产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDBF07014A24 SMD-24
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2008-12-18
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子股份有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 7
SAW FILTER
HDBF07014A24
SMD-24
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Page 2 of 7
SAW FILTER
HDBF07014A24
SMD-24
1. SCOPE
This specification shall cover the characteristics of SAW filter HDBF07014A24
2. ELECTRICAL SPECIFICATION
Max Incident Power in Passband
Max voltage between any 2 terminals
Storage Temperature Range
Operating Temperature Range
10 dBm
30 VDC
-40 to +85 ℃
-40 to +85 ℃
Electronic Characteristics
Parameter
Center Frequency
Insertion Loss
-1dB Bandwidth
-3dB Bandwidth
-40dB Bandwidth
Amplitude Ripple(F0 +/- 6.1MHz)
Group Delay Ripple(F0 +/- 6.1MHz)
Absolute Delay
Stopband Rejection
0.1~55.0MHz
55.0~60.35MHz
63.0~77.0MHz
79.65~85.0MHz
85.0~110.0MHz
Input/Output Impedance
Material Temperature coefficient
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Min
69.85
13.3
14.2
50
40
40
50
Typ
70
12
14.2
14.9
18.2
0.5
30
1.09
55
50
1.0
45
55
50
-86
E-mail:[email protected]
Max
70.15
12.7
19.8
1
100
3.0
Units
MHz
dB
MHz
MHz
MHz
dB
ns
us
dB
dB
dB
dB
dB
ohm
ppm/℃
Page 3 of 7
SAW FILTER
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
HDBF07014A24
E-mail:[email protected]
SMD-24
Page 4 of 7
SAW FILTER
HDBF07014A24
SMD-24
3. DIMENSION
Dimension
A
B
C
D
E
H
P
min
13.1
6.3
1.21
0.72
mm
typ
13.3
6.5
1.36
1.5
0.8
0.76
2.54
max
13.5
6.7
1.51
0.80
Pin Configuration
11
Input
5
Output
Other
Ground
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Page 5 of 7
SAW FILTER
HDBF07014A24
SMD-24
4.TEST CIRCUIT
L1=100nH, L2=120nH, C1=100pF, C2=43pF
* Component values may vary due to actual PCB layout and parasitics.
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-2 Low temperature exposure
Subject the device to -20℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +80℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in table 1.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in table 1.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
table 1.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in table 1.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
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Page 6 of 7
SAW FILTER
HDBF07014A24
SMD-24
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1.
5-8 Lead fatigue
5-8-1 Pulling test
Weight along with the direction of lead without an shock 1kg. The device shall satisfy all
the initial Characteristics.
5-8-2 Bending test
Lead shall be subject to withstand against 90℃ bending with 450g weight in the
direction of thickness. This operation shall be done toward both direction. The
device shall show no evidence of damage and shall satisfy all the initial electrical
characteristics.
6. REMARK
7.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
7.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
7.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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Page 7 of 7