RFFM8204 2.4GHz TO 2.5GHz 802.11b/g/n WiFi FRONT END MODULE Package Style: QFN, 16-pin, 2.5mmx2.5mmx0.45mm ANT NC C_RX C_BT 16 15 14 13 12 NC PDET 1 Features POUT = 19dBm 11g OFDM 2.5% EVM POUT = 21dBm Meeting 11b Spec Mask Input and Output Matched to 50High Level of Integration Supports Wide Voltage Supply Range (3.0V to 4.8V) Low Height Package NC 11 BT 2 VCC 3 10 VCC VCC 4 9 5 TX Applications Cellular Handsets Mobile Devices Tablets Consumer Electronics Gaming Netbooks/Notebooks TV/Monitors/Video Smart Energy 6 PA_EN 7 8 NC RX NC Functional Block Diagram Product Description The RFFM8204 provides a complete integrated solution in a single Front End Module (FEM) for WiFi 802.11b/g/n and Bluetooth® systems. The ultrasmall form factor and integrated matching greatly reduces the number of external components and layout area in the customer application. This simplifies the total Front End solution by reducing the bill of materials, system footprint, and manufacturability cost. The RFFM8204 integrates a 2.4GHz Power Amplifier (PA), power detector coupler for improved accuracy, SP3T Switch, and some filtering for harmonic rejection. The device is provided in 2.5mm x 2.5mm x 0.45mm 16-pin QFN package. This module meets or exceeds the RF Front End needs of IEEE 802.11b/g/n WiFi RF systems. Ordering Information RFFM8204SB RFFM8204SQ RFFM8204SR RFFM8204TR7 RFFM8204PCK-410 Standard 5-piece sample bag Standard 25-piece sample bag Standard 100-piece reel Standard 2500-piece reel Fully assembled evaluation board with 5-piece bag Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MEMS LDMOS RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc. DS120625 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 1 of 8 RFFM8204 Absolute Maximum Ratings Parameter Rating DC Supply Voltage (No RF Applied) Unit 6 V 500 mA Operating Case Temperature -40 to +85 °C Storage Temperature -40 to +150 °C +10 dBm +5 dBm DC Supply Current Maximum TX Input Power Maximum RX Input Power Moisture Sensitivity Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. RFMD Green: RoHS compliant per EU Directive 2002/95/EC, halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder. MSL1 Parameter Min. Specification Typ. Max. Condition Unit 2.412 2.442 2.484 GHz -10 +25 +70 ºC Parameter Operating Frequency Operating Temperature Extended Operating Temperature -40 +25 +85 ºC Storage Temperature -40 +25 150 ºC Power Supply VCC 3.3 3.7 4.35 V Recommended operating voltage range 3 3.7 4.8 V Functional with derated performance 2.8 3.7 VCC V PA_EN, CR_X, C_BT 0 0.2 V Extended VCC Control Voltage-high Control Voltage-low Functional with derated performance T = -10ºC to +70ºC; VCC = 3.3V to 4.35V; PA_EN = high, CR_X = C_BT = low; 50% duty cycle; frequency = 2.412GHz to 2.484GHz, measured with a standard IEEE802.11g waveform unless otherwise noted. Transmit (TX-ANT) Dynamic EVM - Nominal 2.5 Dynamic EVM 2.5 Output power meeting Spectral Mask 21 % T = 25ºC, VCC = 3.3v, POUT = 19dBm 3 % POUT = 18dBm 22 dBm 3 TX Port Return Loss (S11) -10 -8 dB ANT Port Return Loss -12 -10 dB Nominal Gain 23 24 27 dB Gain 22 24 28 dB Gain Flatness - 20 MHz Channel -0.5 0.5 dB Gain Flatness - 40 MHz Channel dB -0.75 0.75 Gain Flatness - 100 MHz Band -1 1 Out of Band Rejection 4 7 11 Mbps CCK, +/- 11MHz offset from carrier 50Ω characteristic impedance T = 25ºC, VCC = 3.3v dB dBc 2110MHz to 2170MHz, T = 25ºC, VCC = 3.3v, frequency = 2.412GHz POUT = 18dBm Operating Current 185 210 mA Quiescent Current 135 160 mA PA_Enable Current 30 50 A Leakage Current 1 10 A Second Harmonic -23 -18 dBm/MHz 4.80GHz to 5.00GHz Third Harmonic -50 -41 dBm/MHz 7.20GHz to 7.50GHz 0.1 0.15 0.2 Power Detector Voltage 1.0 1.25 PDETECT Variation from 0-360 load pull -1.5 Power Detector Voltage 2 of 8 V 1.5 V 1.5 dB VCC = 4.8v, RF OFF POUT = 0dBm POUT = 22dBm 3:1 VSWR 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS120625 RFFM8204 Parameter Specification Typ. Max. Min. Condition Unit T = -10ºC to +70ºC; VCC = 3.3V to 4.35V; PA_EN = low, CR_X = high, C_BT = low; frequency = 2.412GHz to 2.484GHz, measured with a CW waveform unless otherwise noted. Receive (ANT-RX) Insertion Loss (S21) -0.6 -0.3 dB Rx Port Return Loss -1.1 -20 -15 dB ANT Port Return Loss -20 -15 dB Bluetooth TX/RX Input / Output Power 20 Insertion Loss -1.1 dBm -0.6 -0.3 dB BT Port Return Loss -20 -15 dB ANT Port Return Loss -20 -15 dB ANT-BT; TX Mode -20 -18 dB ANT-BT; RX Gain Mode -20 -18 dB ANT-RX; TX Mode -25 -20 dB ANT-RX; BT Mode -20 -18 dB Switch Control Current - High Each Line 5 60 A Switch Control Current - Low Each Line 0.5 10 A Switching Speed 100 150 nS ESD 1000 PA Turn On/Off Time 200 Isolation General Specifications V Maximum Input Power Ruggedness 500 nS +5 dBm 10:1 Output stable to within 90% of final gain Into 50Ω No damage Switch Control Logic Truth Table Operating Mode PA_EN C_RX C_BT Standby Low Low Low 802.11b/g/n TX High Low Low 802.11b/g/n Rx Mode Low High Low BT RX/TX Low Low High Note: PA_EN and TX switch control are tied together internally DS120625 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 3 of 8 RFFM8204 Pin 1 Function PDET 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pkg Base NC* VCC VCC TX PA_EN NC* RX NC* VCC BT NC* C_BT C_RX NC* ANT GND Description Power detector voltage for the TX path. May need external series R/shunt C to adjust voltage level and to filter RF noise. No Connect. This pin is not connected internally and can be left floating or connected to ground. Supply voltage for the output stage of the PA. See applications schematic for biasing and bypassing components. Supply voltage for the first stage of the PA. See applications schematic for biasing and bypassing components. RF input port for the 802.11b/g/n PA. Input is matched to 50. An external DC block is required. Bias voltage for the PA. This pin also controls the TX switch of the SP3T. See truth table for proper settings. No Connect. This pin is not connected internally and can be left floating or connected to ground. RF output port for the 802.11b/g/n RX path. An external DC block is required. No Connect. This pin is not connected internally and can be left floating or connected to ground. Supply voltage for the PA Regulator. See applications schematic for biasing and bypassing components. RF bidirectional port for Bluetooth®. Input is matched to 50. An external DC block is required. No Connect. This pin is not connected internally and can be left floating or connected to ground. Bluetooth® switch control pin. See truth table for proper level. Receive switch control pin. See switch truth table for proper level. No Connect. This pin is not connected internally and can be left floating or connected to ground. RF bidirectional antenna port matched to 50. An external DC block is required. Ground connection. The backside of the package should be connected to the ground plane through a short path, i.e., PCB vias under the device are recommended. * It is recommended to ground all NC pins. Pin Out GND 12 4 of 8 BT 11 VCC NC 10 9 C_BT 13 8 RX C_RX 14 7 GND GND 15 6 PA_EN ANT 16 5 TX 1 2 3 4 PDET NC VCC VCC 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS120625 RFFM8204 Detailed Functional Block Diagram ANT NC C_RX C_BT 16 15 14 13 12 NC PDET 1 NC DS120625 11 BT 2 VCC 3 10 VCC VCC 4 9 5 6 7 8 TX PA_EN NC RX NC 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 5 of 8 RFFM8204 Package Drawing 6 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS120625 RFFM8204 PCB Patterns A = 0.330 x 0.478 (mm) B = 0.478 x 0.330 (mm) C = 0.330 x 0.442 (mm) D = 0.442 x 0.330 (mm) E = 1.300 x 1.300 (mm) 2x 1.207 2x 0.750 2x 0.750 2x 0.250 2x 0.250 2x 0.250 6x 0.293 2x 1.189 PCB SOLDER MASK PATTERN PCB METAL PATTERN 2x 1.207 2x 0.750 2x 0.250 2x 1.207 2x 0.250 2x 1.207 2x 0.750 2x 0.250 2x 0.250 0.000 2x 0.750 2x 1.207 0.000 2x 1.189 2x 1.207 2x 1.207 2x 0.750 2x 0.250 2x 0.250 0.000 2x 0.750 2x 0.750 2x 0.750 2x 0.750 2x 1.207 2x 0.250 2x 0.250 6x 0.170 6x 0.270 0.000 0.000 2x 0.250 2x 1.207 2x 1.207 2x 1.189 2x 0.750 0.000 2x 1.189 2x 1.189 2x 1.189 2x 1.207 2x 1.189 6x 0.293 2x 0.750 2x 1.189 6x 0.170 2x 1.207 6x 0.270 A = 0.207 x 0.340 (mm) B = 0.340 x 0.207 (mm) C = 0.207 x 0.308 (mm) D = 0.308 x 0.207 (mm) E = 1.080 x 1.080 (mm) 2x 1.189 2x 1.189 2x 1.189 2x 1.189 A = 0.230 x 0.378 (mm) B = 0.378 x 0.230 (mm) C = 0.230 x 0.342 (mm) D = 0.342 x 0.230 (mm) E = 1.200 x 1.200 (mm) PCB STENCIL PATTERN Thermal vias for center slug "E" should be incorporated into the PCB design. The number and size of thermal vias will depend on the application, the power dissipation, and the electrical requirements. Example of the number and size of vias can be found on the RFMD evaluation board layout. Shaded are represents Pin 1 location. DS120625 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 7 of 8 RFFM8204 Application Schematic 8 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS120625