
FREQUENCY (kHz)
MICROPHONE PREAMPLIFIER THD+N
vs. OUTPUT VOLTAGE
100
MIC GAIN = 12dB
10
THD+N (%)
VOUT = 1VRMS
fIN = 100Hz
1
fIN = 6kHz
MIC GAIN = 24dB
fIN = 100Hz
1
fIN = 1kHz
fIN = 6kHz
0.1
0.1
0.1
1
FREQUENCY (kHz)
8
0.01
0.01
0.01
0.1
100
10
fIN = 1kHz
1
VOUT = 300mVRMS
100
THD+N (%)
MAX97236 toc16
RL = 10kI
GAIN = 24dB
0.01
10
MICROPHONE PREAMPLIFIER THD+N
vs. OUTPUT VOLTAGE
MAX97236 toc17
MICROPHONE AMPLIFIER THD+N
vs. FREQUENCY
10
1
FREQUENCY (kHz)
10
100
MAX97236 toc18
0.01
THD+N (%)
MAX97236
Audio Amplifier with Jack Detection
0
0.2
0.4
0.6
0.8
VOUT (V)
1.0
1.2
1.4
1.6
0
0.2
0.4
0.6
0.8
1.0
VOUT (VRMS)
1.2
1.4
1.6
Audio Amplifier with Jack Detection
(VDD = 1.8V, VMICVDD = 3.0V, VGND = VPGND = 0V, CFLY = CPVDD = CPVSS = 1FF.)
MICROPHONE PREAMPLIFIER
POWER-SUPPLY REJECTION RATIO
vs. FREQUENCY
30
80
50
40
RL = 10kI
AV = 24dB
RL = J
AV = 24dB
20
GAIN (dB)
PSRR (dB)
60
RL = J
AV = 24dB
25
70
15
10
RL = 10kI
AV = 24dB
5
30
0
20
-5
10
-10
0
0.1
0.01
1
10
0.01
100
0.1
10
100
1000
MICROPHONE BIAS vs. MICVDD
MICROPHONE BIAS vs. TEMPERATURE
3.0
MAX97236 toc21
3.0
2.5
1
FREQUENCY (kHz)
FREQUENCY (kHz)
MICBIAS = 2.6V
2.5
MICROPHONE BIAS (V)
MICROPHONE BIAS (V)
MAX97236 toc20
VRIPPLE = 200mVP-P
2.0
MICBIAS = 2.0V
1.5
1.0
MAX97236 toc22
90
MAX97236 toc19
100
MICROPHONE AMPLIFIER GAIN
vs. FREQUENCY
VMICBIAS = 2.6V
2.0
VMICBIAS = 2.0V
1.5
1.0
0.5
0.5
0
0
-40
-20
0
20
40
60
TEMPERATURE (°C)
80
100
2.6
2.8
3.0
3.2
3.4
3.6
MICVDD (V)
9
MAX97236
Typical Operating Characteristics (continued)
Audio Amplifier with Jack Detection
MAX97236
Pin Configuration
TOP VIEW
(BUMP SIDE DOWN)
MAX97236
1
2
3
4
5
A
GND
INR
INL
PVDD
JACKSW
B
I.C.
GND
IRQ
MOUTN
TIP
C
PVSS
SCL
EXTCLK
MOUTP
RING1
D
C1N
SDA
PGND
MBIAS
MICVDD
E
C1P
PGND
VDD
RING2
SLEEVE
+
WLP
Pin Description
10
BUMP
NAME
A1, B2
GND
Analog Ground
FUNCTION
A2
INR
Right Audio Input
A3
INL
Left Audio Input
A4
PVDD
A5
JACKSW
B1
I.C.
Internally Connected. Leave unconnected.
B3
IRQ
Interrupt Request Flag. Open-drain, active-low digital output. Pullup with 10kI to system logic
voltage.
B4
MOUTN
B5
TIP
C1
PVSS
Charge-Pump Negative Output. Bypass to PGND with 1FF.
C2
SCL
I2C Serial-Clock Input
C3
EXTCLK
Charge-Pump Positive Output. Bypass to PGND with 1FF.
Jack Switch. Connect to the mechanical switch.
Negative Microphone Output
Left Headphone Output. Connect to the first ring of the four-pole jack.
External System Clock Input. All internal digital clocks are derived from EXTCLK.
Audio Amplifier with Jack Detection
BUMP
NAME
C4
MOUTP
Positive Microphone Output
FUNCTION
C5
RING1
Jack Input 2/Right Headphone Output. Connect to the first ring of the four-pole jack.
D1
C1N
Charge-Pump Flying Capacitor Negative Connection. Connect 1FF between C1N and C1P.
D2
SDA
Serial-Data I/O
D3, E2
PGND
Power Ground. Ground Return for the charge pump.
D4
MBIAS
Microphone Bias Capacitor Connection. Connect 1FF to GND.
D5
MICVDD
E1
C1P
Charge-Pump Flying Capacitor Positive Connection. Connect 1FF between C1N and C1P.
E3
VDD
Main Power-Supply Input. Connect to 1.8V and bypass to GND with 1FF.
E4
RING2
E5
SLEEVE
Microphone Power-Supply Input. Bypass to GND with 1FF.
Microphone Input Headset GND. Connect to the second ring of the four-pole jack.
Microphone Input Headset GND. Connect to the sleeve of the four-pole jack.
Detailed Description
Class H DirectDrive Headphone Amplifier
with Dual-Mode Charge Pump
The headphone amplifier is optimized for low-power
consumption and low noise. A charge pump generates
a negative and positive supply voltage that powers the
headphone amplifier and eliminates the need for a large
output coupling capacitor.
The headphone amplifier has volume control from -60dB
to +6dB. A single-pole filter, f-3dB = 85kHz, attenuates
signals outside the audio band.
Dual-Mode Charge Pump
The charge pump powers the headphone amplifier.
When a headphone load is connected and the audio
output signal is small, the charge pump outputs a Q0.9V
negative and positive supply voltage. When a large
audio signal is applied, the output rails of the charge
pump switch to a higher voltage mode, Q1.8V. The
higher voltage rails accommodate the higher voltage
swing necessary to amplify line level audio signals. The
lower voltage rails reduce the power consumption of the
headphone amplifier when higher rails are not needed.
Class H Operation
The Class H amplifier employs a class AB output stage
with power-supply voltages that shift based on the output
signal needs (Figure 1). The lower power supply rails are
used when the output voltage requirements are below
the 0.5V threshold. The higher supply rails are used
when the output voltage is above the 0.5V threshold,
maximizing output power and voltage swing. The switch
between available power-supply voltages occurs on a
cycle-by-cycle basis.
1.8V
0.9V
32ms
PVDD
VTH_H
OUTPUT VOLTAGE
THRESHOLD
VTH_L
-0.9V
PVSS
32ms
-1.8V
Figure 1. Class H Power-Supply Operation
11
MAX97236
Pin Description (continued)
Audio Short-Circuit Protection
A short on the right audio output does not shut down the
left audio channel. A short on the audio output does not
shut down the right audio channel. This ensures that a
mono audio plug does not damage the chip, but allows
audio to be heard through the other channel output. A
short is considered anything below 4I for a time period
of 100ms.
Ground Sense
The headphone amplifier features output ground sensing for improved crosstalk performance. Crosstalk is
improved by at least 20dB, between the audio channels,
which all share a common jack ground. Figure 2 shows
the audio signal path from the filter through the amplifier
with volume control and the ground sense.
Headphone Amplifier Input Filter
The headphone amplifiers employ a lowpass filter to
remove out-of-band noise from the audio DAC driving
the headphone inputs. The filter attenuates frequencies
above 85kHz.
Headphone Amplifier Volume Control
The IC features a 64-step volume control with a resolution of 1dB/step from +6dB down to -54dB and 2dB/step
from -54dB to -60dB. Figure 3 shows the I/O curve of the
volume control.
Headphone Volume Slewing
Volume slewing breaks up large volume changes into the
smallest available step size as it goes through each gain
level between the initial and final volume setting. Volume
slewing also occurs at device turn-on and turn-off when
enabled. During turn-on, the volume is set to mute before
the output is enabled. Once the output is on, the volume
ramps to the programmed level. At turn-off, the volume is
ramped to mute before the output is disabled.
As briefly described in the last section, the VSEN (volume slew enable) bit decides whether each volume step
is used when changing volume settings or whether the
final volume setting jumps to the new value after writing.
The volume slew enable function is used in conjunction
with the zero-crossing detection enable (ZDEN).
Examples:
VSEN = 0, ZDEN = 0, both functions on: The volume
changes one gain step at a time. The gain only changes
at the zero crossing of the audio signal.
VSEN = 0, ZDEN = 1: The volume changes one gain
step at a time.
VSEN = 1, ZDEN = 0: New volume is asserted as soon
as audio signal has gone through a zero crossing (or
100ms after the last gain change, whichever comes first).
VSEN = 1, ZDEN = 1: New volume is asserted as soon
as the I2C command is received.
Headphone Volume Zero-Crossing Detection
Zero-crossing detection is implemented on the headphone amplifier volume control to prevent large glitches
when volume changes are made. Instead of making
a volume change immediately when requested, the
change is made when the audio signal has a zero crossing or after 100ms, whichever comes first.
10
0
MAX97236
IN_
RING1
OR TIP
RING2
OR SLEEVE
VOLUME SETTING (dB)
MAX97236
Audio Amplifier with Jack Detection
-10
-20
-30
-40
-50
-60
PGND
-70
0
10
20
30
40
50
60
70
STEP NUMBER
Figure 2. Headphone Amplifier Signal Path
12
Figure 3. Headphone Volume Control Input/Output Transfer Function
Audio Amplifier with Jack Detection
Ensure that VMICVDD is greater than the desired microphone bias voltage.
The microphone bias line is also used by passive single
button and passive multibutton headsets.
Microphone Preamplifier
A microphone preamplifier provides an additional gain
of 12dB or 24dB (programmable) with low input-referred
noise and high power-supply rejection. Figure 4 shows
the configuration of the microphone bias, amplifier, and
microphone. Internal AC-coupling capacitors connect
both the microphone output and also the MBIAS line to a
differential amplifier, giving improved PSRR.
MBIAS
MAX97236
Jack Detection and
Configuration Algorithm
The IC features a detection scheme that senses when a
3.5mm plug is inserted into the system jack. After sensing
insertion, a configuration detection algorithm takes over
and reads the makeup of the installed plug. Information
regarding the makeup of the plug is reported back through
the I2C status registers. The device can also be placed in
autoconfigure mode. This mode allows the IC to automatically enable the correct functional blocks depending upon
the class of cable that has been inserted.
Jack Insertion Testing
The jack insertion detection uses an inaudible AC waveform output on the jack pins to sense when a load is
plugged in. This electrical test is used to verify and work
in conjunction with a mechanical switch (JACKSW). The
mechanical switch, while not used as the main sensing
mechanism, can be used to save system power. When
a jack is plugged into a device, the switch at JACKSW
is closed. When no jack is plugged in, the switch at
JACKSW is open. When the jack switch at JACKSW is
working, the electrical polling of the jack can be done
less often. A test is done every time a jack is sensed to
check if the switch at JACKSW is working correctly. If
the IC deems that the switch at JACKSW is broken, the
system is flagged. At that point, the system can decide
whether to ignore JACKSW results and poll more quickly.
Jack Configuration Detection
The jack detection and configuration is bounded by
certain load resistance and capacitance limitations. The
correct detection and configuration cannot be guaranteed outside those limitations. The limitations are shown
in Table 1.
Table 1 shows each load case that is detectable with
the IC’s jack configuration algorithm and which class of
cable is found. The status bits of the I2C register (0x01,
0x02, 0x03) report the load found during testing. The
functional blocks are set automatically if AUTO = 10 or
01 (register 0x01E bits 0 and 1), according to what class
of cable is detected.
Figure 4. Microphone Preamplifier Simplified Schematic
Table 1. Jack Detection and Configuration Load Limits
PARAMETER
SYMBOL
MIN
CCABLE
150
Headphone Load Resistance
RHP
12
650
I
Headphone Load Inductance
LHP
30
1600
FH
Audio Line Load Resistance
RLINE
6
50
kI
Microphone Load Resistance
RMIC
0.5
15
kI
Cable Shield Capacitance
TYP
MAX
UNITS
500
pF
13
MAX97236
Microphone Bias
The IC features a low-noise microphone bias generator
and amplifier. The bias voltage resistors are selectable
through I2C register 0x09.
MAX97236
Audio Amplifier with Jack Detection
Case 9 is a special case that requires subsequent testing of the load pins while servicing the left audio load
that has been found. In this case only, the status bits
report that a line level audio load had been found on TIP
while tests continue to run on RING1 and SLEEVE. Once
a load is found with one of the subsequent tests, enough
information about the cable class is known to stop testing. The status bits reflect what is found, and the signal
paths are configured according to the cable class and
testing stops.
unplug detection method varies, depending on which
load is plugged in. Cases with a microphone wait for the
microphone bias to fly up to its full value. The audio only
headphones wait for SLEEVE to fly up when the jack is
removed.
For cases with an AV cable and audio only connected,
the IC can only rely on JACKSW to sense removal or to
wait for user input to shut down audio.
The electrical unplug detection (JKIN bit) is not available
when the IC is running the jack configuration algorithm,
when in FORCE mode, or when in test mode. In those
cases, an unplug can only be detected mechanically
through the JACKSW bit.
Detecting Jack Removal
There are two main jack removal detection methods: an
electrical method and a mechanical method. The electrical
Table 2. Jack Configurations and Status Registers (After DDONE Bit Has Been Reset)
CASE
NO.
14
CABLE CLASS
PINS
1
2
3
4
JACKSW
STATE
REGISTER
0x00
REGISTER
0x01
REGISTER
0x02
1
Nothing
F
F
F
F
Short
0x00
0x00
0x00
2
Extension cable
C
C
C
C
Open
0x84
0x00
0x00
3
Stereo headset (headphones
with microphone), GND on P3
L
R
G
M
Open
0x8C
0x30
0x01
4
Stereo headset (headphones
with microphone), GND on P4
L
R
M
G
Open
0x8C
0x30
0x02
5
Line audio cable
L
R
G
G
Open
0x84
0xC0
0x03
6
Mono headset, GND on P3
L
G
G
M
Open
0x8C
0x20
0x01
7
Mono headset, GND on P4
L
G
M
G
Open
0x8C
0x20
0x02
8
Mono headset, GND on P3
L
L
G
M
Open
0x8C
0x20
0x01
9
Mono headset, GND on P4
L
L
M
G
Open
0x8C
0x20
0x02
10
Mono headset, GND on P3
L
F
G
M
Open
0x8C
0x20
0x01
11
Mono headset, GND on P4
L
F
M
G
Open
0x8C
0x20
0x02
12
Stereo headphones
L
L
G
G
Open
0x84
0x30
0x03
13
Stereo headphones, right
channel open
L
F
G
G
Open
0x84
0x20
0x03
14
Stereo headphones, left
channel open
F
L
G
G
Open
0x84
0x10
0x03
Audio Amplifier with Jack Detection
MAX97236
Key Switch Encoder
There are two types of keypads that can be connected
to the IC:
• A single-button hook switch or MIC switch that
grounds out the microphone bias when pressed
MIC BIAS
• A passive multibutton headset
Key Switch Encoder Timing
Two registers, 0x15 and 0x16, control the key switch
debounce time, tDEB, and delay time, tDELAY.
The debounce time, 0x15, is the time from when the
switch stops bouncing and when the ADC converts.
MAX97236
The delay time, 0x16, is set long to ensure that an unplug
event is not encoded as a keypress. See Figure 9.
The PRESS Bit
The PRESS bit alerts the system to whether the current
interrupt was caused by a button press or release.
Figure 5. Passive Single-Button Hook Switch
SINGLE BUTTON KEYPRESS OR PASSIVE MULTIBUTTON HEADSET (MBH) PLAY/MUTE, NORMAL SPEED
MCSW RELEASE IRQ
MCSW PRESS IRQ AND REPORT VALUE
ADC CONVERT
VBIAS
GND
tDEB
tDELAY
tDEB
tDELAY
MCSW RELEASE IRQ
SINGLE BUTTON KEYPRESS OR PASSIVE
MULTIBUTTON HEADSET (MBH) PLAY/MUTE, FAST SPEED
ADC CONVERT
tDEB
VBIAS
tDELAY
MCSW PRESS IRQ
AND REPORT VALUE
GND
tDEB
tDELAY
Figure 6. Single-Button, Passive Multibutton Hook Switch/Microphone Switch Timing
15
MAX97236
Audio Amplifier with Jack Detection
Passive Multibutton Headset (MBH)
A passive MBH consists of a microphone with numerous
switches that connect different value resistors to ground.
The switched resistor and the microphone bias resistor
set up a voltage-divider that creates a unique voltage.
The on-chip ADC then encodes the voltage and reports
to the system.
A maximum 0.5I resistance between IC pins RING2 and
SLEEVE and the headset is required for proper operation
of the passive multibutton headset.
Figure 7 shows the circuit diagram of a passive MBH.
Figure 8 shows the timing for a fast or normal speed keypress on a passive MBH. Note that a keypress develops
a voltage that is above ground. The switch that shorts
the microphone bias to ground is handled like the hook
switch in the previous section.
MIC BIAS
ADC
MAX97236
Figure 7. Passive MBH
PASSIVE MULTIBUTTON HEADSET (MBH): OTHER BUTTON, NORMAL SPEED, OR BUTTON HELD
KEYPRESS SET KEY AND REPORT VALUE
VBIAS
KEY RELEASE SET KEY IRQ
ADC CONVERT
GND
tDEB
tDELAY
tDEB
tDELAY
KEY RELEASE SET KEY IRQ
PASSIVE MULTIBUTTON HEADSET (MBH): OTHER BUTTON, FAST SPEED
VBIAS
tDEB
ADC CONVERT
KEYPRESS SET KEY
AND REPORT VALUE
GND
tDEB
Figure 8. MBH Timing
16
tDELAY
tDELAY
Audio Amplifier with Jack Detection
JKIN RELEASE IRQ
ADC CONVERT
VBIAS
GND
tDEB
tDELAY
NOTE: ONE INTERRUPT DETERMINED
BY THE AUTODETECT CIRCUIT
Figure 9. Slow Jack Removal Timing
Register and Bit Descriptions
Table 3. Register Map
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
Status1
JKIN
DDONE
VOL
—
MIC_IN
JACKSW
MCSW
MBH
0x00
0x00
R
Status2
LINE_L
LINE_R
HP_L
KEY
—
—
0x01
0x00
R
0x02
0x00
R
0x03
—
—
HP_R JACKSWINC
GND
ADDRESS DEFAULT R/W
Status3
—
—
—
—
—
—
For Expansion
—
—
—
—
—
—
IRQ Mask1
IJKIN
IDDONE
IVOL
—
IMIC
IMBH
0x04
0x00
R/W
IRQ Mask2
ILINE_L
ILINE_R
IHP_L
IHP_R
IJACKSW
IKEY
—
—
0x05
0x00
R/W
For Expansion
—
—
—
—
—
—
—
—
0x06
—
—
—
JACKSW IMCSW
—
Left Volume
L=R
MUTEL
LVOL
0x07
0xC0
R/W
Right Volume
—
MUTER
RVOL
0x08
0x40
R/W
Microphone
—
GAIN
0x09
0x00
R/W
0x0A
0x00
R/W
0x0B
0x90
R
For Expansion
Vendor ID
Register
MICR
BIAS
—
—
For expansion
ID
—
—
—
—
For Expansion
For expansion
0x0C
0x00
R/W
For Expansion
For expansion
0x0D
0x00
R/W
For Expansion
For expansion
0x0E
0x00
R/W
For Expansion
For expansion
0x0F
0x00
R/W
For Expansion
For expansion
0x10
0x00
R/W
For Expansion
For expansion
0x11
0x00
R/W
Keyscan Clock
Divider 1
KEY_DIV_HIGH
0x12
0x00
R/W
Keyscan Clock
Divider 2
KEY_DIV_LOW
0x13
0x00
R/W
Keyscan Clock
Divider ADC
KEY_DIV_ADC
0x14
0x00
R/W
Keyscan
Debounce
KEY_DEB
0x15
0x00
R/W
Keyscan Delay
KEY_DEL
0x16
0x00
R/W
17
MAX97236
Slow Jack Removal
Removing the headphone jack slowly can cause a false
trigger of the key switch encoder because the right speaker
between RING1 and RING2 shorts between microphone
bias and ground. The programmable delay time must be
set by the system to mask out this slow removal so that
an interrupt does not flag until the JKIN status bit tells the
system the jack is unplugged. Figure 9 shows the timing
and interrupt reporting for a slow jack removal event. The
act of microphone bias flying all the way up is the trigger
for a microphone removal event. The Jack Detection and
Configuration Algorithm section explains more about
sensing jack removal.
MAX97236
Audio Amplifier with Jack Detection
Table 3. Register Map (continued)
REGISTER
B7
B6
Passive MBH
Keyscan Data
PRESS
RANGE
B5
B4
B3
B2
B1
B0
KEYDATA
DC Test Slew
Control
DC_SLEW
State Forcing
—
—
AC Test Control
—
—
For Expansion
—
—
—
For Expansion
—
—
FORCE
AC_REPEAT_
STATE
PULSE_WIDTH_
ADDRESS DEFAULT R/W
0x17
0x00
R
0x18
0x00
R/W
—
0x19
0x20
R/W
PULSE_AMP_
0x1A
0x05
R/W
—
—
—
—
—
0x1B
—
—
—
—
—
—
—
—
0x1C
—
—
MIC_AMP
KS
—
—
0x1D
0x00
R/W
FAST
THRH
0x1E
0x00
R/W
Enable1
SHDN
RESET
—
MIC_
BIAS
Enable2
LFTEN
RGHEN
VSEN
ZDEN
AUTO
Device Status Registers
Registers 0x00 and 0x01 are used to report the makeup of the inserted jack as well as report when a microphone
switch has been pressed or the jack has been removed. The IC uses registers 0x00, 0x01, 0x02, and IRQ to report the
status of various device functions. The Status_ register bits are set when their respective event occurs. Device status
can be determined either by polling registers 0x00, 0x01, and 0x02 or configuring the IRQ to go low when specific
events occur. Registers 0x04 and 0x05 determine which bits in the Status_ register trigger IRQ to go low. IRQ is cleared
upon reading the register.
Table 4. Configuration and Device Status Registers
REGISTER
BIT
18
DESCRIPTION
JKIN
Jack Detected
JKIN changes state when the jack detect circuit senses a load at the left headphone output and SHDN = high
0 = No load at TIP.
1 = Load detected at TIP.
DDONE
Jack Configuration Detect Done
DDONE changes state when the jack detect algorithm finishes and the jack configuration
is known and reported in the status registers 0x00, 0x01, and 0x02. Resets after reading.
0 = Jack detect algorithm is not complete.
1 = Jack detection algorithm is complete.
5
VOL
Volume Slew Complete
VOL goes high after the headphone volume has slewed to its final programmed value. VOL
sets every time a gain change is complete whether the gain change is positive or negative.
Ramp the volume down and wait for VOL to set to ensure clickless turn off. Resets after reading.
0 = No volume slewing sequences have completed since any register was last read.
1 = Volume slewing complete.
4
—
7
Status1
0x00
(Read Only)
NAME
6
—
Audio Amplifier with Jack Detection
REGISTER
BIT
3
2
NAME
MIC_IN
JACKSW
Status1
0x00
(Read Only)
1
Status2
0x01
(Read Only)
MCSW
DESCRIPTION
Microphone Connected/Disconnected
MIC_IN reports when a microphone is connected or removed. Set the MIC_INM interrupt
mask to alert the system when the microphone load status has changed.
0 = Microphone is removed.
1 = Microphone is connected.
JACKSW Status
JACKSW reports the mechanical jack switch status. For an operational mechanical jack
switch, JACKSW flags at the same time. If the switch is broken, or if the jack is not plugged
in all the way, JACKSW and JKIN do not report the same value. The JACKSW bit also reports
when a jack has been removed. Set the PIN5M interrupt mask bit to signal the system when
the status of JACKSW changes.
0 = Mechanical jack switch reports no jack is connected.
1 = Mechanical jack switch shows that the jack is connected.
Microphone Switch Status
MCSW goes high when the microphone bias goes low for the debounce period plus the
delay period. This happens when a switch shorts across the microphone, pulling the
micbias node down, indicating a keypress from a hook switch, ADC P 4 LSB.
Resets after reading.
0 = No change in microphone bias, no switch press.
1 = Microphone bias has been pulled to ground and debounced since the last status
read. Debounce time set by KEY_DEB. Delay time set by KEY_DEL.
Multibutton Headset Status
MBH reports when a keypress from a multibutton headset is ready to be read.
Resets after reading.
0 = No active keypress detected.
1 = Active keypress has been detected.
0
MBH
7
LINE_L
Line-Level Load on TIP Detected
0 = Line-level load on TIP not detected.
1 = Line-level load on TIP detected.
6
LINE_R
Line-Level Load on ROUT Detected
0 = Line-level load on RING1 not detected.
1 = Line-level load on RING1 detected.
5
HP_L
Headphone Load on TIP Detected
0 = Headphone load on TIP not detected.
1 = Headphone load on TIP detected.
4
HP_R
Headphone Load on RING1 Detected
0 = Headphone load on RING1 not detected.
1 = Headphone load on RING1 detected.
3
JACKSW Incorrect
JACKSWINC reports when there are inconsistencies between the mechanical switch
and the electrical plug and unplug detection. The exception is when a plug-in occurs
and SHDN is LOW. JACKSWINC does NOT clear when the STATUS register is read.
JACKSWINC
JACKSW is checked at jack plug-in and unplug JACKSWINC is updated when
JACKSW is checked.
0 = JACKSW reporting is correct and correlates with JKIN.
1 = JACKSW reporting is not correct and does not correlate with JKIN.
19
MAX97236
Table 4. Configuration and Device Status Registers (continued)
MAX97236
Audio Amplifier with Jack Detection
Table 4. Configuration and Device Status Registers (continued)
REGISTER
Status2
0x01
(Read Only)
Status3
0x02
(Read Only)
BIT
NAME
2
KEY
1
—
—
0
—
—
7
—
—
6
—
—
5
—
—
4
—
—
3
—
—
2
—
—
1
GND
0
20
DESCRIPTION
Passive Multibutton Headset KEY Status
KEY reports when the passive multibutton has been pressed. Data is available in
KEYDATA. See Figure 8. Resets after reading.
0 = No button pressed.
1 = Button has been pressed/released.
Debounce and delay times have occurred.
Jack Common Location Identifier
The two GND bits tell the system whether the jack’s common connection is at RING2 or
SLEEVE. GND is also used to indicate when a jack has been removed.
00 = No common connection sensed, jack has been removed or nothing has been inserted
yet.
01 = The common jack connection is RING2.
10 = The common jack connection is SLEEVE.
11 = Common on both RING2 and SLEEVE.
Audio Amplifier with Jack Detection
Table 5. Interrupt Mask Registers
REGISTER
IRQ Mask1
0x04
IRQ Mask2
0x05
BIT
NAME
DESCRIPTION
Jack Detect Interrupt Enable
0 = Disabled
1 = Enabled
7
IJKIN
6
IDDONE
5
IVOL
4
—
3
IMIC
2
JACKSW
1
IMCSW
0
IMBH
7
ILINE_L
Line-Level Load TIP Interrupt Enable
0 = Disabled
1 = Enabled
6
ILINE_R
Line-Level Load RING1 Interrupt Enable
0 = Disabled
1 = Enabled
5
IHP_L
Headphone Load TIP Interrupt Enable
0 = Disabled
1 = Enabled
4
IHP_R
Headphone Load RING1 Interrupt Enable
0 = Disabled
1 = Enabled
3
IJACKSW
2
IKEY
1
—
—
0
—
—
Jack Configuration Detect Done Interrupt Enable
0 = Disabled
1 = Enabled
Volume Slew Interrupt Enable
0 = Disabled
1 = Enabled
—
Microphone Interrupt Enable
0 = Disabled
1 = Enabled
JACKSW Status Interrupt Enable
0 = Disabled
1 = Enabled
Microphone Switch Interrupt Enable
0 = Disabled
1 = Enabled
Multibutton Release Status Interrupt Enable
0 = Disabled
1 = Enabled
JACKSW Incorrect Interrupt Enable
0 = Disabled
1 = Enabled
KEY Interrupt Enable
0 = Disabled
1 = Enabled
21
MAX97236
Interrupt Mask Registers
The Interrupt Mask registers control which status bits flag a system interrupt. Setting an interrupt mask bit causes IRQ
to pull low whenever the target status bits set. The IRQ output resets to high, after I2C register is read.
MAX97236
Audio Amplifier with Jack Detection
Headphone Volume Control Registers
The Headphone Volume registers independently control and report the gain of the left and right headphone amplifiers.
Set B7 in Register 0x04 to have the right-channel gain track the left-channel gain.
Table 6. Headphone Volume Registers
REGISTER
Left Volume
0x07
BIT
NAME
DESCRIPTION
7
L=R
Left/Right Tracking
0 = The right-channel volume control is independent of the left.
1 = The left and right volume controls track each other allowing for only one register to be written to change both channel volumes. Control both volume controls by
writing to LVOL.
6
MUTEL/
MUTER
5
4
Left Volume/
Right Volume
0x07/0x08
3
LVOL/
RVOL
2
1
0
22
Headphone Mute
0 = Disable.
1 = Enable, output is muted.
HEX VALUE
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
Left/Right Headphone Output Volume Level
GAIN (dB)
HEX VALUE
-60
0x20
-58
0x21
-56
0x22
-54
0x23
-53
0x24
-52
0x25
-51
0x26
-50
0x27
-49
0x28
-48
0x29
-47
0x2A
-46
0x2B
-45
0x2C
-44
0x2D
-43
0x2E
-42
0x2F
-41
0x30
-40
0x31
-39
0x32
-38
0x33
-37
0x34
-36
0x35
-35
0x36
-34
0x37
-33
0x38
-32
0x39
-31
0x3A
-30
0x3B
-29
0x3C
-28
0x3D
-27
0x3E
-26
0x3F
GAIN (dB)
-25
-24
-23
-22
-21
-20
-19
-18
-17
-16
-15
-14
-13
-12
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
Audio Amplifier with Jack Detection
Table 7. Microphone Bias and Gain Register
REGISTER
BIT
NAME
7
—
6
GAIN
Microphone Preamplifier Gain Select
0 = 12dB
1 = 24dB
MICR
Microphone Bias Resistor Select
000 = 2.2kI
001 = 2.6kI
010 = 3.0kI
011 = Bypassed
1XX = High impedance (sleep mode)
2
BIAS
Microphone Bias Voltage Select
0 = 2.0V
1 = 2.6V
1
—
—
0
—
—
5
Microphone
0x09
4
3
DESCRIPTION
—
Vendor ID Register
Vendor ID bits are shown in Table 8.
Table 8. Vendor ID Register
REGISTER
BIT
NAME
DESCRIPTION
7
6
Vendor ID
Register
0x0B
5
ID
Vendor ID
0x9 = Maxim’s vendor ID
4
3
—
2
—
1
—
0
—
—
23
MAX97236
Microphone Bias Control and Gain Register
The Microphone Bias Control and Gain register controls which microphone bias voltage and bias resistors are used as
well as the microphone amplifier gain.
MAX97236
Audio Amplifier with Jack Detection
Keyscan Clock Divider Registers
The Keyscan Clock Divider register sets the clock frequency that is used for the conversion clock for the keyscan 1kHz
generator.
Table 9. Keyscan Clock Divider Registers
REGISTER
BIT
NAME
7
6
Keyscan
Clock Divider
1/2
0x12/0x13
5
4
3
KEY_DIV_HIGH/
KEY_DIV_LOW
2
1
0
DESCRIPTION
Keyscan Clock Divider
The keyscan 1kHz clock is generated by dividing down the frequency of
EXTCLK. The divider is set with the 16 bits contained within registers 0x12
and 0x13, where 0x12 is the high byte and 0x13 is the low byte.
Since 1kHz (1ms) is desired, then:
N = fIN/2kHz
e.g., fIN = 20MHz, then N = 10,000
e.g., fIN = 1MHz, then N = 500
e.g., fIN = 19.2MHz, then N = 9600
For the low input frequencies, resolution is about 0.2%.
Keyscan Divider ADC Register
The Keyscan ADC Clock Divider register sets the clock frequency that is used for the conversion clock for the keyscan
6-bit ADC.
Table 10. Keyscan ADC Clock Divider Registers
REGISTER
BIT
NAME
7
6
Keyscan
Clock Divider
ADC
0x14
5
4
3
KEY_DIV_ADC
2
1
0
DESCRIPTION
Keyscan ADC Clock Divider
The keyscan ADC clock is generated by dividing down the frequency of
EXTCLK. The divider is set with the 8 bits contained within register 0x14.
Since 100kHz (10Fs) is desired, then:
N = fIN/200kHz
e.g., fIN = 20MHz, then N = 100
e.g., fIN = 1MHz, then N = 5
e.g., fIN = 19.2MHz, then N = 96
For the low input frequencies, resolution is about 20%.
Keyscan Debounce Register
The Keyscan Debounce register controls the debounce time when a keypress is detected. See Figure 6.
Table 11. Keyscan Clock Divider Registers
REGISTER
BIT
NAME
DESCRIPTION
7
6
Keyscan
Debounce
0x15
5
4
3
2
1
0
24
KEY_DEB
Keyscan Debounce Register
Debounce time set from 1ms to 256ms in 1ms increments. The programmed
code plus one represents the debounce time directly.
tDEB = KEY_DEB + 1
e.g., code 0x13 represents 20ms of debounce.
Audio Amplifier with Jack Detection
Table 12. Keyscan Delay Register
REGISTER
BIT
NAME
DESCRIPTION
KEY_DEL
Keyscan Delay Register
Delay time set from 4ms to 1024ms in 4ms increments. The programmed code
plus one multiplied by 4ms represents the delay time.
tDELAY = (KEY_DEL + 1) x 4ms
e.g., code 0x63 represents 400ms of delay.
7
6
Keyscan
Delay
0x16
5
4
3
2
1
0
Passive Multibutton Keyscan Data Register
The Keyscan Data register contains the data read from a keypress after the 6-bit ADC encodes the input voltage level.
The read keypress could come from a single switch or a passive multibutton device.
Table 13. Keyscan Data Register
REGISTER
Passive MBH
Keyscan Data
0x17
(Read Only)
BIT
NAME
DESCRIPTION
7
PRESS
Release
Tells if a KEY status was PRESS or RELEASE.
0 = Key release.
1 = Keypress.
6
RANGE
0 = Coarse range.
1 = Fine range.
5
4
3
2
1
KEYDATA
Keyscan Data
B6–B0 are read-only bits that contain the data read from a passive keypress
that shorts the microphone to ground. There is a coarse range (10mV/LSB)
and a fine range (2mV/LSB). See Figure 7 and the Passive Multibutton Headset
(MBH) section.
0
25
MAX97236
Keyscan Delay Register
The Keyscan Delay register sets the timeout that the microphone button press is masked from the system. At the end of
the delay time, the IC checks to see if a microphone is still present. If the microphone is present, the system is alerted
by setting the MCSW bit in the status register flagging an interrupt if IMCSW is set. If the microphone is not present
after the delay time, the system is flagged with an interrupt by setting MICROPHONE_IN signifying that the microphone
has been removed and no keypress was made.
MAX97236
Audio Amplifier with Jack Detection
Ramp Test Slew Control
The ramp test slew control programs the period of the jack configuration algorithm’s ramp test. Slow slew rates ensure
test inaudibility, but increase test time to complete the configuration algorithm.
Table 14. Ramp Test Slew Control
REGISTER
BIT
NAME
DESCRIPTION
7
6
DC Test Slew
Control
0x18
5
4
3
DC_SLEW
2
DC Slew Control
Program the DC test slew rate from 5.12ms to 1305.6ms in 5.12ms steps.
Recommend value to be used is 0x04 to 0x08.
1
0
Load State Forcing
Use the Load State Forcing register to force a state and ignore the results of the jack detection algorithm. It forces the
required blocks to be on (bypassing the Enable registers).
Table 15. Load State Forcing
REGISTER
State Forcing
0x19
26
BIT
NAME
7
—
—
DESCRIPTION
6
—
—
5
FORCE
Load State Force Enable
0 = Forces the IC into a configuration defined by 0b4–0b0.
1 = State forcing disabled.
Audio Amplifier with Jack Detection
REGISTER
BIT
NAME
DESCRIPTION
State Value
Bits 0b4–0b0 programs the configuration of the IC. The columns show all the
possible configurations.
4
CODE
[B4:B0]
3
State Forcing
0x19
STATE
2
1
0
STATE
(F = Float, L = Left Audio, R = Right
Audio, G = Ground,
M = Microphone)
0x01
FFFF
0x02
LRGM
0x03
LRMG
0x07
LRGG_AC
0x08
LRGF
0x09
LFGF
0x0A
FRGF
0x0C
LGGM
0x0D
LGMG
0x0E
LLGM
0x0F
LLMG
0x10
LFGM
0x11
LFMG
0x12
LRGG_DC
0x13
LFGG
0x14
FRGG
27
MAX97236
Table 15. Load State Forcing (continued)
MAX97236
Audio Amplifier with Jack Detection
Pulse Test Hardware Settings
The Jack Detect Test Hardware Settings register programs the amplitude and width of the pulse used in the jack detection tests and jack insertion algorithm.
Table 16. Jack Detect Test Hardware Settings
REGISTER
AC Test
Control
0x1A
BIT
NAME
7
6
—
—
DESCRIPTION
5
AC_REPEAT1
4
AC_REPEAT0
3
PULSE_WIDTH1
2
PULSE_WIDTH0
1
PULSE_AMP1
0
PULSE_AMP0
—
—
AC_Repeat
00 = 1, 01 = 3, 10 = 5, 11 = 7.
Programs number of pulses sent for each jack detection test.
Pulse Width
00 = 50Fs, 01 = 100Fs, 10 = 150Fs, 11 = 300Fs. Test 1 and 4 pulse width
is fixed at 10Fs.
Pulse Amplitude
For tests 1 and 4, pulse amplitude is 00 = 25mV, 01 = 50mV, 10 = 100mV,
11 = 200mV. Tests 6, 7, and 8 pulse amplitude is 00 = 37mV, 01 = 75mV,
10 = 150mV, 11 = 220mV.
Enable Registers
The Enable_ registers contain all of the bits that control the separate functional blocks for the IC. The system can either
directly control these bits, or it can allow the IC to automatically configure itself and report in the Enable_ register which
blocks are enabled. When the AUTO bits (B1, B0) are set to 01 or 10, the Enable_ registers are read-only (except the
SHDN and SLEEP bits). The block enable bits need to be set to sense a jack removal. The jack removal circuitry is
active after the jack configurations detect algorithm has completed.
Table 17. Enable Registers
REGISTER
BIT
NAME
DESCRIPTION
7
SHDN
Full Device Shutdown Control
SHDN turns the IC on and off. When SHDN is low, the device is in shutdown
mode and the jack insertion detect circuitry is active. Pull SHDN high to turn
on the device and run the jack configuration detect algorithm. Typically, SHDN
is held low until the system gets an interrupt from the IC, indicating that a jack
has been inserted. The system then pulls SHDN high.
0 = The IC is in shutdown mode with jack detection circuitry active.
1 = The IC is active. The jack configuration algorithm runs immediately after a
load has been detected.
6
RESET
RESET Jack Detection
Cycle RESET (low g high g low) to repeat the jack detection and configuration
algorithm.
Enable1
0x1D
28
Audio Amplifier with Jack Detection
REGISTER
BIT
NAME
5
—
Enable1
0x1D
DESCRIPTION
—
MIC_BIAS
Microphone Bias Enable/Status
Set MIC_BIAS to enable the microphone block. This bit is read-only when
AUTO (0b0 or 0b1) is set.
0 = Microphone bias is disabled.
1 = Microphone bias is enabled.
MIC_AMP
Microphone Amplifier Enable/Status
Set MIC_AMP to enable the microphone amplifier. This bit is read-only when
AUTO (0b0 or 0b1) is set.
0 = Microphone amplifiers are disabled.
1 = Microphone amplifiers are enabled.
2
KS
Keyscan Enable/Status
KS enables the circuitry that decodes passive multibutton keypad or simple
microphone switch. This bit is read only when AUTO (0b0 or 0b1) is set.
0 = Keyscan ADC is disabled.
1 = Keyscan ADC is enabled.
1
—
—
0
—
4
3
7
6
—
LFTEN
Left Headphone Enable/Status
Set LFTEN to enable the left channel of the DirectDrive headphone amplifier.
This bit is read-only when AUTO (0b0 or 0b1) is set.
0 = Headphone amplifier left channel is disabled.
1 = Headphone amplifier left channel is enabled.
RGHEN
Right Headphone Enable/Status
Set RGHEN to enable the left channel of the DirectDrive headphone amplifier.
This bit is read-only when AUTO (B0) is set.
0 = Headphone amplifier right channel is disabled.
1 = Headphone amplifier right channel is enabled.
Enable2
0x1E
MAX97236
Table 17. Enable Registers (continued)
29
MAX97236
Audio Amplifier with Jack Detection
Table 17. Enable Registers (continued)
REGISTER
BIT
5
4
3
NAME
DESCRIPTION
VSEN
Volume Adjustment Slewing
Volume changes are smoothed by stepping through intermediate steps. VSEN
also ensures that the volume automatically ramps from the minimum setting to
the programmed value at turn-on and back to the minimum value at turn-off.
0 = Enabled.
1 = Disabled.
ZDEN
Zero-Crossing Detection
ZDEN holds volume changes until there is a zero-crossing in the audio signal.
This reduces clicks during volume changes (zipper noise). If no zero-crossing
is detected within 100ms, the volume change is forced.
0 = Enabled.
1 = Disabled.
FAST
Jack Insertion Polling Speed
A fast polling speed tests for a jack insertion 3 times per second, while a
slow polling speed tests for jack insertion every 2 seconds. Setting the polling
speed to slow mode saves shutdown power consumption while the mechanical
JACKSW switch is operational.
0 = Slow polling mode, 2s delay between polls.
1 = Fast polling mode, 333ms delay between polls.
THRH
Class H Threshold Select
THRH selects the threshold at which the power supplies switch from Q0.9V
to Q1.8V. A higher threshold allows the IC’s output stage to be powered from
Q0.9V for a higher percentage of the audio waveform, decreasing power dissipation at the expense of dynamic distortion.
0 = Low threshold.
1 = High threshold.
AUTO
Automatic Mode Select
Set AUTO to allow the IC to enable functional blocks depending on the load.
In auto mode, the user merely reads the status of registers 0x1D and 0x1E to
find out what blocks are enabled. Setting AUTO makes bits register 0x1D and
0x01E read-only (except SHDN and SLEEP). Clear AUTO to give the system
control of what functional blocks are active. The user needs to allow the jack
configuration detect algorithm to complete before enabling functional blocks.
00 = User controls which functional blocks are on. Registers 0x1D and 0x1E
are R/W.
01 = The IC enables functional blocks automatically depending on the results
of the jack configuration detect algorithm after SHDN is set.
10 = The IC enables functional blocks automatically depending on the results
of the jack configuration detect algorithm regardless of whether SHDN is set.
SHDN must go to high to enable audio playback.
Enable2
0x1E
2
1
0
30
Audio Amplifier with Jack Detection
MAX97236
SDA
tBUF
tSU,STA
tSU,DAT
tHD,STA
tHD,DAT
tLOW
tSP
tSU,STO
SCL
tHIGH
tHD,STA
tR
tF
REPEATED
START CONDITION
START
CONDITION
STOP
CONDITION
START
CONDITION
Figure 10. I2C Interface Timing Diagram
I2C Serial Interface
The IC features an I2C/SMBusK-compatible, 2-wire
serial interface consisting of a serial-data line (SDA) and
a serial-clock line (SCL). SDA and SCL facilitate communication between the IC and the master at clock rates up
to 400kHz. Figure 10 shows the 2-wire interface timing
diagram. The master generates SCL and initiates data
transfer on the bus. The master device writes data to the
IC by transmitting the proper slave address followed by
the register address and then the data word. Each transmit sequence is framed by a START (S) or REPEATED
START (Sr) condition and a STOP (P) condition. Each
word transmitted to the IC is 8 bits long and is followed
by an acknowledge clock pulse. A master reading data
from the IC transmits the proper slave address followed
by a series of nine SCL pulses. The IC transmits data on
SDA in sync with the master-generated SCL pulses. The
master acknowledges receipt of each byte of data. Each
read sequence is framed by a START or REPEATED
START condition, a not acknowledge, and a STOP condition. SDA operates as both an input and an open-drain
output. A pullup resistor, typically greater than 500I,
is required on SDA. SCL operates only as an input. A
pullup resistor, typically greater than 500I, is required
on SCL if there are multiple masters on the bus, or if
the single master has an open-drain SCL output. Series
resistors in line with SDA and SCL are optional. Series
resistors protect the digital inputs of the IC from high
voltage spikes on the bus lines, and minimize crosstalk
and undershoot of the bus signals.
Bit Transfer
One data bit is transferred during each SCL cycle. The data
on SDA must remain stable during the high period of the
SCL pulse. Changes in SDA while SCL is high are control
signals. See the START and STOP Conditions section.
START and STOP Conditions
SDA and SCL idle high when the bus is not in use. A
master initiates communication by issuing a START condition. A START condition is a high-to-low transition on
SDA with SCL high. A STOP condition is a low-to-high
transition on SDA while SCL is high (Figure 11). A START
condition from the master signals the beginning of a
transmission to the IC. The master terminates transmission and frees the bus by issuing a STOP condition. The
bus remains active if a REPEATED START condition is
generated instead of a STOP condition.
Early STOP Conditions
The IC recognizes a STOP condition at any point during
data transmission except if the STOP condition occurs in
the same high pulse as a START condition. For proper
operation, do not send a STOP condition during the
same SCL high pulse as the START condition.
S
Sr
P
SCL
SDA
Figure 11. START, STOP, and REPEATED START Conditions
SMBus is a trademark of Intel Corp.
31
MAX97236
Audio Amplifier with Jack Detection
Slave Address
The slave address is defined as the 7 most significant
bits (MSBs) followed by the read/write bit. The IC has an
address of 0x80. The 7 most significant bits are 100000.
Setting the read/write bit to 1 (slave address = 0x81)
configures the IC for read mode. Setting the read/write
bit to 0 (slave address = 0x80) configures the IC for write
mode. The address is the first byte of information sent to
the IC after the START condition.
Acknowledge
The acknowledge bit (ACK) is a clocked ninth bit that the
IC uses to handshake receipt each byte of data when
in write mode (Figure 12). The IC pulls down SDA during the entire master-generated ninth clock pulse if the
previous byte is successfully received. Monitoring ACK
CLOCK PULSE FOR
ACKNOWLEDGMENT
START
CONDITION
SCL
2
1
8
allows for detection of unsuccessful data transfers. An
unsuccessful data transfer occurs if a receiving device is
busy or if a system fault has occurred. In the event of an
unsuccessful data transfer, the bus master retries communication. The master pulls down SDA during the 9th
clock cycle to acknowledge receipt of data when the IC
is in read mode. An acknowledge is sent by the master
after each read byte to allow data transfer to continue. A
not-acknowledge is sent when the master reads the final
byte of data from the IC, followed by a STOP condition.
Write Data Format
A write to the IC includes transmission of a START condition, the slave address with the R/W bit set to 0, one byte of
data to configure the internal register address pointer, one
or more bytes of data, and a STOP condition. Figure 13
illustrates the proper frame format for writing one byte of
data to the IC. Figure 14 illustrates the frame format for
writing n bytes of data to the IC.
The slave address with the R/W bit set to 0 indicates
that the master intends to write data to the IC. The IC
acknowledges receipt of the address byte during the
master-generated 9th SCL pulse.
9
NOT ACKNOWLEDGE
The second byte transmitted from the master configures
the IC’s internal register address pointer. The pointer
tells the IC where to write the next byte of data. An
acknowledge pulse is sent by the IC upon receipt of the
address pointer data.
SDA
ACKNOWLEDGE
Figure 12. Acknowledge
ACKNOWLEDGE FROM MAX97236
B7
ACKNOWLEDGE FROM MAX97236
SLAVE ADDRESS
S
B6
B5
B4
B3
B2
B1
B0
ACKNOWLEDGE FROM MAX97236
0
REGISTER ADDRESS
A
DATA BYTE
A
R/W
A
P
1 BYTE
AUTOINCREMENT INTERNAL REGISTER ADDRESS POINTER
Figure 13. Writing One Byte of Data to the IC
ACKNOWLEDGE FROM
MAX97236
ACKNOWLEDGE FROM
MAX97236
S
SLAVE ADDRESS
B7 B6 B5 B4 B3 B2 B1 B0
ACKNOWLEDGE FROM
MAX97236
0
A
R/W
REGISTER ADDRESS
ACKNOWLEDGE FROM
MAX97236
A
DATA BYTE 1
B7 B6 B5 B4 B3 B2 B1 B0
A
1 BYTE
AUTOINCREMENT INTERNAL REGISTER ADDRESS POINTER
Figure 14. Writing n Bytes of Data to the IC
32
DATA BYTE n
1 BYTE
A
P
Audio Amplifier with Jack Detection
frame. A STOP condition can be issued after any number
of read data bytes. If a STOP condition is issued followed
by another read operation, the first data byte to be read
is from register 0x00.
The address pointer can be preset to a specific register
before a read command is issued. The master presets the
address pointer by first sending the IC’s slave address
with the R/W bit set to 0 followed by the register address.
A REPEATED START condition is then sent followed by
the slave address with the R/W bit set to 1. The IC then
transmits the contents of the specified register. The
address pointer autoincrements after transmitting the
first byte.
Read Data Format
Send the slave address with the R/W bit set to 1 to initiate a read operation. The IC acknowledges receipt of
its slave address by pulling SDA low during the 9th SCL
clock pulse. A START command followed by a read command resets the address pointer to register 0x00.
The master acknowledges receipt of each read byte
during the acknowledge clock pulse. The master must
acknowledge all correctly received bytes except the last
byte. The final byte must be followed by a not acknowledge
from the master and then a STOP condition. Figure 15 illustrates the frame format for reading one byte from the IC.
Figure 16 illustrates the frame format for reading multiple
bytes from the IC.
The first byte transmitted from the IC is the content of
register 0x00. Transmitted data is valid on the rising
edge of SCL. The address pointer autoincrements after
each read data byte. This autoincrement feature allows
all registers to be read sequentially within one continuous
ACKNOWLEDGE FROM
MAX97236
ACKNOWLEDGE FROM
MAX97236
S
SLAVE ADDRESS
0
A
A
REGISTER ADDRESS
R/W
NOT ACKNOWLEDGE FROM MASTER
ACKNOWLEDGE FROM
MAX97236
Sr
SLAVE ADDRESS
REPEATED START
1
R/W
A
DATA BYTE
A
P
1 BYTE
AUTOINCREMENT INTERNAL
REGISTER ADDRESS POINTER
Figure 15. Reading One Byte of Data from the IC
S
SLAVE ADDRESS
0
ACKNOWLEDGE FROM
MAX97236
ACKNOWLEDGE FROM
MAX97236
ACKNOWLEDGE FROM
MAX97236
A
REGISTER ADDRESS
R/W
A
REPEATED START
Sr
SLAVE ADDRESS
1
R/W
A
DATA BYTE
A
P
1 BYTE
AUTOINCREMENT INTERNAL
REGISTER ADDRESS POINTER
Figure 16. Reading n Bytes of Data from the IC
33
MAX97236
The third byte sent to the IC contains the data that is
written to the chosen register. An acknowledge pulse
from the IC signals receipt of the data byte. The address
pointer autoincrements to the next register address after
each received data byte. This autoincrement feature
allows a master to write to sequential registers within
one continuous frame. The master signals the end of
transmission by issuing a STOP condition. Register
addresses greater than 0x0C are reserved. Do not write
to these addresses.
MAX97236
Audio Amplifier with Jack Detection
Applications Information
Power Modes
The power modes of the IC are controlled by the SHDN
bit. The three power modes include detection, normal
operating, and standby.
Detection mode occurs when no jack has been plugged
in, SHDN = RESET = 0. Once a jack is plugged in and
detected, the IC enters normal operating mode after
SHDN transitions from 0 to 1. While in normal operating
mode, pull SHDN low to put the device in standby mode.
Pull RESET high then low to reset the jack detection and
configuration.
Standby mode leaves the key encoder active to pick up
a keypress event if the IC has completed jack detection prior to standby mode. A weak pullup voltage is put
across the microphone to look for a hook switch press.
Once a keypress event occurs, an interrupt flags, and
the IC enters detection mode after SHDN transitions high.
MVDD power domain:
Power Domains
Microphone bias, switches, ESD, and jack detection
tests 2 to 9.
VDD power domain:
Charge pump, digital block, ADC, mic amp, and jack
detection test 1.
Power-Up/-Down Sequence
The IC needs VDD and MVDD to operate correctly.
until SHDN is pulled high. After the configuration is
detected, the IC waits for the system to turn on the
appropriate enable bits.
• AUTO = 0x01: The IC detects a jack plug-in and set
JKIN, but does not run the configuration detect until
SHDN is pulled high. After the configuration detect is
run, the IC automatically sets the appropriate enable
bits to be able to drive all loads for the found cable.
• AUTO = 0x02: The IC detects a jack plug-in, sets
JKIN, and automatically runs the configuration detect.
After the configuration detect is run, the IC automatically sets the appropriate enable bits to be able to
drive all loads for the found cable. However, the
amplifiers do not actually turn on until SHDN is pulled
high. The IC completes detection and waits in standby mode until SHDN is pulled high.
Ensure that RESET = 0 to enable the jack detect plug-in
test signal.
Power-Up, AUTO = 0x00 or 0x01:
1) Set IDDONE and IJACKSW and IJKIN so that an
interrupt flags when something is plugged in and the
detection is done.
2) Wait for IRQ.
3) Wait for JACKSW to set.
4) Pull SHDN high.
5) Detection is done when DDONE sets.
If AUTO = 0x00:
Turning off one supply voltage during a mode might prevent proper operation of the IC.
1) Read the Status registers to find out what was detected.
The power-up sequence is:
3) System sets the appropriate enable bits.
• Apply VDD
4) Set the volume register to the appropriate setting if
audio is present.
• Apply MVDD
• Set AUTO to 01 (register 0x1E, bit 0)
There are a few different ways to power-up/-down
depending on how autonomous you want the IC to operate and whether the jack is plugged in or not. The AUTO
bits are in register 0x1E, bits 0 and 1. The three methods
for getting the IC running are:
• AUTO = 0x00: The IC detects a jack plug-in and
set JKIN, but does not run the configuration detect
34
2) System makes a decision about what to enable.
If AUTO = 0x01:
1) Read the Status registers to find out what was detected.
2) The appropriate enable bits automatically set.
3) Read the Enable1 and Enable2 registers to see what
was turned on.
4) Set the volume register to the appropriate setting if
audio is present.
Audio Amplifier with Jack Detection
1) Wait for JKIN to set.
2) Detection runs automatically, so wait for DDONE to set.
3) Read the Status registers to find out what was detected.
4) The IC is automatically placed in standby mode after
detection is done.
5) Pull SHDN high to turn on the IC.
6) The appropriate enable bits were automatically set
because AUTO = 0x02.
7) Read the Enable1 and Enable2 registers to see what
was turned on.
When AUTO = 0x01 or 0x02, the IC automatically
enables the required blocks according to what has been
detected. In case AUTO = 0x00, it is required that all
the correct blocks are enabled for unplug detection to
work properly. Table 18 correlates the status bits with the
enable bits for the blocks that are (need to be) enabled
for proper operation.
Power-Down, All AUTO Settings:
If audio is playing and VSEN = 0:
1) Set the headphone volume register mute bits or set
code 0x00 as the volume.
2) Set the headphone volume register mute bits or set
code 0x00 as the volume, and the amplifiers mute
immediately.
3) Pull SHDN to 0 to go to standby mode; the current
jack case is remembered. Cycle RESET (low ➝ high
➝ low) to run jack detection and configuration again.
PCB Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance, as well as route heat away
from the device. Good grounding improves audio performance, minimizes crosstalk between channels, and
prevents switching noise from coupling into the audio
signal. Connect PGND and GND together at a single
point on the PCB. Route PGND and all traces that carry
switching transients away from GND, and the traces and
components in the audio signal path.
Place the charge-pump capacitors as close as possible
to the device. Bypass PVDD and PVSS with a 1FF capacitor to PGND. Place the bypass capacitors as close as
possible to the device.
2) The VOL bit is set when the volume slew is done.
Make sure IVOL is set so that an interrupt is flagged.
Route the pins that connect to the jack on wide, lowimpedance traces whenever possible. RING2 or SLEEVE
ends up being the load’s ground connection; ground
impedance causes excess crosstalk and noise pickup.
3) Pull SHDN low to go into standby mode; the current
jack case is remembered. Cycle RESET (low ➝ high
➝ low) to run jack detection and configuration again.
Route the EXTCLK traces away from low-level audio
input nodes and the microphone bias bypass connection
to keep the audio as noise free as possible.
If audio is not playing:
PGND and GND pins need to have as low an impedance
connection to the ground plane. This means liberal use
of vias and a solid ground plane.
1) Set VSEN = 1 to disable volume slewing. If this is not
done, the volume slew down at a rate of 1ms per volume step.
Table 18. Status Bits Relation to Enable Bits
STATUS BIT
ENABLE BIT
MIC_IN
MIC_BIAS
MIC_AMP
KS
LINE_L
LFTEN
LINE_R
RGHEN
HP_L
LFTEN
HP_R
RGHEN
The maximum resistance between the pins TIP and RING1
to the headphone jack should not exceed 3I.
The maximum resistance between RING2 and SLEEVE to
the headphone jack should be 0.5I or better. RING2 or
SLEEVE is used as the common connector in a headset
or headphone. Any impedance on this path decreases
crosstalk performance.
Power-Supply Bypassing
A bulk 10FF capacitor is required for proper chargepump operation. The capacitors are readily available in
0603 packages in the necessary voltage rating. Bypass
VDD to PGND with 10FF.
35
MAX97236
Power-Up, AUTO = 0x02:
MAX97236
Audio Amplifier with Jack Detection
Component Selection and Layout
Capacitance values of 1FF are recommended. Larger
value capacitors can be used to lower power-supply
ripple. Do not use charge-pump caps greater than
3.3FF. See Table 19 for a detailed description for each
component value.
Charge-Pump Capacitors
The charge pump requires three capacitors: PVDD,
PVSS, and the flying capacitor between C1N and C1P.
It is recommended that these all remain the same value.
Table 19. Recommended Component Values
COMPONENT
RECOMMENDED VALUE
DETAILS
Charge-pump capacitors
1FF, X5R,
6.3V or greater voltage rating
or better
The capacitor needs low ESR to achieve the required chargepump output impedance. If the charge-pump output impedance is too high, the headphone amplifier cannot deliver the
stated output power.
A larger capacitor does not completely charge in one switching cycle. A smaller capacitor does not hold enough charge.
Thus, it is highly recommended to use the suggested value.
VDD capacitor
C1: 1FF to 10FF, X5R, 6.3V
or better
C2: 0.01nF to 0.1FF, X5R,
6.3V minimum
C1: A smaller values helps on the ESD robustness.
C2: Is not a must-have capacitor, but still recommended. This
capacitor helps improve the RF immunity of the IC.
Audio input capacitors
1FF, 6.3V, X5R or better
Lower capacitance creates a highpass filter due to the input
impedance of the IC.
Microphone input capacitors
1FF, 6.3V, X5R or better
—
EMI filter capacitors
33pF
—
EMI filter ferrite bead
Murata BLM15BB220
—
Chip Information
PROCESS: BiCMOS
36
Audio Amplifier with Jack Detection
2.4V TO 3.6V
1.8V
VDD
MVDD
PVDD
INL
TIP
PVDD
VDD
C1P
C1N
PVSS
CHARGE
PUMP
RING1
GND SENSE
PVDD
RING2
PVSS
SLEEVE
INR
JACKSW
PVSS
MVDD
MAX97236
MOUTP
TO JACK
MECH SW
MOUTN
JACK
DETECTION
AND
CONFIGURATION
2.2kI/2.6kI/3kI
SDA
SCL
IRQ
I2C
MIC BIAS
SELECT
INTERFACE
AND
CONTROL
HP VOL
CONTROL
MIC
SENSE
MIC
BIAS
MBIAS
ADC
I.C.
EXTCLK
GND
PGND
37
MAX97236
Functional Diagram/Typical Application Circuit
MAX97236
Audio Amplifier with Jack Detection
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the
package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the
package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
25-Bump WLP
W252G2+1
21-0453
Refer to Application Note 1891
PIN 1
INDICATOR
E
MARKING
COMMON DIMENSIONS
1
A
A3
A
0.64
0.05
A1
0.19
0.03
0.45 REF
A2
AAAA
D
A1
A2
0.05 S
S
TOP VIEW
0.025 BASIC
A3
A
See Note 7
SIDE VIEW
E1
SE
b
0.27
D1
1.60
E1
1.60
e
0.40 BASIC
SD
0.00 BASIC
SE
0.00 BASIC
0.03
e
B
E
E
SD
D
C
D1
B
A
1
2
3
4
5
A
b
0.05 M
S
D
DEPOPULATED
BUMPS
PKG. CODE
MIN
MAX
MIN
MAX
W252D2+1
2.25
2.36
2.25
2.36
NONE
W252F2+1
2.02
2.16
2.02
2.16
NONE
W252G2+1
2.32
2.44
2.22
2.34
NONE
W252H2+1
2.41
2.44
2.41
2.44
NONE
AB
BOTTOM VIEW
NOTES:
1. Terminal pitch is defined by terminal center to center value.
2. Outer dimension is defined by center lines between scribe lines.
3. All dimensions in millimeter.
4. Marking shown is for package orientation reference only.
5. Tolerance is ± 0.02 unless specified otherwise.
6. All dimensions apply to PbFree (+) package codes only.
7. Front - side finish can be either Black or Clear.
- DRAWING NOT TO SCALE -
38
TITLE
APPROVAL
PACKAGE OUTLINE
25 BUMPS, WLP PKG. 0.4mm PITCH
DOCUMENT CONTROL NO.
21-0453
REV.
D
1
1
Audio Amplifier with Jack Detection
REVISION
NUMBER
REVISION
DATE
0
3/11
DESCRIPTION
Initial release
PAGES
CHANGED
—
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2011
Maxim Integrated Products 39
Maxim is a registered trademark of Maxim Integrated Products, Inc.
MAX97236
Revision History