规格书编号 SPEC NO : 产品 规 格书 SPECIFICATION CUSTOMER 客 户： PRODUCT 产 品： SAW RESONATOR MODEL NO 型 号： HDR360M S20 PREPARED 编 制： CHECKED 审 核： APPROVED 批 准： D A T E 日 期： 2011-5-5 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 1 of 6 SAW RESONATOR HDR360M S20 更改历史记录 History Record 更改日期 Date www.shoulder.cn 规格书编号 Spec. No. 产品型号 Part No. 客户产品型号 Customer No. Tel:0755-82916880 Fax:0755-82916881 更改内容描述 Modify Content E-mail:[email protected] 备注 Remark Page 2 of 6 SAW RESONATOR HDR360M S20 1. SCOPE This specification is applied to a SAW resonator designed for the stabilization of transmitters such as garage door openers and security transmitters. 2. ELECTRICAL SPECIFICATION DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature RF Power Dissipation 30V 10V50Hz/60Hz -40℃ to +85℃ -45℃ to +85℃ 0dBm Electronic Characteristics Item Center Frequency Insertion Loss (in 50ohm system) Quality Factor Unites Minimum Typical Maximum MHz 359.925 360.000 360.075 dB 1.5 2.2 Sym fc IL Unloaded Q 8000 13900 QU 50Ω LoadedQ 1000 2000 QL 10 25 Temperature Turnover Temperature Stability Turnover Frequency Frequency Temperature Coefficient Frequency Aging Absolute Value during the First year DC Insulation Resistance between any two Pins Motional Resistance ℃ MHz fc ppm/℃2 Motinal Inductance µH RLC Model Motinal Capacitance fF Pin 1to pin2 Static Capacitance pF Transducer Static Capacitance pF FTC ≤10 |fA| 1.0 Ω RF Equivalent To fo 0.037 ppm /yr MΩ 40 19 26 125.72 Lm 1.2914 1.5 2.0 1.7 Rm Cm 2.5 Co Cp 3. TEST CIRCUIT www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 3 of 6 SAW RESONATOR HDR360M S20 4. DIMENSION 4-1 Typical dimension(unit: mm) www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 4 of 6 SAW RESONATOR HDR360M S20 4-2 Typical circuit board land patter 5. ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85℃ for 16 hours. Then release the resonator into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5-2 Low temperature exposure Subject the device to -20℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5-3 Temperature cycling Subject the device to a low temperature of -40℃for 30 minutes. Following by a high temperature of +80℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in table 1. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in table 1. 5-5 Solderability Subject the device terminals into the solder bath at 245℃±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in table 1. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1. 5-7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1. 5-8 Lead fatigue www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 5 of 6 SAW RESONATOR HDR360M S20 5-8-1 Pulling test Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the initial Characteristics. 5-8-2 Bending test Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction of thickness. This operation shall be done toward both directions. The device shall show no evidence of damage and shall satisfy all the initial electrical characteristics. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. 7.TYPCIAL APPLICATION CIRCUITS www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 6 of 6