RFFM8204 - RFMD.com

RFFM8204
2.4GHz TO 2.5GHz 802.11b/g/n WiFi
FRONT END MODULE
Package Style: QFN, 16-pin, 2.5mmx2.5mmx0.45mm
ANT
NC
C_RX
C_BT
16
15
14
13
12 NC
PDET 1
Features





POUT = 19dBm 11g OFDM
2.5% EVM
POUT = 21dBm Meeting 11b
Spec Mask
Input and Output Matched to
50High Level of Integration
Supports Wide Voltage Supply Range (3.0V to 4.8V)
Low Height Package
NC
11 BT
2
VCC 3
10 VCC
VCC 4
9
5
TX
Applications








Cellular Handsets
Mobile Devices
Tablets
Consumer Electronics
Gaming
Netbooks/Notebooks
TV/Monitors/Video
Smart Energy
6
PA_EN
7
8
NC
RX
NC
Functional Block Diagram
Product Description
The RFFM8204 provides a complete integrated solution in a single Front
End Module (FEM) for WiFi 802.11b/g/n and Bluetooth® systems. The
ultrasmall form factor and integrated matching greatly reduces the number of external components and layout area in the customer application.
This simplifies the total Front End solution by reducing the bill of materials,
system footprint, and manufacturability cost. The RFFM8204 integrates a
2.4GHz Power Amplifier (PA), power detector coupler for improved accuracy, SP3T Switch, and some filtering for harmonic rejection. The device is
provided in 2.5mm x 2.5mm x 0.45mm 16-pin QFN package. This module
meets or exceeds the RF Front End needs of IEEE 802.11b/g/n WiFi RF
systems.
Ordering Information
RFFM8204SB
RFFM8204SQ
RFFM8204SR
RFFM8204TR7
RFFM8204PCK-410
Standard 5-piece sample bag
Standard 25-piece sample bag
Standard 100-piece reel
Standard 2500-piece reel
Fully assembled evaluation board with 5-piece bag
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT

SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.
DS120625
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 8
RFFM8204
Absolute Maximum Ratings
Parameter
Rating
DC Supply Voltage (No RF Applied)
Unit
6
V
500
mA
Operating Case Temperature
-40 to +85
°C
Storage Temperature
-40 to +150
°C
+10
dBm
+5
dBm
DC Supply Current
Maximum TX Input Power
Maximum RX Input Power
Moisture Sensitivity
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
RFMD Green: RoHS compliant per EU Directive 2002/95/EC, halogen free
per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric
materials and red phosphorus as a flame retardant, and <2% antimony in
solder.
MSL1
Parameter
Min.
Specification
Typ.
Max.
Condition
Unit
2.412
2.442
2.484
GHz
-10
+25
+70
ºC
Parameter
Operating Frequency
Operating Temperature
Extended Operating Temperature
-40
+25
+85
ºC
Storage Temperature
-40
+25
150
ºC
Power Supply VCC
3.3
3.7
4.35
V
Recommended operating voltage range
3
3.7
4.8
V
Functional with derated performance
2.8
3.7
VCC
V
PA_EN, CR_X, C_BT
0
0.2
V
Extended VCC
Control Voltage-high
Control Voltage-low
Functional with derated performance
T = -10ºC to +70ºC; VCC = 3.3V to 4.35V;
PA_EN = high, CR_X = C_BT = low; 50% duty cycle;
frequency = 2.412GHz to 2.484GHz, measured with
a standard IEEE802.11g waveform unless otherwise
noted.
Transmit (TX-ANT)
Dynamic EVM - Nominal
2.5
Dynamic EVM
2.5
Output power meeting Spectral Mask
21
%
T = 25ºC, VCC = 3.3v, POUT = 19dBm
3
%
POUT = 18dBm
22
dBm
3
TX Port Return Loss (S11)
-10
-8
dB
ANT Port Return Loss
-12
-10
dB
Nominal Gain
23
24
27
dB
Gain
22
24
28
dB
Gain Flatness - 20 MHz Channel
-0.5
0.5
dB
Gain Flatness - 40 MHz Channel
dB
-0.75
0.75
Gain Flatness - 100 MHz Band
-1
1
Out of Band Rejection
4
7
11 Mbps CCK, +/- 11MHz offset from carrier
50Ω characteristic impedance
T = 25ºC, VCC = 3.3v
dB
dBc
2110MHz to 2170MHz, T = 25ºC, VCC = 3.3v,
frequency = 2.412GHz
POUT = 18dBm
Operating Current
185
210
mA
Quiescent Current
135
160
mA
PA_Enable Current
30
50
A
Leakage Current
1
10
A
Second Harmonic
-23
-18
dBm/MHz 4.80GHz to 5.00GHz
Third Harmonic
-50
-41
dBm/MHz 7.20GHz to 7.50GHz
0.1
0.15
0.2
Power Detector Voltage
1.0
1.25
PDETECT Variation from 0-360 load pull
-1.5
Power Detector Voltage
2 of 8
V
1.5
V
1.5
dB
VCC = 4.8v, RF OFF
POUT = 0dBm
POUT = 22dBm
3:1 VSWR
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120625
RFFM8204
Parameter
Specification
Typ.
Max.
Min.
Condition
Unit
T = -10ºC to +70ºC; VCC = 3.3V to 4.35V;
PA_EN = low, CR_X = high, C_BT = low;
frequency = 2.412GHz to 2.484GHz, measured with
a CW waveform unless otherwise noted.
Receive (ANT-RX)
Insertion Loss (S21)
-0.6
-0.3
dB
Rx Port Return Loss
-1.1
-20
-15
dB
ANT Port Return Loss
-20
-15
dB
Bluetooth TX/RX
Input / Output Power
20
Insertion Loss
-1.1
dBm
-0.6
-0.3
dB
BT Port Return Loss
-20
-15
dB
ANT Port Return Loss
-20
-15
dB
ANT-BT; TX Mode
-20
-18
dB
ANT-BT; RX Gain Mode
-20
-18
dB
ANT-RX; TX Mode
-25
-20
dB
ANT-RX; BT Mode
-20
-18
dB
Switch Control Current - High Each Line
5
60
A
Switch Control Current - Low Each Line
0.5
10
A
Switching Speed
100
150
nS
ESD
1000
PA Turn On/Off Time
200
Isolation
General Specifications
V
Maximum Input Power
Ruggedness
500
nS
+5
dBm
10:1
Output stable to within 90% of final gain
Into 50Ω
No damage
Switch Control Logic Truth Table
Operating Mode
PA_EN
C_RX
C_BT
Standby
Low
Low
Low
802.11b/g/n TX
High
Low
Low
802.11b/g/n Rx Mode
Low
High
Low
BT RX/TX
Low
Low
High
Note: PA_EN and TX switch control are tied together internally
DS120625
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
3 of 8
RFFM8204
Pin
1
Function
PDET
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pkg
Base
NC*
VCC
VCC
TX
PA_EN
NC*
RX
NC*
VCC
BT
NC*
C_BT
C_RX
NC*
ANT
GND
Description
Power detector voltage for the TX path. May need external series R/shunt C to adjust voltage level and to filter RF
noise.
No Connect. This pin is not connected internally and can be left floating or connected to ground.
Supply voltage for the output stage of the PA. See applications schematic for biasing and bypassing components.
Supply voltage for the first stage of the PA. See applications schematic for biasing and bypassing components.
RF input port for the 802.11b/g/n PA. Input is matched to 50. An external DC block is required.
Bias voltage for the PA. This pin also controls the TX switch of the SP3T. See truth table for proper settings.
No Connect. This pin is not connected internally and can be left floating or connected to ground.
RF output port for the 802.11b/g/n RX path. An external DC block is required.
No Connect. This pin is not connected internally and can be left floating or connected to ground.
Supply voltage for the PA Regulator. See applications schematic for biasing and bypassing components.
RF bidirectional port for Bluetooth®. Input is matched to 50. An external DC block is required.
No Connect. This pin is not connected internally and can be left floating or connected to ground.
Bluetooth® switch control pin. See truth table for proper level.
Receive switch control pin. See switch truth table for proper level.
No Connect. This pin is not connected internally and can be left floating or connected to ground.
RF bidirectional antenna port matched to 50. An external DC block is required.
Ground connection. The backside of the package should be connected to the ground plane through a short path,
i.e., PCB vias under the device are recommended.
* It is recommended to ground all NC pins.
Pin Out
GND
12
4 of 8
BT
11
VCC
NC
10
9
C_BT 13
8 RX
C_RX 14
7 GND
GND 15
6 PA_EN
ANT 16
5 TX
1
2
3
4
PDET
NC
VCC
VCC
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120625
RFFM8204
Detailed Functional Block Diagram
ANT
NC
C_RX
C_BT
16
15
14
13
12 NC
PDET 1
NC
DS120625
11 BT
2
VCC 3
10 VCC
VCC 4
9
5
6
7
8
TX
PA_EN
NC
RX
NC
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 8
RFFM8204
Package Drawing
6 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120625
RFFM8204
PCB Patterns
A = 0.330 x 0.478 (mm)
B = 0.478 x 0.330 (mm)
C = 0.330 x 0.442 (mm)
D = 0.442 x 0.330 (mm)
E = 1.300 x 1.300 (mm)
2x 1.207
2x 0.750
2x 0.750
2x 0.250
2x 0.250
2x 0.250
6x 0.293
2x 1.189
PCB SOLDER MASK PATTERN
PCB METAL PATTERN
2x 1.207
2x 0.750
2x 0.250
2x 1.207
2x 0.250
2x 1.207
2x 0.750
2x 0.250
2x 0.250
0.000
2x 0.750
2x 1.207
0.000
2x 1.189
2x 1.207
2x 1.207
2x 0.750
2x 0.250
2x 0.250
0.000
2x 0.750
2x 0.750
2x 0.750
2x 0.750
2x 1.207
2x 0.250
2x 0.250
6x 0.170
6x 0.270
0.000
0.000
2x 0.250
2x 1.207
2x 1.207
2x 1.189
2x 0.750
0.000
2x 1.189
2x 1.189
2x 1.189
2x 1.207
2x 1.189
6x
0.293
2x 0.750
2x 1.189
6x
0.170
2x 1.207
6x
0.270
A = 0.207 x 0.340 (mm)
B = 0.340 x 0.207 (mm)
C = 0.207 x 0.308 (mm)
D = 0.308 x 0.207 (mm)
E = 1.080 x 1.080 (mm)
2x 1.189
2x 1.189
2x 1.189
2x 1.189
A = 0.230 x 0.378 (mm)
B = 0.378 x 0.230 (mm)
C = 0.230 x 0.342 (mm)
D = 0.342 x 0.230 (mm)
E = 1.200 x 1.200 (mm)
PCB STENCIL PATTERN
Thermal vias for center slug "E" should be incorporated into the PCB design. The number and size of thermal vias will
depend on the application, the power dissipation, and the electrical requirements. Example of the number and size of
vias can be found on the RFMD evaluation board layout.
Shaded are represents Pin 1 location.
DS120625
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
7 of 8
RFFM8204
Application Schematic
8 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120625