CRYSTAL RESONATOR Data Sheet

SHOULDER ELECTRONICS LIMITED
CRYSTAL RESONATOR Data Sheet
PRODUCT 产 品:
CRYSTAL RESONATOR
MODEL NO 型 号:
ZM206
PREPARED 编 制:
Fengyu
CHECKED 审 核:
York
APPROVED 批 准:
Lijiating
DATE
2008-01-25
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日 期:
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1. Feature
z
z
z
RoHS Compliant(Lead Free)
High precision characteristic covering up to high frequency range
Higher frequency stability and reliability
2. SPECIFICATION
FREQUENCY RANGE
30.000-200.000KHz
LOAD CAPACITANCE
12.5PF
FREQUENCY TOLERANCE AT 25℃
±20 /±30 /±50 PPM
25±5℃
TURNOVER TEMPERATURE
[-0.035±0.01] ppm /℃
TEMPERATURE COEFFICIENT
OPERATING TEMPERATURE RANGE
–10 TO +60℃
STORAGE TEMPERATURE RANGE
–40 TO +85℃
EQUIVALENT SERIES RESISTANCE (ESR) 25℃
DRIVE LEVEL
1.0µW MAXIMUM
MOTIONAL CAPACITANCE
0.0035pF TYPICAL
SHUNT CAPACITANCE
CAPACITANCE
40KΩ MAX
RATIO
AGING [first year]
1.75pF TYPICAL
CO/C1
500 TYPICAL
AT 25℃ ±3℃
–/+5PPM MAXIMUM
QUALITY FACTOR(DEPEND ON FREQUENCY)
INSULATION RESISTANCE
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(DC100V±15V)
60000 TYPICAL
500 MOhm MINIMUM
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3. DIMENSIONS
4. FREQUENCY VS. TEMPERATURE CURVE
5. MECHANICAL AND ENVIRONMENTAL SPECIFICATION
1)
Vibration
Conditions :
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Vibration Frequency
10 to 55Hz
Vibration Amplitude
1.5mm
Cycle Time 1-2min (10-55-10Hz)
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Direction
X.Y.Z
Duration 2h/each direction
Results: Frequency Change: ±10ppm Max.
Resistance Change: ±15% or 5kohm Max.
2) Shock
Conditions: 3 Times free drop from 75cm height to hard wooden board of
thickness more than 30mm
Results: Frequency Change: ±10ppm Max.
Resistance Change: ±15% or 5kohm Max.
3) Leakage
Conditions: Put crystal units into a hermetic container and Helium for
0.5-0.6Mpa, and keep it for 1h; Check the leakage by a Helium
leak detector
Results: Leakage: 1x10¯8mbar.l/s Max.
4) Solderability
Conditions: Put the leads of crystal units into solder melted tank for 3 to 5s
Temperature of solder melted tank is 245℃±5℃
Results:
5)
Reflow soldering
Temperature cycling test
Conditions: Next Fig.1 for TF38 families.
Results:
6)
The dipped surface of the leads should be at least 95% covered
with continuous new solder coating
Resistance Change:±25% or 10kohm Max.
Lead Strength (DIP)
Conditions: The crystal lead with the 0.9kg(9N)power(keep it for 30s±5s)
and bend the crystal lead 90° with 0.45kg power and two
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Results:
7)
times (which you want to bend should be more than 1.5mm
from the case)
The crystal lead is not abnormity
High Temperature Endurance
Conditions:
The crystal units shall be put in somewhere for 2 hours at
temperature of 85℃±2℃,then keep it for 1 to 2 hours under
room temperature
Results:
Frequency Change: ±10ppm Max.
Resistance Change: ±15% or 5kohm Max.
8)
Low Temperature Endurance
Conditions: The crystal units shall be put in somewhere for 2 hours at
temperature of -25℃,then keep it for 1 to 2 hours under room
temperature
Results:
Frequency Change: ±10ppm Max.
Resistance Change: ±15% or 5kohm Max.
9) Low Temperature Endurance
Conditions: somewhere at 40℃ in relative humidity of 90-95% for 48
hours, then keep it for one or two hours under room
temperature
Results:
Frequency Change: ±10ppm Max.
Resistance Change: ±15% or 5kohm Max.
10) Temperature Cycle
Conditions: Temperature shift from low(-40℃) to high(100℃,keep 30
minutes),satisfy high(100 ℃ ) to low(-40 ℃ ,keep 30
minutes),then go up to room temperature for 5 cycles
Results: Frequency Change: ±10ppm Max.
Resistance Change: ±15% or 5kohm Max.
11)
Salt Spray Test
Conditions: Put the crystal units in the salt spray room(salt density:5%)at the
temperature of 35℃ for 96 hours. Then clean it with water and
dry its surface.
Results: The appearance shall has no abnormity and soldering is good.
Frequency Change: ±10ppm Max.
Resistance Change: ±10% or 5kohm Max.
6. PACKAGE
1000pcs/box (335*335*30)
10000pcs/big box (338*338*300)
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7. PROCESSING INSTRUCTIONS
The following instructions and information are provided for the purpose of having the
user understand the proper way to process our crystal products to prevent problems
prior to use and enhance the reliability of the equipment to which they are applied.
1) When dropped by mistake
The crystal units are designed and manufactured to resist physical shocks. However,
when the crystal units are subjected to excessive impact such as being dropped onto
the floor or giving shocks during processing, need to make sure its satisfactory
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performance before using it.
2) Soldering
Lead wires should be soldered within 3 seconds with the soldering iron heated to a
temperature no higher than 300℃
In solder-dip processing, the leads should be soldered within 10 seconds with a
temperature no higher than 260℃.Mounting in upright is recommendable to prevent
the heat conduction directly to the body of the crystal unit.
3) TO BEND THE LEAD of cylinder type products
When the lead of cylinder type crystal units need to be bent, leave more than
1.5mm(3.0mm is recommendable) of lead from the case in order to prevent from any
cracks of the hermetic sealing glass at the root of the lead, and use a jig to bend if
possible.
When bending the lead of cylinder type crystal units, do not scrape off the
soldering plating from the lead surface.
4) Mounting :
A: “Mounting” of cylinder type products
Soldering the body of the cylinder type crystal units with PCB must be avoided due
to deteriorate the characteristics or damage the products. Rubber adhesive is
recommended
B: When the lead needs to be bent by hand, please follow the instruction as
below:
Hold the body of the cylinder type crystal unit in fingers; Pick at the part with
tweezer, which you want to bend. There should be more than 1.5mm(3.0mm is
recommended) from the body case; Bend the lead 90° by tweezer without pulling the
lead strongly .If pulling the lead strongly may cause any cracks of hermetic sealing
glass at the root of the lead and may cause the leakage and the characteristics to
deteriorate.
5) Cleaning
Crystal units may be sffected and destroyed at worst by supersonic cleaning or
supersonic welding. Please be sure to check if your cleaning and welding process
sffects any damage to crystal units before using.
Some kinds of cleaning fluid may cause any damage to crystal units. Please be
sure to check suitability of the cleaning fluid in advance.
6) Storage
Storage of crystal units under higher temperature or high humidity for a long term
may affects frequency stability or solderability. Please store the crystal units under the
normal temperature and humidity without exposing to direct sunlight and dew
condensation , and avoid the storage of crystal units for more than 6 months, and
mount them as soon as possible after unpacking.
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