RFPA3809 RFPA3809 GaAs HBT 400MHz to 2700MHz Power Amplifier GaAs HBT 400MHz TO 2700MHz POWER AMPLIFIER Package: SOIC-8 Features High Linearity: OIP3=49dBm (880MHz) Low Noise: NF=3.1dB (2140MHz) P1dB>29dBm 400MHz to 2700MHz Operation Thermally Enhanced Slug Package Applications GaAs Pre-Driver for Base Station Amplifiers PA Stage for Commercial Wireless Infrastructure Functional Block Diagram Product Description Class AB Operation for DCS, PCS, UMTS, LTE, and WLAN Transceiver Applications 2nd/3rd Stage LNA for Wireless Infrastructure The RFPA3809 is a GaAs HBT linear power amplifier specifically designed for Wireless Infrastructure applications. Using a highly reliable GaAs HBT fabrication process, this high performance single-stage amplifier achieves ultra-high linearity over a broad frequency range. It also offers low noise figure making it an excellent solution for 2nd and 3rd stage LNAs. The RFPA3809 also exhibits excellent thermal performance through the use of a thermally-enhanced plastic surface-mount slug package. Ordering Information RFPA3809SQ RFPA3809SR RFPA3809TR13 RFPA3809PCK-410 RFPA3809PCK-411 GaAs HBT GaAs MESFET InGaP HBT Sample Bag with 25 pieces 7" Reel with 100 pieces 13" Reel with 2500 pieces 869MHz to 894MHz PCBA with 5-piece Sample Bag 2110MHz to 2170MHz PCBA with 5-piece Sample Bag Optimum Technology Matching® Applied SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT BiFET HBT LDMOS RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. DS130130 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 1 of 11 RFPA3809 Absolute Maximum Ratings Parameter Supply Voltage (VCC and VBIAS) Reference Current (IREF) Rating Unit 6.5 V 5 mA DC Supply Current (IC) 768 mA CW Input Power, 2:1 Output VSWR 26 dBm Output Load VSWR at P3dB 5:1 Operating Junction Temperature 160 °C Operating Temperature Range (TL) -40 to +85 °C Storage Temperature -55 to +150 °C ESD Rating: Human Body Model Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Class 1B Moisture Sensitvity Level MSL 2 Notes: 1. The maximum ratings must all be met simultaneously. 2. Pdiss = PDC+PRFIN-PRFOUT 3. TJ=TL+Pdiss*Rth Parameter Min. Specification Typ. Max. 869 880 894 MHz 18 dBm Unit 869MHz to 894MHz Condition VCC =5.0V, VBIAS =5.0V, ICQ =275mA Frequency Input Power (PIN) Gain (S21) 17 dB OIP3 49 dBm P1dB 29 dBm Efficiency at P3dB 58 % Input Return Loss (S11) 16 dB Output Return Loss (S22) 18 dB Noise Figure 3.9 dB WCDMA Ch Power at -65dBc ACPR 17 dBm WCDMA Ch Power at -55dBc ACPR 19.3 dBm UMTS2100 Max recommended, VCC <6.0V 15dBm/tone, tone spacing=1MHz At P3dB, EVB tuned for linear operation 3GPP 3.5, Test Model 1, 64 DPCH 3GPP 3.5, Test Model 1, 64 DPCH VCC =5.0V, VBIAS =5.0V, ICQ =275mA Frequency 2110 2140 Input Power (PIN) Gain (S21) 2170 MHz 20 dBm 12.4 dB OIP3 47 dBm P1dB 29 dBm Efficiency at P3dB 50 % Input Return Loss (S11) 17 dB Max recommended, VCC <6.0V 15dBm/tone, tone spacing=1MHz At P3dB, EVB tuned for linear operation Output Return Loss (S22) 15 dB Noise Figure 3.1 dB WCDMA Ch Power at -65dBc ACPR 16.5 dBm 3GPP 3.5, Test Model 1, 64 DPCH WCDMA Ch Power at -55dBc ACPR 19 dBm 3GPP 3.5, Test Model 1, 64 DPCH At VCC =5.0V Power Supply 275 380 mA Operating Voltage (VCC) Operating Current (Quiescent) 5.0 6.0 V Thermal Resistance (RTH) 38 Power Down Current 2 of 11 230 20 Max recommended collector voltage C/W At quiescent current, no RF uA At VREF =0V 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS130130 RFPA3809 Typical Performance (869MHz to 894MHz Application Circuit) DS130130 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 3 of 11 RFPA3809 Typical Performance (869MHz to 894MHz Application Circuit) 4 of 11 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS130130 RFPA3809 Evaluation Board Schematic (869MHz to 894MHz Application Circuit) EVB BOM (869MHz to 894MHz Application Circuit) Description Reference Designator Manufacturer Manufacturer's P/N C1 AVX Corporation TAJA106K010R PCB, PA380X410 PA380X410(A) CAP, 10F, 10%, 10V, TANT-A CAP, 100pF, 5%, 50V, C0G, 0402 C2 Taiyo Yuden (USA), Inc. RM UMK105CG101JV-F CAP, 18pF, 5%, 50V, COG, 0402 C3 Taiyo Yuden (USA), Inc. RM UMK105 CG180JV-F CAP, 7.5pF, ±0.5pF, 50V, C0G, 0402 C23 Taiyo Yuden (USA), Inc. RM UMK105CG7R5DW CAP, 1.8pF, ±0.25pF, 50V, C0G, 0402 R5 Taiyo Yuden (USA), Inc. RM UMK105CG1R8CW CAP, 27pF, 5%, 50V, COG, 0402 C7 Taiyo Yuden (USA), Inc. RM UMK105CG270JV-F CAP, 8.2pF, ±0.5pF, 50V, C0G, 0402 C25 Taiyo Yuden (USA), Inc. RM UMK105 CG8R2DV-F CAP, 5.6pF, ±0.25pF, 50V, HI-Q, 0402 C12 Johanson Technology 500R07S5R6CV4TD CAP, 100pF, 5%, 50V, C0G, 0402 C13 Murata Electronics GRM1555C1H101JZ01D IND, 47nH, 5% W/W, 0603 L1 Coilcraft 0603HC-47NXJLW IND, 1.8nH, ±0.3nH, M/L, 0402 C9, C22 Toko America, Inc. LL1005-FH1N8S IND 2.7nH, ±0.3nH, M/L, 0402 L2 Toko America, Inc. LL1005-FH2N7S CONN. SMA, END, LAUNCH, RND, PIN, 0.062” J1, J2 GIGALANE CO., LTD. PAF-S05-008 CONN, HDR, ST, 2-PIN, 0.100” PBC02SAAN P1, P2 Sullins Electronics RFPA3809SB U1 RFMD RFPA3809 FER, BEAD, 260, 5%, 1/16W, 0402 R1 Murata Electronics BLM18EG221SN1D RES, 620, 5%, 1/16W, 0402 R3 PANASONIC INDUSTRIAL ERJ-2GEJ621X RES, 0, 0603 R4 Kamaya, Inc. RMC1/16JPTP RES, 1K, 5%, 1/16W, 0402 C19 Kamaya, Inc. RMC1/16S-102JTH S1, S2, S3, S4, S5 McMaster-Carr Supply Co. 92196A076 RFMD EEF-102059(B) SCREW, 2-56X3/16”, SOCKET HEAD Heatsink Block 1.16 sq. in. DNP DS130130 C4-C6, C8, C10, C11, C14-C18, C20, C21, C24, C26-C29, R2 R6-R8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 5 of 11 RFPA3809 Evaluation Board Assembly Drawing (869MHz to 894MHz Application Circuit) 6 of 11 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS130130 RFPA3809 Typical Performance (2110MHz to 2170MHz Application Circuit) DS130130 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 7 of 11 RFPA3809 Typical Performance (2110MHz to 2170MHz Application Circuit) 8 of 11 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS130130 RFPA3809 Evaluation Board Schematic (2110MHz to 2170MHz Application Circuit) EVB BOM (2110MHz to 2170MHz Application Circuit) Description Reference Designator Manufacturer Manufacturer's P/N C1 AVX Corporation TAJA106K010R PCB, PA380X410 PA380X410(A) CAP, 10F, 10%, 10V, TANT-A CAP, 1000pF, 10%, 50V, X7R, 0402 C2 Taiyo Yuden (USA), Inc. RM UMK105BJ102KV-F CAP, 10pF, 5%, 50V, C0G, 0402 C3, C4,C13 Murata Electronics GRM1555C1H100JZ01E CAP, 100pF, 5%, 50V, C0G, 0402 C6 Taiyo Yuden (USA), Inc. RM UMK105CG101JV-F CAP, 4.7pF, ±0.1pF, 50V, COG, 0402 C7 Taiyo Yuden (USA), Inc. RM UMK105CG4R7BW-F CAP, 3pF, ±0.1pF, 50V, COG, 0402 C8 Taiyo Yuden (USA), Inc. RM UMK105CG030BW-F CAP, 3.3pF, ±0.1pF, 50V, COG, 0402 C9 Taiyo Yuden (USA), Inc. RM UMK105CG3R3BW-F CAP, 1.5pF, ±0.1pF, 50V, COG, 0402 C11 Taiyo Yuden (USA), Inc. RM UMK105CG1R5BW-F CAP, 0.1uF, 10%, 16V, X7R, 0402 C5 Murata Electronics GRM155R71C104KA88D CAP, 0.5pF, ±0.1pF, 50V, COG, 0402 C24 Taiyo Yuden (USA), Inc. RM UMK105CG0R5BW-F IND, 24nH, 5%, W/W, 0603 L1 Coilcraft 0603HC-24NXJLW RES, 0, 0402 L2 Kamaya, Inc RMC1/16SJPTH CONN, SMA, END, LAUNCH, RND, PIN, 0.062" J1, J2 GIGALANE CO., LTD. PAF-S05-008 CONN, HDR, ST, 2-PIN, 0.100 P1, P2 Sullins Electronics PBC02SAAN RFPA3809SB U1 RFMD RFPA3809 FER, BEAD, 260, 2A, 0603 R1 Murata Electronics BLM18EG221SN1D RES, 620, 5%, 1/16W, 0402 R2 PANASONIC INDUSTRIAL CO ERJ-2GEJ621X RES, 0, 0603 R4 Kamaya, Inc RMC1/16JPTP RES, 2K, 5%, 1/16W, 0402 R5 Kamaya, Inc RMC1/16S-202JTH SCREW 2-56X3/16”, SOCKET HEAD Heatsink Block 1.16 sq. in. DNP DS130130 McMaster-Carr Supply Co. 92196A076 RFMD EEF-102059(B) C10, C12, C14-C23, C25-C29, R3, R6-R8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 9 of 11 RFPA3809 Evaluation Board Assembly Drawing (2110MHz to 2170MHz Application Circuit) 10 of 11 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS130130 RFPA3809 Pin 1 2 3 4 5 6 7 8 EPAD Function Description Control input to the active bias circuit to set ICQ. Can be used as a power-down pin. VREF No connection. NC RF input. External DC block is required. RF IN No connection. NC No connection. NC RF OUT/VCC RF output, device collector. RF OUT/VCC RF output, device collector. Supply voltage for the active bias circuit. VBIAS DC and RF ground. Must be soldered to EVB ground plane over a bed of vias for thermal and RF performance. GND Package Drawing Dimensions in inches (millimeters) Branding Diagram DS130130 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 11 of 11