RF3394 RF3394General Purpose Amplifier GENERAL PURPOSE AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: QFN, 12-Pin, 3 x 3 20dB Small Signal Gain +32dBm Output IP3 +18dBm Output Power GND 9 NC Basestation Applications Broadband, Low-Noise Gain Blocks Driver Stage for Power Amplifiers Final PA for Low-Power Applications High Reliability Applications 8 RF OUT NC 3 Footprint Compatible with MicroX IF or RF Buffer Amplifiers 10 RF IN 2 11 NC 1 Applications 12 7 NC 4 5 6 GND GND Internally Matched Input and Output GND DC to >6000MHz Operation GND GND Features Functional Block Diagram Product Description The RF3394 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50Ω gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50Ω input and output impedances and requires only two external DCbiasing elements to operate as specified. The device is designed for cost effective high reliability in a plastic package. The 3mmx3mm footprint is compatible with standard ceramic and plastic Micro-X packages. Ordering Information RF3394 RF3394PCBA-41X 9GaAs HBT GaAs MESFET InGaP HBT General Purpose Amplifier Fully Assembled Evaluation Board Optimum Technology Matching® Applied SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. Rev A14 DS070226 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 1 of 12 RF3394 Absolute Maximum Ratings Parameter Input RF Power Rating Unit +13 dBm Operating Ambient Temperature -40 to +85 °C Storage Temperature -60 to +150 °C Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Parameter Min. Specification Typ. Max. Unit Overall Condition T=25 °C, ICC =65mA (See Note 1.) Frequency Range 3dB Bandwidth Gain DC to >6000 MHz 3 GHz 18.7 20.2 18.5 20.0 21.0 dB dB Freq=850MHz 17.0 18.7 22.0 dB Freq=2000MHz dB Freq=3000MHz 16.7 15.7 Freq=4000MHz 12.1 Freq=6000MHz Noise Figure 3.5 Input VSWR <1.8:1 Output VSWR dB +29.0 Freq=2000MHz In a 50Ω system, <500MHz <1.25:1 In a 50Ω system, 500MHz to 5000MHz <2.2:1 In a 50Ω system, 5000MHz to 6000MHz <2.0:1 In a 50Ω system, <500MHz <1.35:1 In a 50Ω system, 500MHz to 4000MHz <1.8:1 Output IP3 Freq=500MHz In a 50Ω system, 4000MHz to 6000MHz +32.0 dBm Freq=2000MHz Output P1dB +17.5 dBm Freq=2000MHz Reverse Isolation 22.0 dB Freq=2000MHz ThetaJC 147 °C/W Maximum Measured Junction Temperature at DC Bias Conditions 139 °C TAMB =+85°C Mean Time To Failure 3065 years TAMB =+85°C Thermal ICC =65mA, PDISS =274mW. (See Note 3.) Power Supply Device Operating Voltage Operating Current VPIN =4.2V With 22Ω bias resistor 4.4 4.5 4.6 V At pin 8 with ICC =65mA 5.5 5.9 6.5 V At evaluation board connectors, ICC =65mA 80 mA See Note 2. Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are not optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used. Note 2: The 3394 must be operated at or below 80mA in order to achieve the thermal performance listed above. While the RF3394 may be operated at higher bias currents, 65mA is the recommended bias to ensure the highest possible reliability and electrical performance. 2 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A14 DS070226 RF3394 Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 80mA over all intended operating conditions. Rev A14 DS070226 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 3 of 12 RF3394 Pin 1 2 Function NC RF IN 3 4 5 6 7 8 NC GND GND GND NC RF OUT Description Interface Schematic No internal connections. It is not necessary to ground this pin. RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. No internal connections. It is not necessary to ground this pin. RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to VCC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: ( V SUPPLY – V DEVICE ) R = ------------------------------------------------------I CC RF OUT RF IN Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. 9 10 11 12 Die Flag NC GND GND GND GND No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. Ground connection. To ensure best performance, avoid placing ground vias directly beneath the part. Package Drawing 0.05 C 2 PLCS 0.10 C A 3.00 -A- 2 PLCS 0.10 C B 3 0.90 0.85 0.20 REF. 0.05 0.00 1 3.00 12° MAX 0.10 C B 2 PLCS 0.10 C A 2 PLCS -B- 2.75 SQ -C- SEATING PLANE 0.10 M C A B 0.60 0.24 TYP 0.35 0.30 PIN 1 ID R0.20 1.90 1.60 0.45 0.35 Dimensions in mm. Shaded lead is pin 1. 4 of 12 0.375 0.275 1.15 0.85 0.65 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A14 DS070226 RF3394 Application Schematic VCC 10 nF 22 pF 47 nH 12 11 10 1 9 2 8 RBIAS 22 pF RF IN RF OUT 22 pF 3 7 4 5 6 Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) P1 P1-1 P1-3 1 VCC 2 GND 3 NC VCC P1-1 CON3 12 J1 RF IN 50 Ω μstrip C1 100 pF 11 10 1 9 2 8 3 7 4 5 R1 22 Ω C3 100 pF L1 100 nH C2 100 pF C4 1 μF 50 Ω μstrip J2 RF OUT 6 NOTE: Evaluation board optimized for frequencies above 300 MHz and below 2.5 GHz. For operation below 300 MHz the value of inductor L1 and capcitors C1 and C2 should be increased. Rev A14 DS070226 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 5 of 12 RF3394 Evaluation Board Layout Board Size 1.195" x 1.000" Board Thickness 0.033”, Board Material FR-4 Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Overlay of Suggested Micro-X and 3mmx3mm Layouts Showing Compatibility 6 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A14 DS070226 RF3394 Output P1dB versus Frequency Across Temperature (ICC=65mA) Gain versus Frequency Across Temperature (ICC = 65 mA) 20.0 -40°C 20.0 -40°C 25°C 25°C 19.0 85°C 85°C 18.0 Output Power (dBm) Gain (dB) 18.0 16.0 14.0 17.0 16.0 15.0 14.0 12.0 13.0 10.0 12.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 0.0 6000.0 500.0 Frequency (MHz) 1500.0 2000.0 2500.0 3000.0 4000.0 Noise Figure versus Frequency Across Temperature (ICC = 65 mA) 6.0 -40°C -40°C 34.0 25°C 5.5 25°C 85°C 85°C 5.0 Noise Figure (dB) 32.0 30.0 OIP3 (dBm) 3500.0 Frequency (MHz) Output IP3 versus Frequency Across Temperature (ICC=65mA) 36.0 1000.0 28.0 26.0 4.5 4.0 3.5 24.0 3.0 22.0 2.5 20.0 2.0 0.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0 3500.0 0.0 4000.0 500.0 Frequency (MHz) 1500.0 2000.0 2500.0 3000.0 Frequency (dB) Input VSWR versus Frequency Across Temperature Output VSWR versus Frequency Across Temperature (ICC = 65 mA) 2.8 1000.0 (ICC = 65 mA) 1.9 -40°C 25°C 2.6 1.8 2.4 1.7 2.2 1.6 2.0 1.5 VSWR VSWR 85°C 1.8 1.4 1.6 1.3 1.4 1.2 1.2 1.1 1.0 1.0 -40°C 25°C 85°C 0.0 1000.0 2000.0 3000.0 4000.0 Frequency (MHz) Rev A14 DS070226 5000.0 6000.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 Frequency (MHz) 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 7 of 12 RF3394 Reverse Isolation versus Frequency Across Temperature (ICC = 65 mA) 23.0 Current versus Voltage (At evaluation board connector, R BIAS = 22Ω) 90.0 80.0 22.0 60.0 ICC (mA) Reverse Isolation (dB) 70.0 21.0 20.0 50.0 40.0 19.0 30.0 -40°C -40°C 18.0 20.0 25°C +25°C +85°C 85°C 10.0 17.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 4.5 6000.0 5.0 5.5 Frequency (MHz) 6.0 6.5 V CC (V) Power Dissipated versus Voltage at Pin 8 Current versus Voltage (At Pin 8 of the RF3394) (TAMBIENT = +85°C) 0.40 80.0 0.35 70.0 0.30 Power Dissipated (W) ICC (mA) 60.0 50.0 40.0 0.25 0.20 0.15 30.0 0.10 -40°C +25°C 20.0 0.05 +85°C 10.0 0.00 4.0 4.1 4.2 4.3 4.4 4.5 4.6 VPIN (V) 4.00 4.10 4.20 4.30 4.40 4.50 4.60 VPIN (V) Junction Temperature versus Power Dissipated (TAMBIENT = +85°C) 165.00 Junction Temperature ( oC) 160.00 155.00 150.00 145.00 140.00 135.00 130.00 125.00 0.22 0.24 0.26 0.28 0.30 0.32 0.34 Power Dissipated (Watts) 8 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A14 DS070226 RF3394 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3μinch to 8μinch Gold over 180μinch Nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Mask Pattern A = 0.59 x 0.32 (mm) Typ. 0.80 (mm) Typ. 1.00 (mm) 0.40 (mm) Typ. 0.70 (mm) 1.00 (mm) Typ. Typ. Pin 1 3.20 (mm) Typ. 0.65 (mm) Typ. A A A A A A 2.20 (mm) Typ. 0.95 (mm) Typ. 0.30 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 1. PCB Metal Land Pattern (Top View) PCB Solder Mask Pattern Rev A14 DS070226 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 9 of 12 RF3394 Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.72 x 0.45 (mm) Typ. 0.72 (mm) Typ. 1.15 (mm) 0.41 (mm) Typ. 0.75 (mm) Typ. 1.05 (mm) Typ. Pin 1 3.32 (mm) Typ. 0.65 (mm) A A A A A A 2.27 (mm) Typ. Typ. 1.01 (mm) Typ. 0.45 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 2. PCB Solder Mask (Top View) Thermal Pad and Via Design The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. NOTE: A small amount of ground inductance is required to achieve data sheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. 10 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A14 DS070226 RF3394 RoHS* Banned Material Content RoHS Compliant: Yes Package total weight in grams (g): 0.023 Compliance Date Code: 0512 Bill of Materials Revision: A Pb Free Category: B i l l o f Ma te r i a l s e3 Pa r ts Pe r Mi l l i o n (PPM) Pb Cd Hg Cr V I PB B PB DE Di e 0 0 0 0 0 0 Mo l di ng Co mp o und 0 0 0 0 0 0 Le a d F r a me 0 0 0 0 0 0 Di e Atta ch Ep o x y 0 0 0 0 0 0 Wi r e 0 0 0 0 0 0 So l de r Pl a ti ng 0 0 0 0 0 0 Thi s R o HS b a nne d ma te r i a l co nte nt de cl a r a ti o n wa s p r e p a r e d so l e l y o n i nfo r ma ti o n, i ncl udi ng a na l y ti ca l da ta , p r o vi de d to R F MD b y i ts sup p l i e r s, a nd a pp l i e s to the B i l l o f Ma te r i a l s (B OM) r e vi si o n no te d * DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment Rev A14 DS070226 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 11 of 12 RF3394 12 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A14 DS070226